Tom McMullen Week 5 4/3/2013 – 8/3/2013

LETI wafer thinning project flow Phase 1 IDProject NameOwnerDaysStartEnd 3-Feb10-Feb17-Feb24-Feb3-Mar10-Mar17-Mar24-Mar31-Mar5-Apr12-Apr19-Apr26-Apr 1.0Thin Wafer AssembliesT. McMullen01-Feb30-Sep Week 1Week 2Week 3Week 4Week 5Week 6Week 7Week 8Week PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to AdvacamLETI - 3D101-Feb29-Mar LETI accpets CERN proposal 1.1.1Send gds to LETIT. McMullen51-Feb8-Feb Send 2 FEI4b wafers to LETIR. Bates51-Feb6-Feb Confirm step size on wafer and centre ofset variation on waferLETI51-Feb6-Feb Layout and mask productionLETI101-Feb11-Feb Deliverable 1: Microbumb gds files First 2 wafers with micro bumps delivered to AdvacamLETI4912-Feb2-Apr Deliverable 2: First 2 wafers with micro bumps delivered to Advacam Current Deliverable Target not met

Action List Phase 1 and 2 ActionWhatWhoWhenComment 6Further funding for flip-chip processRbates\Cbuttar31/3/2013Richard has confirmed this is all in place 7Bow measurement set-upTMcM31/2/2013visit SMC and set up program for bow measurement 8Sensors for flip chippingAll31/3/2013Sensor availablilty for flip-chip process - Meeting rqd 9Assembly probe test solutionTMcM19/3/2013Pobe test solution for flip-chipped assemblies - yield maps 10FEI4B probe card and probe set-upRbates/TMcM19/3/2013FEI4B test solution for assembly testing yeild maps 11Experience with FEI4A probe card set-upRbates/TMcM19/3/2013 FEI4A probe card set-up and testing of assemblies on Wentworth

Highlights and issues  Cash for flip-chip bonding We will need this further funding by the end of phase 1 (week 9 from Gant on previous slide) to test the LETI micro-bumps Richard has confirmed that this is OK  Bump gds design completed and mask delivery due end of next week LETI are confident they will have delivered wafers to ADVACAM by deliverable date.  Meeting required to discuss sensor availability for the flip-chip process Amount of sensors for flip-chipping – good statistical analysis required for micro-bump yield – Richard and I have begun discussions on this. IBL TDR bump spec: ○ Pitch = 50um ○ Bump density = 26,880 per ROIC ○ Defect rate < ○ ROIC thickness <200um FEI4b Assembly testing ○ FEI4b probe card required ○ Test equipment/apparatus required ○ Semi-auto testing solution required for assemblies

Wafer Inventory Wafer #Wafer IDYieldPurposeComment 1VMB8WDHG= 34, y=17, R=8, B=1Full thickness micro-bump testDelivered to LETI. High-yielding die. Micro-bump yeild testing on assemblies 2V6B8WUHG= 43, y=13, R=4, B=0Full thickness micro-bump testDelivered to LETI. High-yielding die. Micro-bump yeild testing on assemblies 3VUAYCRH First technology run. Run 2 Received at Glasgow Wafer thinning to 100microns. Used for thermal cycling bow measurements at SMC. Ship to LETI 4ABPJXGH First technology run. Run 2 Received at Glasgow Wafer thinning to 100microns. Used for thermal cycling bow measurements at SMC. Ship to LETI 5 Second technology run. Run 3Wafer to be identified and delivered to glasgow 6 Second technology run. Run 3Wafer to be identified and delivered to glasgow 7 Third technology run. Run 4Wafer to be identified and delivered to glasgow 8 Third technology run. Run 4Wafer to be identified and delivered to glasgow 9 Forth technology run. Run 5Wafer to be identified and delivered to glasgow 10 Forth technology run. Run 5Wafer to be identified and delivered to glasgow

LETI wafer thinning project flow Phase 2