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The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 1 INFN Sezione di Pavia I-27100 Pavia, Italy.

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Presentation on theme: "The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 1 INFN Sezione di Pavia I-27100 Pavia, Italy."— Presentation transcript:

1 The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 1 INFN Sezione di Pavia I Pavia, Italy 2 Università di Bergamo Dipartimento di Ingegneria Industriale, I-24044 Dalmine (BG), Italy L. Gaioni1,2, on behalf of the SVT-SuperB Group Introduction Electronic Readout for SVT Inner Layers Microstrips and striplets detectors are the baseline option for the design of the SVT fast (Layers 0 to 3) front-end at SuperB ASIC: the signals from the silicon strip detectors will be processed by a custom-designed IC based on a 130 nm planar technology with 128 channels Analog Channel: amplification filtering threshold discrimination 4 bit analog information about the signal amplitude Main requirements: Operating temperature: <40 °C Radiation tolerance: >3 Mrad/year for 10 years Power dissipation: <4 mW/channel Signal polarity: the channel must be capable of reading out the signals from either P and N-side of the strip detectors Dynamic range: MIP charge Analog Resolution: 0.2 MIP minimum input charge Hit efficiency: >95% at design luminosity Peaking Time: 25 ns for Layer 0 Signal-to-Noise Ratio: >20 Threshold dispersion: <300 e rms Six layers of microstrip detectors are foreseen in the present baseline design of the SuperB Silicon Vertex Tracker. Different strip pitches and lengths will be used in the various SVT layers; however, the capability of standing a high background rate and of operating with high hit detection efficiency will be a common feature of the innermost layers. These requirements set the need for a readout chip with analog channels with a short signal shaping time (25 to 100 ns in layers 0 – 3) to achieve an adequate time stamp resolution and a small pulse overlap. These channels are also required to provide a 4-bit hit amplitude resolution for dE/dx measurements. A new chip is being designed in a 130 nm CMOS process to comply with these specifications. This work shows the solutions that are adopted in this chip for the various blocks of the analog channels, and presents the simulation results for the current design along with the expected performance in terms of parameters such as signal-to-noise ratio, dynamic range, linearity, power dissipation. Analog front-end Analog channel Shaping circuit Charge Sensitive Amplifier Shaping function: Unipolar semi-Gaussian (RC2-CR) Polarity selection (1 bit): allows to operate with signals delivered both from n- and p- sides of double-sided strip detectors Main design features Chip bias Vdd 1.2 V PA input W/L 2000/0.2 PA input ID 500 µA Power consumption 1.1 mW Feedback Cf1, Cf2 400 fF 100 fF Reset Gf 100 nS Peaking time selection (2 bit): obtained by setting the values of capacitances in the shaper according to the following relationships (with tp0=25 ns, C0=50 fF and n=1-4) Shaper Output response and dynamic range CSA response and dynamic range Architecture: active folded cascode (with local feedback) loaded by an active cascoded load Sensitivity: low gain 2.0 mV/fC (Cf = Cf1 + Cf2), high gain mV/fC (Cf =Cf1) Reset: performed by a time continuous feedback network implemented with a differential pair (reset time in the order of a few microseconds) Noise performance Layer CD [pf] tp [ns] ENC Rs [e rms] ENC CSA S/N (1 MIP) 10 25 220 580 26 1 100 460 650 30 2 590 720 3 35 200 410 660 31 S/N >20 for all the layers (1 MIP is 16 ke- in L0 and 24 ke- in L1 to L3) 12th Pisa Meeting on Advanced Detectors, May , La Biodola, Isola d'Elba (Italy)


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