J-C. BRIENT (LLR) 1  Introduction with pictures  Prototype design and construction  R&D on the design of the full scale calorimeter CALICE - ECAL silicon-tungsten CALICE - ECAL silicon-tungsten

J-C. BRIENT (LLR) 2 Simulation,visualisation MOKKA, FANAL e + e –  W + W – at  s = 800 GeV Classified as charged pads Classified as photon’s pads e + e –  W + W – at  s = 800 GeV After reconstruction Just to recall the reason of the choice

J-C. BRIENT (LLR) 3 Jet mass Jets at 91 GeV ZH at 500 GeV Z in, H in jets Photon energy GeV Photon ID in jets  ID  → →  →  and  →  250 GeV  ± Particle momentum GeV ALL VALUES in % Electron ID in jets Electron ID Hadron MISID

J-C. BRIENT (LLR) 4 Looking along the charged track in the first 4 X0 Jet mass < 0.2 Jet mass in  →  82% 17%  →  2% 90% Tau decays ID is essential for  ID and polarisation measurement charged pionPhotons from  o Looking along the ch. track in 5-12 X0  (250 GeV) → 

J-C. BRIENT (LLR) 5  Introduction with pictures  Prototype design and construction  R&D on the design of the full scale calorimeter CALICE - ECAL silicon-tungsten CALICE - ECAL silicon-tungsten

J-C. BRIENT (LLR) mm ECAL general view 3 rd structure (3×1.4mm of W plates) 370 mm 180 mm Silicon wafer 2 nd structure (2×1.4mm of W plates) VME/PCI/… HCAL VFE Movable table ECAL Beam monitoring Global view of the test beam setup Prototypes overview Prototypes overview BEAM 1 st structure (1.4mm of W plates) Detector slab

J-C. BRIENT (LLR) 7 Design and construction of a mould with all metallic pieces for the 3 different structures Mould for alveolus structure 1.4 Alveolus structures Structure 5 alveolus :(10 layers) Detector slab (here it is just a type H structure)

J-C. BRIENT (LLR) 8 Front End electronics (Cfi / W) structure type H Silicon wafer Shielding PCB Al. Shielding PCB (8-10 layers) (  mm ) Silicon wafer (0.525 mm) Tungsten (1.4 mm, 2×1.4 or 3×1.4 mm) 7.3 mm Composite structure (0.15 mm / layer) Transverse view Detector slab

J-C. BRIENT (LLR) 9 1 wafer 62mm Diode pinout Diode bias Sig. readout PCB Wafers The aluminium sheet is the ground Aluminium sheet 10mm Diode footprint Detector schematic description Amorphous silicon deposition  Protection  Capacitance (AC coupling)

J-C. BRIENT (LLR) 10 4” high resistivity wafers -525 microns thick – 5K  cm - tile side: mm - scribe line: 100  m - scribe safety zone: 200  m - guard ring width: cca 750  m (cca 1.5 * wafer thickness) ECAL prototype ECAL prototype silicon wafer description Dead zone width is only 1mm Wafer book keeping information 24 good 24 good (<10nA leakage) First test production with 25 wafers with 25 wafers

J-C. BRIENT (LLR) 11 low noise 1.6 nv/  Hz good linearity non-linearity ≲ 1% large dynamic 650 mip CHIP FLC-PH1 developed at LAL Front End electronics Electronic readout Electronic readout 18 charge inputs 18 voltage outputs 1 MUX voltage output Custom-built VME readout board (UK) First prototype April 2003 Board based on PCI or even USB2.0 is also under study

J-C. BRIENT (LLR) 12 ITEMS LABORATORIES - Tungsten production and test ITEP, IHEP, LAL - Mechanics assembly (Cfi,…) LLR, LPC - Silicon wafers productionMSU (Moscow), IPASCR (Prague) - Amorphous silicon deposition,…PICM, LLR - VFE design and productionLAL, (LPC for large scale R&D) - ADC’s and DAQ IC, UCL, Manchester, Cambridge, Birmingham - Detector slab assemblyLLR - Cosmics test on assembled deviceLLR Responsibilities Responsibilities

J-C. BRIENT (LLR) 13 Meetings and Agenda Meetings and Agenda 21th January 2003, ORSAY (LAL) meeting on ECAL prototype - Technical meeting on construction, test, beam def., … End February 2003, PALAISEAU (LLR) Digital HCAL prototype meeting on Digital HCAL prototype - responsibilities - funding - repartition of works ECAL ready for a first debugging test beam at theSummer-Fall 2004 at the Summer-Fall 2004 The goal is :

J-C. BRIENT (LLR) 14  Introduction with pictures  Prototype design and construction  R&D on the design of the full scale calorimeter CALICE - ECAL silicon-tungsten CALICE - ECAL silicon-tungsten

J-C. BRIENT (LLR) 15 Other R&D Other R&D Cooling of the readout Impact of e.m. shower on the VFE - Study with SPICE and SAMCEF - Small prototype to validate the simulation - First response for Amsterdam 2003 GEANT4 - First study with GEANT4 - Possibility to use the beam H4 (CERN) with 200 GeV electron in First response at the end of 2003 Under preparation By the LAL group Collaboration is welcome For the electronic readout inside the detector and if needed by the dissipation of the VFE In progress at LLR

J-C. BRIENT (LLR) 16 PCB 1mm thick (with wafers) Heat points (VFE chip) Cooling channel Radiator aluminium plate Structure type H Thermal sensors External connections  Global simulation of the device with SPICE (static as well as dynamic simulation)  Local simulation by finite elements using SAMCEF (using the condition at the limit obtains by SPICE)  Correlation and validation of the simulations by a small prototype  Simulation of a “large scale" detector slab and its environment. In progress at LLR

J-C. BRIENT (LLR) 17 R&D – 1 st results SPICE/SAMCEF Point numbers Degree K T1T2T3 … T1 T2 T3 T4 T5 T6 T7 T8 8 0 m m m m SPICE SAMCEF Conditions at the limits Temperature distribution : Results : T1 T2 T3 T4 T5 T6T7T8 V = Temperature I = Calor flux

J-C. BRIENT (LLR) 18 Conclusion Conclusion  The prototype design is almost fixed  The prototype construction will begin soon  Ready for a first test beam in 2004  The R&D on the large scale detector are in progress In both case, collaboration with US labs. is welcomed