1. Pressure Tests Results 13/03/2013Collaboration meeting CERN - CSEM1

2. Summary of Wafers…. 13/03/2013Collaboration meeting CERN - CSEM2 Micro-fabrication process at CSEM. 5 wafers produced from a 380 µm Si wafer etched with 190 µm deep channels and closed by Si-Si bonding with a cover wafer. -Wafer # 3 -> (through holes) -Wafer # 5 -Wafer # 7 -Wafer # 8 -Wafer # 9 186 µm 194 µm th -dicing and grinding of the cover wafer to the wanted thickness (th) -testing at CERN Bonding details  see CSEM

3. Structures on Each Wafer: 13/03/2013Collaboration meeting CERN - CSEM3 B (µm) 50 100 200 500 PRESSURE TEST STRUCTURES ATLAS FRAME 4 - NA62 D = 210 µm 5.4 mm 50 µm 2.85 mm B 21 mm 13 mm 45 mm 19 mm CSEM 83.8 mm 10 mm CSEM In each wafer there are: -2 samples ATLAS -2 samples FRAME 4 – NA62 -8 structures «pressure test» (4 different channel dimensions) Done for CO 2 circulation, with restrictions and pillars

4. Testing Procedure: 13/03/2013Collaboration meeting CERN - CSEM4 ATLAS CSEM FRAME 4 - NA62 CSEM -Gluing a piece of silicon for the ATLAS and FRAME4 samples on the inlet hole to test the outlet manifold (weakest point) -Manual water pump used to apply the pressure -Clamp connector to hold the samples -DAQ system in Labview to save data -Eye alignment of the hole and the connector

5. Tested Samples: 13/03/2013Collaboration meeting CERN - CSEM5 -‘## bar’ = good explosion of the channel -‘## bar (broken)’ = sample broken in many pieces once reached the ## pressure -‘(broken)’ = sample broken before testing -‘ > ## bar ‘ = reached a pressure of ## bar without failure  samples still available -‘fluidic test’ = samples avalaible for testing  on going...

6. Pictures: 13/03/2013Collaboration meeting CERN - CSEM6 Wafer # 9: debonding area (channel of 50, 65 bar) Wafer # 3: explosion of outlet manifold (FRAME4, 100 µm, 123 bar) Wafer # 8: explosion of outlet manifold (ATLAS, 100 µm, 66 bar) Wafer # 7: explosion of channel (channel of 200, 175 bar)

7. Test with 2mm Pyrex 13/03/2013Collaboration meeting CERN - CSEM7 2 mm 70 µm th A (µm)B (µm) 2050 100 50200 50500 Pressure test structures with 70 µm channels etched in a Silicon wafer anodically bonded to a 2 mm Pyrex. The silicon has been then grinded to different thickness (th). D = 200 µm 5 mm A B 20 mm 10 mm Samples produced by CERN at CMi

8. Test with Pyrex 2 mm, Results 13/03/2013Collaboration meeting CERN - CSEM8

9. Test with Si-Si Samples with Channels 13/03/2013Collaboration meeting CERN - CSEM9 Very big outlet manifold (large unbonded area) Narrow manifold No manifold, just channels Long restrictions at the inlet 200 µm wide channels P1P2 P3 P4 165 µm 70 µm 165 µm Samples production outsourced

10. Test with Si-Si Samples, Results 13/03/2013Collaboration meeting CERN - CSEM10 P1_516 P1_116 P3_144 Hydrophobic bonding!! P3_214 P2_515 Hydrophilic bonding  unbonded areas!

11. Future tests 13/03/2013Collaboration meeting CERN - CSEM11 -More pressure test with 2 mm Pyrex -Fluidic test on-going -SEM images and measures of the real thickness of samples -Numerical simulations with COMSOL on-going -…