PCB Design (with EAGLE tutorial) TA: Robert Likamwa ELEC 424, Fall 2010.

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Presentation transcript:

PCB Design (with EAGLE tutorial) TA: Robert Likamwa ELEC 424, Fall 2010

Printed Circuit Boards What are they? How can I make one? 424 Project description Eagle Tutorial

What is a Printed Circuit Board? “A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces.” (Wikipedia)

How does it work? Drilling (vias and holes) Patterning (etching) ▫Subtractive process to remove copper cover from a preimpregnated substrate ▫Silk-screen printing of etch- resistant inks Lamination ▫Multilayer PCBs Coating ( Solder and Solder mask /resist) Printing text and symbols

Why do I need to know PCB Design? Create your own embedded devices. ▫More robust than breadboard. Won’t fall apart. ▫Can use surface mount chips ▫Light in weight and size ▫Production quality devices Put it on your resume… Recession-proof skill!

Steps to Design a PCB Figure out Functional Design ▫Identify components to be used Design schematic Design PCB Layout and Routing

Function DesignSchematic Layout Routing Form factor constraints Production Assembly Component library PCB design tool PCBexpress.com Any local workshops Design rules

Function Design What’s your device supposed to do? What sensors do you need to achieve your tasks? How is everything going to be powered? Will it fit in the provided space?

Component Selection Which Integrated Circuit chips can perform your task? Do they play nicely with each other? Are they available from the distributor?

Through-hole components Transistors, Resistors, Capacitors DIP (Dual In-Line Package) Packages

Two-terminal SMD Packages Surface Mount Devices Resistors, Capacitors, LEDs, etc. Usually given in hundredths of an inch ▫Careful, they can be given in metric, also. Some common form factors: ▫0805 (means 0.08” x 0.05”) ▫1206 ▫1210 ▫1806

IC Form Factors Surface Mount Device (SMD) Chip form factors: ▫Small Outline IC (SOIC) (variants - TSOP, SSOP, TSSOP) ▫Quad Flat Package/No-lead QFP, QFN ▫Ball Grid Array (BGA)

Decoupling (Bypass) Capacitors Remove noise by shunting noise uF for board (electrolytic or tantalum) 10nF for each IC (ceramic) Put capacitors as close as possible to ICs. AB Vdd Electrolytic (polar)Ceramic (non-polar)

Steps to Design a PCB Figure out Functional Design ▫Identify components to be used Design schematic Design PCB Layout and Routing Use Eagle!

Function DesignSchematic Layout Routing Form factor constraints Production Assembly Component library PCB design tool PCBexpress.com Any local workshops Design rules

Project Description Build a PCB to control the QuadRotor Helicopter. Figure out tilt of board, control motors to balance. ▫Use gyroscope and accelerometer sensors. Control altitude ▫Use ultrasound rangefinder Offer user-control of movement via bluetooth. Use MSP430 as the CPU (the “brain”)

Eagle Schematic Design

Schematic Project Considerations Gyroscope MUST be connected to I2C pins on MSP430 Accelerometers and Rangefinder MUST be connected to ADC pins on MSP430

Add parts Move Clone Delete Mirror Rotate Group objects (try right-clicking!)

Schematic Exercise! Part 1 New Project New Schematic Save it inside the project folder. Use library “ricemobile.lbr” (Library->Use) Add Part MAX604 (MAX604) Add Part MSP430 (F16X---PM64) Add Part KXM52 Accelerometer (KXM52) Add Ground, Add VCC (From Supply Library)

Schematic Exercise! Part 2 Connect GND wires on MAX604. Clone GND, connect it to GND. Connect VCC to IN. Add Electrolytic Capacitors (1206) to IN and OUT. ▫Rotate by right-clicking while moving it ▫Make sure minus side of capacitor is pointed to GND Value the Capacitors appropriately (10 uF).

Schematic Exercise! Part 3 Draw lines to connect ▫OUT_Y, OUT_Z on KXM52 ▫A1, A2 on MSP430 Connect “wirelessly” ▫Draw line sticking out of OUT_X. ▫Draw line sticking out of A0. ▫Name both lines ACC1_X. ▫Label both of them. By the way, you’re not finished here. There are resistors and capacitors that need to be placed around the KXM52. Always check the datasheets!

Eagle PCB Layout Design

PCB Layout Considerations Positions of the following need to be EXACT: ▫4 mounting holes (1.75” square pattern) ▫Accelerometer (1.5”, 1.5”) ▫MSP430 (1.5”, 1.0”) (For accelerometer and MSP430, we’re sending in a stencil for PCB Assembly) Board size needs to be 3”x3”

Layout Exercise! 1: Resize Board Use “Move” tool Type in ( ) ▫This will select the rightmost border as if you clicked exactly there. Type in ( ) ▫This will move the cursor to that position, resizing the board to exactly 3”x3” Then move all of your components in.

Poke holes in the right places 1.75” apart in a square pattern on a 3” x 3” board 3” – 1.75” = 1.25” extra 1.25”/2 = 0.625” clearance 0.625”+1.75” = 2.375” (0.625, 0.625)(0.625, 2.375) (2.375, 0.625) (2.375, 2.375)

Layout Exercise! 2: Precision Layout Draw 4 holes. ▫Use hole tool. Type: drillsize (x y)  ( )  ( )  ( )  ( ) Move KXM52 to its place ( ) Move MSP430 to its place ( )

Layout Exercise! 3: MAX604 on bottom Put MAX604 and its capacitors on bottom by using Mirror tool. Yellow lines are “Airwire” lines Use Route Manually tool to turn Airwires into traces ▫Turn off Grid (View->Grid, Finest Grid)  Or just change grid spacing to what you want it to be. ▫Change line width as necessary at top of screen

Layout Exercise! 4: Connect From KXM52, connect pin 6 to MSP430. From KXM52, connect pin 9 to MSP430. From KXM52, connect pin 7 to MSP430. ▫Go from top to bottom by selecting “Bottom” at the top-left of the screen. This will create a via. ▫Try to make your bottom traces as short as possible.

Layout Exercise! 5: Create GND Plane Use Polygon tool to draw a GND Plane. (Make sure not to draw the plane beneath your bluetooth antenna) ▫Use the name tool to make it GND. ▫“Ratsnest” to see the result Create GND vias near GND pins on KXM52 and MSP430. ▫Place Vias, then “Name” them GND. Route the vias to the chips.

Create your own part Some parts don’t have an Eagle footprint associated with them. Let’s create our own gyroscope part.

Part Creation Tutorial 1 Go to Control Panel (Window->Control Panel) File->New Library ▫Save library as 424parts.lbr Library->Symbol ▫Call it GYRO-BREAKOUT Use “Draw a Pin” to add pins. Change names ▫SCL, SDA, CLK, INT, GND, VLOGIC, VDD

Part Creation Tutorial 2 Library->Package ▫Call it GYRO-BREAKOUT Draw 7 Pads in a row. Space them by 0.100” ▫Drill size set to ~ ▫Rename the pads if you want to. Draw a box around the 7 pads with “Draw Lines”

Part Creation 3 Library->Symbol ▫Call it GYRO-BREAKOUT Add a Part ▫Select GYRO-Breakout, lay it down Click “New” button (on right side) ▫Select GYRO-Breakout Click Connect ▫Assign pins to the symbol to pins on the device appropriately.  SCL, SDA, CLK, INT, GND, VLOGIC, VDD Now if you want to use the part, all you have to do in a schematic is Use Library & Add Part.

Where to go from here: Design Rule Checking ▫Find the Sunstone design rules online.  resources/downloads.aspx resources/downloads.aspx  DFM Add-ons ▫Follow its provided instructions to check your design rules. Create Gerber Files ▫Gerber: standard file format for patterns on PCB – used by most fabrication houses Send Gerber Files to PCBExpress

Create Gerber Files Download EagleCam.zip EagleCam.zip Use instructions at: Sunstone%20Protos.pdf Sunstone%20Protos.pdf Open your board Click on ULP then select “drillcfg.ulp” Click on CAM then select “excellon.cam” Click on CAM then select “xLPlus-Sunstone.cam" ▫x = number of layers ▫Note which layers you want for each file ▫Dimension layer (20) should be selected in all files Important: always check your Gerber files afterwards ▫Free viewer:

Send files to PCBExpress Outline:.oln Drill hole locations/size:.drd/.drl Copper layers:.l1,.l2,.l3,.l4 Top/bottom solder mask:.smt/.smb Top/bottom silkscreen:.slk/.slb Top/bottom soldering stencils:.tps/.bps (May be different files for you)

And that’s the tutorial! Now you know how to Layout a PCB. The rest comes from experience! Just remember to always read the datasheets for all components. Further project specifications will be provided.