Environmental Issues Update Committee Chairman Council Environmental Issues Update February 2004

Manufacturing Issues Toxic Release Inventory Reporting  IPC still seeking burden reduction  EPA White Paper  Proposal January 2005?  TRI Reporting on Lead  Science Review expected completion Summer 2004? 2005?  1,252 Form Rs were filed by electronics companies  70% reported less than one pound of lead released

Manufacturing Issues RCRA (Waste Management)  Definition of Solid Waste (includes hazardous waste)  Proposed Limited Exclusions for Recycling  IPC Urging Broader Rule  Final rule, Spring 2005  F006 Sludge Rule  Proposal August 2004?

Product Issues Increasing Regulations WEEE/RoHS type restrictions  California  China  Massachusetts ?  Wisconsin ? Brominated Flame Retardants  CA  Maine

Materials Declaration Handbook Supply Chain communication of materials of concern Increasingly demanded by OEMs Chaired by John Sharp, Teradyne Connection Systems Final Draft

Lead Free Solder LCA IPC and EIA partnering with the US EPA Project Goals  Evaluate the relative environmental impacts of Sn/Pb solder and Pb-free solders  Evaluate the effects of lead-free solders on recycling and reclamation at EOL  Assess the leachability of Pb-free solders and their potential environmental effects Overview presentation: 11 am Tuesday Draft report will be posted for public review at Final Report Spring 2004

Solders Selected for Evaluation Reflow Application Solders Sn/Pb (63 Sn/ 37 Pb) Sn/Ag/Cu (95.5 Sn/3.9 Ag/0.6 Cu) Sn/Ag/Bi (42 Sn/1.0 Ag/57 Bi) SnAg/Cu/Bi (96 Sn/2.5 Ag/0.5 Cu/1.0 Bi) Wave Application Solders Sn/Pb (63 Sn/ 37 Pb) Sn/Cu (99.2 Sn/ 0.8 Cu) Sn/Ag/Cu (95.5 Sn/3.9 Ag/0.6 Cu) (Not in Presentation)

LCIA Results These results are currently undergoing final review Impact categorySnPbSnAbCuSnAgBiSnAgBiCu Nonrenewable resource use Lowest Highest Renewable resource use Highest Lowest Energy use Highest Lowest Landfill space Lowest Highest Global warming Highest Lowest Ozone depletion Highest Lowest Photochemical smog Lowest Highest Acidification Lowest Highest Particulate matter Lowest Highest Eutrophication Highest Lowest Water quality Highest Lowest Public chronic non-cancer Highest Lowest Public cancer Highest Lowest Occupational chronic non-cancer Highest Lowest Occupational cancer Highest Lowest Aquatic toxicity Highest Lowest :

What Study Does Not Address (partial limitations to scope) Excludes performance and economic considerations Assumes releases = exposure EOL Issues  Bismuth solders present both a technological and economical problem to recycling (did address in BSA model)  Strict definition of lead-free (0.1%) may prevent recycling  Equipment life?

Product Issues Lead-Free Labeling Various lead-free labeling being used Need a global lead-free labeling standard IPC blue ribbon committee Labels for bare boards and assemblies  Working with JEDEC on joint-standard for component labeling  Draft proposal to be finalized this week

Product Issues Lead-Free Labeling Indicate Lead Free Solder family Tin-lead boards and components have no assigned label (default) Optional additional board markings  Halide-free base resin  Conformal coating used after assembly