1. Tom McMullen Week 3 25/2/2013 – 1/3/2013

2. LETI wafer thinning project flow Phase 1 IDProject NameOwnerDaysStartEnd 3-Feb10-Feb17-Feb24-Feb3-Mar10-Mar17-Mar24-Mar31-Mar5-Apr12-Apr19-Apr26-Apr 1.0Thin Wafer AssembliesT. McMullen01-Feb30-Sep Week 1Week 2Week 3Week 4Week 5Week 6Week 7Week 8Week 9 1.1 PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to AdvacamLETI - 3D101-Feb29-Mar LETI accpets CERN proposal 1.1.1Send gds to LETIT. McMullen51-Feb8-Feb 1.1.2 Send 2 FEI4b wafers to LETIR. Bates51-Feb6-Feb 1.1.3 Confirm step size on wafer and centre ofset variation on waferLETI51-Feb6-Feb 1.1.4 Layout and mask productionLETI101-Feb11-Feb Deliverable 1: Microbumb gds files 1.1.4 First 2 wafers with micro bumps delivered to AdvacamLETI4912-Feb2-Apr Deliverable 2: First 2 wafers with micro bumps delivered to Advacam Current Deliverable Target not met

3. Action List Phase 1 and 2 ActionWhatWhoWhenComment 4Top metal align key informationTMcM22/5/2003Alignment key config taken from FEI4 CAD – now with LETI 5CERN purcahsing info for STFCTMcM14/2/2013Confirmed to be ok by Richard 6Further funding for flip-chip processRbates\Cbuttar31/3/2013 Richard awaiting information back from Hienze regarding this 7Bow measurement set-upTMcM31/2/2013visit SMC and set up program for bow measurement 8Sensors for flip chippingAll31/3/2013Sensor availablilty for flip-chip process - Meeting rqd 9Assembly probe test solutionTMcM19/3/2013Pobe test solution for flip-chipped assemblies - yield maps 10FEI4B probe card and probe set-upRbates/TMcM19/3/2013FEI4B test solution for assembly testing yeild maps

4. Highlights and issues 1  Cash for flip-chip bonding We have the funding for the thinning work with LETI but will need further funding for the flip-chip process at Advacam Richard has contacted Heinz regarding this and awaiting feedback. Didier and Peppe have declined to contribute at this time as they have already submitted their proposals for the next 2 years We will need this further funding by the end of phase 1 (week 9 from Gant on previous slide) to test the LETI micro-bumps  Receipt of purchase CERN feedback on receipt of purchase prior to the end of March was not possible with a DAI. An invoice can be created using EDH and needs to be confirmed if this will suffice. Richard has confirmed with STFC that their will be no issues with a receipt of purchase prior to the end-of-March deadline  Top Metal layer gds information is required for the alignment scheme. Richard is trying to source this information but its painfully slow and holding up progress. Deliverable 1 has been missed due to this. LETI are still confident on meeting deliverable 2 provided we get this information ASAP. Alignment key configuration taken from FEI4 and ‘instanced’ into FEI4B. 120nm offset in y-axis, this is a little above 1% of the smallest CD of the alignment marks and should be well within alignment tolerance. Gds sent to LETI and awaiting information if it’s ok and final layout configuration.  Micro-bumps are designed and wafer mapping completed

5. Highlights and Issues 2  Meeting required to discuss sensor availability for the flip-chip process Amount of sensors for flip-chipping – good statistical analysis required for micro-bump yield. LETI input required We will need to resolve funding for the flip-chip process prior so we know how many we can process for the whole project  FEI4b Assembly testing FEI4b probe card required Test equipment/apparatus required Semi-auto testing solution required for assemblies

6. Alignment key proposal -Rectangle entourant le motif  alignement grossier -Alignement fin Croix / carré

7. Photos wafers

8. LETI wafer thinning project flow Phase 2 To be published in next report