Front-end electronics for Time Projection Chamber I.Konorov Outlook:  TPC requirements  TPC readout options  Options for TPC FE chips  Prototype TPC.

Slides:



Advertisements
Similar presentations
1 500cm 83cm 248cm TPC DETECTOR 88us 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 1MIP = 4.8 fC = 3 x10 4 e Dynamic : 30 MIP S / N = 30:1 LATERAL.
Advertisements

Front-end electronics for the LPTPC  Connectors  Cables  Alice readout electronics  New developments  New ideas  Open questions Leif Jönsson Phys.
J.C Santiard CERN EP-MIC ANALOG AND DIGITAL PROCESSING FOR THE READOUT OF RADIATION DETECTORS  J.C. Santiard, CERN, Geneva, CH
Specific requirements for analog electronics of a high counting rate TRD Vasile Catanescu NIHAM - Bucharest CBM 10th Collaboration Meeting Sept 25 – 28,
SKIROC New generation readout chip for ECAL M. Bouchel, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, IN2P3/LAL Orsay J. Lecoq, G. Bohner S.
A scalable DAQ system using the DRS4 sampling chip H.Friederich 1, G.Davatz 1, U.Hartmann 2, A.Howard 1, H.Meyer 1, D.Murer 1, S.Ritt 2, N.Schlumpf 2 1.
HEP2005, Lisboa July 05 Roberto Campagnolo - CERN 1 HEP2005 International Europhysics Conference on High Energy Physics ( Lisboa-Portugal,
ACTAR Nov 05 Lolly Pollacco CEA Saclay Front End Electronics for ACTAR.
14-5 January 2006 Luciano Musa / CERN – PH / ED General Purpose Charge Readout Chip Nikhef, 4-5 January 2006 Outline  Motivations and specifications 
TOF Electronics Qi An Fast Electronics Lab, USTC Sept. 16~17, 2002.
L.Royer– Calice DESY – July 2010 Laurent ROYER, Samuel MANEN, Pascal GAY LPC Clermont-Ferrand R&D LPC Clermont-Fd dedicated to the.
Data is sent to PC. Development of Front-End Electronics for time projection chamber (TPC) Introduction Our purpose is development of front-end electronics.
SODA: Synchronization Of Data Acquisition I.Konorov  Requirements  Architecture  System components  Performance  Conclusions and outlook PANDA FE-DAQ.
P. Baron CEA IRFU/SEDI/LDEFACTAR WORKSHOP Bordeaux (CENBG) June 17, Functionality of AFTER+ chip applications & requirements At this time, AFTER+
07 October 2004 Hayet KEBBATI -1- Data Flow Reduction and Signal Sparsification in MAPS Hayet KEBBATI (GSI/IReS)
25/05/2010 RD51 Collaboration Meeting Cisbani-Musico-Minutoli / Status JLab Electronics 1 Status of the APV25 electronics for the GEM tracker at JLab Evaristo.
1 E. Delagnes Saclay Dec 3rd CLAS12 Micromegas Tracker: FE electronics
S.Vereschagin, Yu.Zanevsky, F.Levchanovskiy S.Chernenko, G.Cheremukhina, S.Zaporozhets, A.Averyanov R&D FOR TPC MPD/NICA READOUT ELECTRONICS Varna, 2013.
The AFTER electronics from a user’s point of view D. Attié, P. Colas Mamma meeting,CERN Feb T2K electronics.
P. Baron CEA IRFU/SEDI/LDEFACTAR Meeting Santiago de Compostela March 11, A review of AFTER+ chip Its expected requirements At this time, AFTER+
DAQ for 4-th DC S.Popescu. Introduction We have to define DAQ chapter of the DOD for the following detectors –Vertex detector –TPC –Calorimeter –Muon.
Shashlyk FE-DAQ requirements Pavel Semenov IHEP, Protvino on behalf of the IHEP PANDA group PANDA FE-DAQ workshop, Bodenmais April 2009.
Valerio Re, Massimo Manghisoni Università di Bergamo and INFN, Pavia, Italy Jim Hoff, Abderrezak Mekkaoui, Raymond Yarema Fermi National Accelerator Laboratory.
65 nm CMOS analog front-end for pixel detectors at the HL-LHC
1 Luciano Musa, Gerd Trampitsch A General Purpose Charge Readout Chip for TPC Applications Munich, 19 October 2006 Luciano Musa Gerd Trampitsch.
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
ASIC Activities for the PANDA GSI Peter Wieczorek.
LHCb Vertex Detector and Beetle Chip
LC Power Distribution & Pulsing Workshop, May 2011 Super-ALTRO Demonstrator Test Results LC Power Distribution & Pulsing Workshop, May nd November.
Readout Architecture for MuCh Introduction of MuCh Layout of Much ( proposed several schemes) Read ASIC’s Key features Basic Readout chain ROC Block Diagram.
Pixel detector development: sensor
TPC electronics Status, Plans, Needs Marcus Larwill April
D. Attié, P. Baron, D. Calvet, P. Colas, C. Coquelet, E. Delagnes, R. Joannes, A. Le Coguie, S. Lhenoret, I. Mandjavidze, M. Riallot, E. Zonca TPC Electronics:
1 19 th January 2009 M. Mager - L. Musa Charge Readout Chip Development & System Level Considerations.
M. TWEPP071 MAPS read-out electronics for Vertex Detectors (ILC) A low power and low signal 4 bit 50 MS/s double sampling pipelined ADC M.
D. Attié, P. Colas, E. Delagnes, M. Riallot M. Dixit, J.-P. Martin, S. Bhattacharya, S. Mukhopadhyay Linear Collider Power Distribution & Pulsing Workshop.
VMM Update Front End ASIC for the ATLAS Muon Upgrade V. Polychronakos BNL RD51 - V. Polychronakos, BNL10/15/131.
November, 7, 2006 ECFA06, Valencia, Spain LumiCal & BeamCal readout and DAQ for the Very Forward Region Wojciech Wierba Institute of Nuclear Physics Polish.
TPC FEE status and more TUM Physics Department E18 I.Konorov.
FEE for Muon System (Range System) Status & Plans G.Alexeev on behalf of Dubna group Turin, 16 June, 2009.
1 E. Delagnes Saclay Dec 3rd FE electronics for Micromégas Trackers
STT read-out concepts Detectors requirements and layout Read-out concepts Developments of Analog FE and Digital Boards STS el. group : INFN, FZ Juelich,
Overview of TPC Front-end electronics I.Konorov Outline:  TPC prototype development  Readout scheme of the final TPC detector and further developments.
C.Beigbeder, D.Breton, M.El Berni, J.Maalmi, V.Tocut – LAL/In2p3/CNRS L.Leterrier, S. Drouet - LPC/In2p3/CNRS P. Vallerand - GANIL/CNRS/CEA SuperB -Collaboration.
SKIROC status Calice meeting – Kobe – 10/05/2007.
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 1 INFN Sezione di Pavia I Pavia, Italy.
Work on Muon System TDR - in progress Word -> Latex ?
Valérie Chambert and Joël Pouthas
Transient Waveform Recording Utilizing TARGET7 ASIC
DAQ ACQUISITION FOR THE dE/dX DETECTOR
DCH FEE STATUS Level 1 Triggered Data Flow FEE Implementation &
ETD meeting Architecture and costing On behalf of PID group
FEE for TPC MPD__NICA JINR
Journées VLSI-FPGA-PCB Juin 2010 Xiaochao Fang
Jinfan Chang Experimental Physics Center , IHEP Feb 18 , 2011
A General Purpose Charge Readout Chip for TPC Applications
Readiness of the TPC P. Colas What is left before final design?
96-channel, 10-bit, 20 MSPS ADC board with Gb Ethernet optical output
R&D activity dedicated to the VFE of the Si-W Ecal
KRB proposal (Read Board of Kyiv group)
DCH FEE 28 chs DCH prototype FEE &
A Readout Electronics System for GEM Detectors
Power pulsing of AFTER in magnetic field
A First Look J. Pilcher 12-Mar-2004
A Low Power Readout ASIC for Time Projection Chambers in 65nm CMOS
A Fast Binary Front - End using a Novel Current-Mode Technique
LHCb calorimeter main features
Status of n-XYTER read-out chain at GSI
TOF read-out for high resolution timing
Readout electronics system for Laser TPC prototype
Presentation transcript:

Front-end electronics for Time Projection Chamber I.Konorov Outlook:  TPC requirements  TPC readout options  Options for TPC FE chips  Prototype TPC readout system PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM

Time Projection Chamber  no gating  no triggering  Hexagon pads Ø 3 mm  channels  kHz hit  Extracted information: – X, Y coordinates – T -> Z coordinate – dE/dX Requirements for FEE: – Noise 500 e- - low ion feedback – Amplitude resolution 8 bits – Time resolution 3-5 ns – Double cluster resolution 200 ns – Self triggering FEE – Radiation tolerant electronics PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM

Readout options for PANDA TPC Options: – N-xyter ASIC – Super ALTRO – Hit detection ASIC – AFTER ASIC – only for TPC prototype PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM

SUPER ALTRO readout architecture Advantage:  Complete signal shape information  Best quality feature extraction : Amplitude and Time  Advanced da  Common mode noise correction  Pile up detectio PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM Disadvantage:  Low density  High power consumption SUPER ALTRO  Expansive Goal: channels/chip

Optimized readout architecture analog zero suppression PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM PreAmpShaperAnalog buffer SCA Hit detection MUX Derandomization buffer ADC Hit detection ASIC Advantages: low cost per channel low power many applications SCA Clock : 40 MHz - TPC, EMC, Silicon 100 MHz - Straw, Muon 200 MHz - Barrel DIRC, Forward EMC

PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM Read out scheme Hit Detection ASIC CSA TPC FPGA ADC CLK,RESET Digital Data CLK,RESET EMC Hit Detection ASIC EMC CSA FPGA ADC

N-XYTER ASIC Features:  Self triggering, hit rate upto160kHz/channel  Charge sensitive amplifier, peak detector  Time stamping with 1 ns LSB, 2ns resolution  Hit information: Amplitude(analog) + Time(digital)  Derandomizer buffer for 4 hits  128 channels  128:1 multiplexer, 32MHz readout  13 mW/channel PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM

N-XYTER expected performance Performance parameters are not confirmed yet! PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM

AFTER chip block diagram PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM  developed by Saclay for T2K experiment  72 detector channels  4 Fixed Pattern Noise channels  programmable charge sensitive amplifier from dynamic range 120fC to 600fC  programmable shaper: peaking time from 116÷2000 ns  analog memory: switched capacitor array, 511 cells, frequency 1÷50 MHz  readout : multiplexing 511x76 20 MHz

Measured chip performance Noise performance – Board is not connected to detector – 1 ADC unit = 0.12 fC or 700e- – 4+4 unconnected channels – 4 Fixed Pattern Noise channels PANDA collaboration meeting Igor Konorov TUM Noise of connected channels: ~600 e- T2K noise Saclay

Test chamber front-end board Front-end board:  4xAFTER chips  256 channels  L-shaped to place chips outside of beam PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM

Final design of AFTER FE card PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM 4 AFTER chips, 256 Channels Power Supply +3.3V Power consumption < 1.5W

Conclusions Not yet fully working solution for final TPC – Super-Altro – high power consumption, first prototype will be submitted in fall 2009 – N-Xyter – not yet measured, higher noise than expected – Hit Detection ASIC – no manpower for development AFTER chip fulfills requirements for TPC prototype – 500e- noise – 100 ns rise time – MHz sampling PANDA FE-DAQ workshop Bodenmais Igor Konorov TUM