1. ALICE SSD 20 May 20051 Yalta G-J Nooren ALICE SSD status

2. ALICE SSD 20 May 20052 Sensor delivery and testing deliveries proceeding well: > 1200 delivered proper balancing needed: –3 manufacturers –1 testing site –3 module assembly sites –testing defines layer 5 or layer 6 –need layer 5 first –matching of bias curves per half ladder testing on critical path

3. ALICE SSD 20 May 20053 HAL 25 production status 28 k chips in house second production : –13 wafers delivered mid March, 3 tested 90 % yield –thinning etc. ordered –25 more wafers delivered, to be tested chipcable production status ~ 16 k delivered Industrial production started 23 k chips in SSD

4. ALICE SSD 20 May 20054 bonding chips Real yield ~ 85 % faulty cables, faulty chips, faulty bonding

5. ALICE SSD 20 May 20055 Hybrids ~2000 subhybrids delivered, ~1000 bonded

6. ALICE SSD 20 May 20056 module assembly status Folded, ready for ladder assembly 267 modules plus: Hybrids for 200 Chips for 300 1698 in SSD

7. ALICE SSD 20 May 20057 module yield & quality In March, > 20 % of mass produced modules from Strasbourg and Trieste have IV-curves like  Investigations at Helsinki and Utrecht Strasbourg Trieste measurements I-V curves noise response to laser optical inspection V_depl = 55 V TRI029/ITC332

8. ALICE SSD 20 May 20058 I-V measurement set up

9. ALICE SSD 20 May 20059 I-V trouble: evidence 1 Hybrid GND decoupled from bias: normal behaviour

10. ALICE SSD 20 May 200510 I-V trouble: evidence 2 By changing the Hybrid- GND potential the rise shifts forward The slope is ~1MΩ (current by-passed the N-side resistor) -4 -7 0

11. ALICE SSD 20 May 200511

12. ALICE SSD 20 May 200512 Detailed view of a faulty bond A possible short between metal strip and p-stop sensor bonding pad chipcable

13. ALICE SSD 20 May 200513 module yield & quality (cont’d) problem analysed and understood repair method available and tested bonding method improved: last modules –MIPOT, Helsinki 95 % –IReS 85 % mostly other failures TRI074/ITC447

14. ALICE SSD 20 May 200514 Thermal cyclings (hybrids/chips) Two cycling sessions Cycling profile +5 - +90 (26 min.) 1) 16 glued chips and 6 hybrids cycled one week (387 cycles) Small vibration due the cycles caused by oven compressors 2) 5 glued and 5 unglued chips cycled one week (380 cycles) Vibrations eliminated Henri Seppänen in SSD meeting, Jalta, 16-20th of May 2005

15. ALICE SSD 20 May 200515 Thermal cycling test results Results 1) Chips and hybrids tested after 387 cycles - All 16 chips have many bonds opened - 30*** cables have more open bonds than 10*** cables - All 6 hybrids got fatal damages 2) 10 chips tested after 90, 264 and 380 cycles - One unglued chip got 2 open bonds after 264 cycles and got ExTest error. - No other damages. ? Indicates that vibrations + cycling might cause damages?  Not likely in the ALICE conditions, but more research will be done In the past 1 hybrid survived 350 cycles, no chip functionality failures after 1326 cycles

16. ALICE SSD 20 May 200516 Ladder cable status First prototypes delivered discussing delivery schedule 3400 in SSD

17. ALICE SSD 20 May 200517 Ladderframes assembly is going on, 1/day 10 ladder5, 14 ladder6 72 ladders in SSD Ladderframe with all 75 sensor supports within 0.03 mm in same plane

18. ALICE SSD 20 May 200518 Ladder assembly status –Transport of French machine to SUBATECH –Tests of module gripper –First calibration of NIKHEF machine: 2  m –accuracy of positioning, TDR: X 10  m, R 90  m, Z 50  m –first ladder before summer (SUBATECH and NIKHEF) –start mass production from September compatible with July delivery –Formation of teams in SUBATECH and NIKHEF Calibration ladder, measured relative to ladder supports

19. ALICE SSD 20 May 200519 Clean room installation @ SUBATECH Module and ladder storage Module test bench Ladder assembly benchSoldering bench Ladder test bench Ladder cable test bench

20. ALICE SSD 20 May 200520 Assembly bench (2) Installation at SUBATECH : week 17

21. ALICE SSD 20 May 200521 Graphic user interface

22. ALICE SSD 20 May 200522 conclusion Excellent cooperation in heterogeneous team Good progress in module production, but –Folding of modules not yet started at production sites –Testing of sensors too slow Slowly working towards assembly of first ladders SSD assembly late start due to cone problems important decisions this week: –module test requirements –ladder support rings –grounding Money and manpower problems showing up everywhere