1. SFB CSEM 4’’

2. PROCESS FLOW

3. #1 avant recuit

4. #1 apres recuit

5. #2 RT manuel avant recuit

6. #2 RT manuel apres recuit

7. #3 RT manuel avant recuit

8. #3 RT manuel après recuit

9. #4 avant recuit

10. #4 apres recuit

11. TEST SET-UP – NEW connector O-ring

12. #3 (#3????) 27 35 57 68 163 181 509 345 15279 396 487 1000 750 500 200

13. #1 (#4???) 1000 750 500 200 69 443 650 232 200 507 563 290 167 188

14. #4 (#2???) 1000 750 500 200 137 233 267 524 144 95 343 464 323 171 181

15. #2 (#1???) 1000 750 500 200 304 323 282 288 493 284

17. RESULTS Hold 700bar  not broken wafer1Wafer2 Wafer3 Wafer4 top middle bottom top middle bottom top middle bottom top middle bottom

18. Z11 - DP650RT___Ti-Ni-Au_unif 200-350-100 nm 488-972-81 s METALIZATION Frame4, frame3, ATLAS devices metalized with mask! Soldering test: 4 times ok! No clean Si surface!