8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 1 ALICE Forward Detectors Technical Design Report Editorial team: I.G. Bearden (NBI) H. Bøggild (NBI) C.Holm.

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8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 1 ALICE Forward Detectors Technical Design Report Editorial team: I.G. Bearden (NBI) H. Bøggild (NBI) C.Holm (NBI) J.J. Gaardhøje (NBI), ch J.Y. Grossiord (Lyon) T. Malkiewicz (Jyvaesk.) B.S. Nielsen (NBI) G. Paic (Mexico) W. Trzaska (Jyvaeskyla)

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 2

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 3 FMD ’inner’ protype before dicing 2 sectors of 512 strips Test structures on 6” wafer Hamamatsu

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 4 Bonding pads and bias resistors

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 5 ALICE-FMD inner sensor

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 6 First 3 inner sensors delivered at NBI-Feb 2005 TDR Specs: Full depletion voltage V Measure: full depletion voltage: V. TDR specs: thickness = 310 μm μm Measure: t= 323 μm +- 1 μm

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 7 First test of FMD inner Si sensors TDR Specs: < 3 μA Measure: < 0.3 μA < 0.3 nA /strip Full-depletion voltage: 75 V Measure: < 2.5 pF/strip (bulk) 168 hr long-term stability test of leakage current at 200V

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 8 FMD Hybrid card w. 8 x (128 ch) preamplifiers

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 9 VA_ALICE 128 ch preampl

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 10 Test of FEE card with 8 VA_ALICE preamplifier chips

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 11 FEE card test results I MIP  e-  3.5 fC Gain 20 mV/fC => 20MIP  1.4 V TDR: C=0pF => N=310e-, C=25pF => N=410e- Measure: C=0pF : N=200e- Expect for C=25pF: N~300e- => S/N= 22400/300=75.

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 12 RCU-USB test at NBI with PC&TPC-FEE card

8-3-05Jens Jørgen Gaardhøje. NBI. ALICE-CR5 13 FMD milestones adjusted to new ALICE installation schedule Production of VA_ALICE chipdone Delivery of prototype hybrid cards done Delivery of prototype Si sensors Feb-05done Prototype digitizer boards produced April-05 Lab tests Si-FEE-Digitizer-RCU Jun-05 Rad. hardness studies of FEE&digitizer May-05 Place Si production order Jun-05 Delivery Si & FEE Nov-05 Bonding at CERN Dec-05 Mechanics RB26 completed Feb-06 Full system test with DAQ Dec-05 Sector (half ring) rad. testJan-06 Detector assembly RB26 Mar-06 Detector assembly RB24 Jun-06 Ready for installation RB26 May-06 Ready for installation RB24 Sep-06