Building a world without wires! October 6, 2000 Kichul Chang Principal Engineer LG Innotek Co., Ltd.

AGENDA Bluetooth Introduction Bluetooth Introduction Future of Bluetooth Future of Bluetooth Market Overview Market Overview Chipset & Module Trend Chipset & Module Trend Conclusion Conclusion

Bluetooth Introduction

- 3 - Personal Ad-hoc Connectivity Cable Replacement Landline Data/Voice Access Points Bluetooth Vision The best low-cost radio link technology The best low-cost radio link technology Perfect for mobile devices – small, low power, and low cost, but good performance Perfect for mobile devices – small, low power, and low cost, but good performance Open, royalty free specification Open, royalty free specification

- 4 - Bluetooth SIG History Ericsson Invented the Concept - '94 Ericsson Invented the Concept - '94 Invited Other Industry Leaders to Help Develop the Concept - '97 Invited Other Industry Leaders to Help Develop the Concept - '97 Technology Announced - May '98 Technology Announced - May '98 Nine Lead Promoter Companies - Ericsson, Nokia, Toshiba, Intel, IBM - Microsoft, Motorola, 3Com, Lucent (Dec '99) Nine Lead Promoter Companies - Ericsson, Nokia, Toshiba, Intel, IBM - Microsoft, Motorola, 3Com, Lucent (Dec '99) Unprecendented Industry Acceptance of the Bluetooth Wireless Technology - Over 2000 Adopter and Associate Companies Have Joined the SIG! - Many Market Segments and Usage Models Have Been Defined Unprecendented Industry Acceptance of the Bluetooth Wireless Technology - Over 2000 Adopter and Associate Companies Have Joined the SIG! - Many Market Segments and Usage Models Have Been Defined v1.0 Specification Published - July '99 v1.0 Specification Published - July '99 v1.0b Update Published - Dec '99 v1.0b Update Published - Dec '99 v1.1 Update will be Published - Nov '00 - New Member Web-Site Opened ( v1.1 Update will be Published - Nov '00 - New Member Web-Site Opened ( Products Are Starting to Enter the Market Now - Mobile Phones, Headsets, Mobile PCs, Data Access Points Products Are Starting to Enter the Market Now - Mobile Phones, Headsets, Mobile PCs, Data Access Points

- 5 - Korean SIG Members Advanced Semiconductor Business Inc.Advanced Semiconductor Business Inc. Belco International Co., LtdBelco International Co., Ltd Bellwave, Inc.Bellwave, Inc. C&S TechnologyC&S Technology Commax.co.ltdCommax.co.ltd CyberbankCyberbank D.O.TelD.O.Tel Dacom CorpDacom Corp Daewoo Telecom LTDDaewoo Telecom LTD DAIC MicrosystemsDAIC Microsystems Doshin Electroniks Corp.Doshin Electroniks Corp. DreamTelDreamTel DSI Inc.DSI Inc. EST(Embedded Solution Technology Inc.)EST(Embedded Solution Technology Inc.) ETRIETRI FlinstonFlinston Gmate, Inc. / ASIC design Lab.Gmate, Inc. / ASIC design Lab. Hanchang CorpHanchang Corp Hansei UniversityHansei University HASSNetHASSNet HC Telecom Co., Ltd.HC Telecom Co., Ltd. Hutel Inc.Hutel Inc. IWingzIWingz JATY ELECTRONICS CO., LTDJATY ELECTRONICS CO., LTD Joohong Information and communicationJoohong Information and communication JTEL Co. LtdJTEL Co. Ltd KetiKeti KiRyung Electronics Co., LtdKiRyung Electronics Co., Ltd Korea Electronics Technology InstituteKorea Electronics Technology Institute Kortronics Enterprise Co., LtdKortronics Enterprise Co., Ltd LG Electronics Inc./ Media-Communication Lab.LG Electronics Inc./ Media-Communication Lab. LG Information & Communications,LtdLG Information & Communications,Ltd LG Innotek Co., Ltd.LG Innotek Co., Ltd. LG TelecomLG Telecom Maxon ElectronicsMaxon Electronics MiengineMiengine MMC Technology, Inc.MMC Technology, Inc. N3 Technologies IncN3 Technologies Inc NavtronNavtron Netnaru Ltd.Netnaru Ltd. Nexcell Telecom CO, LtdNexcell Telecom CO, Ltd Nong Shim Data System Co, Ltd.Nong Shim Data System Co, Ltd. NuArk Co., Ltd.NuArk Co., Ltd. Open SolutionOpen Solution Opentech Inc.Opentech Inc. Powerlink Corp.Powerlink Corp. Radionix Inc.Radionix Inc. RFSSRFSS S&S Technology, Inc.S&S Technology, Inc. SamsungSamsung SANION CO.,LTD.SANION CO.,LTD. Sejin Electron Inc.Sejin Electron Inc. SENA Technologies, Inc.SENA Technologies, Inc. SEWON TELECOM LTDSEWON TELECOM LTD Simplex InvestmentSimplex Investment SK TelecomSK Telecom SysOnChip, Inc.SysOnChip, Inc. TeleTek Inc.TeleTek Inc. Telian CorporationTelian Corporation Tescom co. ltd.Tescom co. ltd. UNO Systems Co., LtdUNO Systems Co., Ltd Wide Telecom, Inc.Wide Telecom, Inc. Total 62 Company/University/Institute (19/July/'00) Total 62 Company/University/Institute (19/July/'00) About 200+ Companies participate in Bluetooth Developments. About 200+ Companies participate in Bluetooth Developments. Main Application is Mobile Phone and Accessary Main Application is Mobile Phone and Accessary

- 6 - BQRB = Bluetooth Qualification Review Board BTAB = Bluetooth Technical Advisor Board BQA = Bluetooth Qualification Administrator BQB = Bluetooth Qualification Body Bluetooth SIG Structure

- 7 - Application Framework and Support Link Manager and L2CAP Radio & Baseband Host Controller Interface RF Baseband Audio Link Manager L2CAP TCP/IPHIDRFCOMM Applications Data Control Spec Overview Test Specification

- 8 - Frequency band & Channel Arrangement : ISM Band - USA GHzf = k MHz, k=0, …78 - Europe GHzf = k MHz, k=0, …78 - Spain GHzf = k MHz, k=0, …22 - France GHzf = k MHz, k=0, …22 Transmitter Power Transmitter Power - 0 dBm (Class 3) - 4 dBm (Class 2) - 20 dBm (Class 1) Power Consumption Power Consumption mA (Standby mode), 30mA (Operating Mode) Modulation Modulation - GFSK (BT = 0.5; 0.28 < h < 0.35) - 1 MSymbols/s Receiver Sensitivity Receiver Sensitivity - 0.1% BER Spec Overview (Radio)

- 9 - Spec Overview (Baseband) Channel - Data channel + 3 Voice Channel - Data Rate: kbps / 57.6 kbps (Asymmetric), kbps / kbps (Symmetric) - Voice : 64 kbps for each channel FEC (Forward Error Correction) FEC (Forward Error Correction) - 1/3 Rate FEC, 2/3 Rate FEC - ARQ scheme for the data Security - Robust Authentication and Encryption : Key Length up to 128 bits - Fast Frequency Hopping : 79 channels - Low transmission Power : Range typically 10 meters Audio Audio - CVSD (Continuous Variable Slope Delta Modulation) - 64k samples /s linear PCM data Support up to 8 devices / piconet, Max 10 piconet (71 devices)

SCO (Synchronous Connection Oriented) Link. 1 Packet / 1 Slot ACL (Asynchronous Connection-Less) - Packet, 1,3,5 3 Slot Spec Overview (Link)

Piconets & Scatternets Master Piconet 1 Slave 3 Slave 1 Slave 2 Master Piconet 3 Slave 7 Slave 6 Slave 8 Master Piconet 2 Slave 5 Slave 4 A master and up to 7 slaves from a Piconet A master and up to 7 slaves from a Piconet Master controls the Piconet Master controls the Piconet Slaves only communicate with the master Slaves only communicate with the master Up to 10 Piconets in a Scatternet before performance starts to degrade Up to 10 Piconets in a Scatternet before performance starts to degrade Total 71 devices can be connected together (= 7*9 + 8) Total 71 devices can be connected together (= 7*9 + 8)

Bluetooth Profile Profiles provide a vertical slice through the protocol stack Profiles provide a vertical slice through the protocol stack - Each profile defines mandatory and optional features of each protocol One profile defined per usage model One profile defined per usage model Profiles are the basis for interoperability and logo requirements Profiles are the basis for interoperability and logo requirements Each Bluetooth device supports one or more profile Each Bluetooth device supports one or more profile Profiles Protocols Applications

ProfilesEquipments Headset IntercomHandset, CT Phone Dial-up NetworkingModem FAX LAN AccessRouter, Gateway File TransferPC, Notebook SynchronizationPDA, Notebook Intercom Image VOICE Mobile Phone Bluetooth Profile Dialup Networking Image DATA Mobile Phone Modem Bluetooth Profile Object PushHandset, PC Cordless TelephoneHandset, CT Phone Generic OBEX Profile Serial Port Profile SDP (Service Discovery Profile) GAP (Generic Access Profile)

Qualification Program (Bluetooth Identity) Qualification Program (Bluetooth Identity) Regulatory Type Approval (License to sell) Regulatory Type Approval (License to sell) Bluetooth Qualification Goal : To ensure interoperability between different Bluetooth devices even from different vendors BQTF BQB Manufacturer BQA Product tested Declaration and documentation review Qualified products lists Documents pulled from web side Test report checked by BQB Qualification Program Documents RF EMC SAR RF EMC SAR USA EUROPE ETS ETS ES ETS ETS ES Deliverry : 5 Week Cost : : USD 15k Deliverry : 5 Week Cost : : USD 15k FCC Part 15 FCC Part 2 FCC Part 15 FCC Part 2 Delivery : 6 Week Cost : USD 10k Delivery : 6 Week Cost : USD 10k RF EMC SAR RF EMC SAR

DATE: 5 - 9th November 2000 (Sunday - Thursday). DATE: 5 - 9th November 2000 (Sunday - Thursday). LOCATION: Bellevue, Washington, U.S.A (located near Seattle on the North West coast of the USA. Hosted by Microsoft). LOCATION: Bellevue, Washington, U.S.A (located near Seattle on the North West coast of the USA. Hosted by Microsoft). WHO IS INVITED? Engineers who meet ALL of the following criteria: - Are developing Bluetooth components, firmware or software - Have a unique implementation - Are able to fix problems with the portion of the product that they are testing - Are members of the Bluetooth SIG WHO IS INVITED? Engineers who meet ALL of the following criteria: - Are developing Bluetooth components, firmware or software - Have a unique implementation - Are able to fix problems with the portion of the product that they are testing - Are members of the Bluetooth SIG THOSE **NOT** INVITED: - System integrators who are bringing third party products for evaluation - Marketing Staff - Observers, Press, Sales Representatives, Students THOSE **NOT** INVITED: - System integrators who are bringing third party products for evaluation - Marketing Staff - Observers, Press, Sales Representatives, Students HOW WILL TESTING BE CONDUCTED HOW WILL TESTING BE CONDUCTED - Category-1 (RF, BB, LM), - Category-1 (RF, BB, LM), - Category-2 (L2CAP, SDP, RFCOMM, TCS) - Category-2 (L2CAP, SDP, RFCOMM, TCS) - Category-3 (Application profiles). - Category-3 (Application profiles). UnPlugFest-4

SD Client LC DriverTimer Driver HCI - Host Driver IRQ Driver L2CAP RFCOMM PPP UDPTCP AT Commands vCard/vCal SD Server TCS BIN HCI IP WAE Baseband w/ Link Controller ASIC Bluetooth RF Module Audio HCI Transport/Drivers Host Controller Link Manager OBEXWAP USBSerial PCMCIA USBSerial PCMCIA RTOS Flash Driver Flash Loader SSI SCMDBM Virtual OS Layer Bluetooth Software Application Software Baseband Firmware

Future of Bluetooth

BluetoothHomeRF IEEE Major Company Ericsson, Intel, IBM Nokia, Toshiba Microsoft, Intel, IBM HP, Compact Harris,3COM,Lucent Symbol, Aironet, StandardStatus SIG 1.0b SWAP 1.11 (99.6) IEEE Rev D10 Technology Power Symbol Rate Range Topology Security RF 2.4GHz, FHSS RF 2.4GHz FHSS, DSSS, irDA 0 ~ 20 dBm (1mW ~ 100mW) < 20 dBm (100mW) 1MS/s 0.8/1.6 MS/s 11MS/s 10 m 100m(Optional) 50/100 m 30 m 8 (Piconet),Ponit-to-Multi AuthenticationEncryption Optional Optional, WEP < 20 dBm (100mW) 128CSMA 128CSMA Freq HOP 79ch, 1600 hop/sec 79ch, 50 hop/sec 79ch, 2.5hop/sec Application Mobile Phone Mobil Computer Home WLAN WLAN MAC Protocol Link Management L2CAPEthernetEthernet Voice 3Ch, 64kb/ch CVSD, Log PCM DECT 6Ch, 32Kbps ADPCM X Modulation 2GFSK 2GFSK4GFSK FHSS(2GFSK,4GFSK)DSSS(DBPSK,DQPSK) Time to Market Q3, 2000 ? On Market Comparsion with Other Spec.

IEEE WPAN Task Group 1 (TG1) - Bluetooth - IEEE Standards making efforts - To publish an approved standard early next year Task Group 1 (TG1) - Bluetooth - IEEE Standards making efforts - To publish an approved standard early next year Task Group 2 (TG2) - Coexistence between and Wireless Network - Target Completion Date : Mar 2001 Task Group 2 (TG2) - Coexistence between and Wireless Network - Target Completion Date : Mar 2001 Task Group 3 (TG3) - High Rate Study Group (>20Mbps) - Target Completion Date : Nov 2001 Task Group 3 (TG3) - High Rate Study Group (>20Mbps) - Target Completion Date : Nov 2001 MC (Marketing Committee) MC (Marketing Committee) R2SG (Radio 2 Study Group) R2SG (Radio 2 Study Group) LRSG (WPAN Low Rate Study Group) LRSG (WPAN Low Rate Study Group)

Bluetooth Spec 2.0 (Radio 2) Improved Mode : 2Mbps Improved Mode : 2Mbps Higher Rate Mode : 10Mbps Higher Rate Mode : 10Mbps Fully backward interoperable with Bluetooth Specification 1.0 Fully backward interoperable with Bluetooth Specification 1.0 To meet cost/power requirements, SIG did not want larger bandwidth application To meet cost/power requirements, SIG did not want larger bandwidth application Conflict with IEEE (TG3) Conflict with IEEE (TG3) Bluetooth Radio 1 2.4G, 1Mbps Radio 2 2.4G, 2~10Mbps 2.4G, 20Mbps Radio 3 5G(?), 20Mbps

Developed by Philips, Sony, Toshiba, Ericsson and Nokia Developed by Philips, Sony, Toshiba, Ericsson and Nokia Classes: Classes: Sound distribution: high quality audio to headphones and speaker sets Sound distribution: high quality audio to headphones and speaker sets Surround distribution: wireless surround sound systems Surround distribution: wireless surround sound systems Video distribution: observation camera, video projector Video distribution: observation camera, video projector Video conferencing: 3 rd generation mobile phones Video conferencing: 3 rd generation mobile phones Audio/video control: control signals Audio/video control: control signals Key aspects: Quality of service and choice of right codecs Key aspects: Quality of service and choice of right codecs Audio Compression : MP3 Audio Compression : MP3 Video Compression : MPEG4 Video Compression : MPEG4 MPEG1(1.5Mbps) & MPEG2(>5Mbps) will realize in ver2.0 or higher MPEG1(1.5Mbps) & MPEG2(>5Mbps) will realize in ver2.0 or higher A/V Profile W/G

Accessing the Car Accessing the Car Authorize for Car Access Authorize for Car Access Personalized Setting Personalized Setting Authorize car embedded equipment Authorize car embedded equipment Authorize for Service Authorize for Service Vehicle Area LAN Extension Vehicle Area LAN Extension Portable Device Functionality Portable Device Functionality Portable Smart Card Portable Smart Card Portable Phonebook Portable Phonebook Portable Voice Recognition Portable Voice Recognition Public Access Profile Public Access Profile Authorized Workshop, Gas Station, etc. Authorized Workshop, Gas Station, etc. Anonymous Access Anonymous Access Automotive&Bluetooth Automotive W/G

Car Hands Free ('01 ) ('01 ) Headset, Ear Piece Headset, Ear Piece Navigation System, A/V System Navigation System, A/V System Bluetooth Control Unit Bluetooth Mobile Phone Bluetooth Microphone Bluetooth Interface Source : Kenwood

Bluetooth Market Overview

Silicon Vendor Module Vendor Set Maker S/W Vendor Bluetooth Qualification Nitch Market Philips Infineon CSR ATMEL Ericsson ALPS Lucent MACO SSL S3 IVT Extended System Salutation Con. Cetecom 7Layer TUV Modile Phone PC Maker Consumer etc... ?? Bluetooth Business Model Bluetooth S/W Stack Ver 1.0 Open, Global Market Open, Global Market Over 2,000 Company Participate in Bluetooth Business Over 2,000 Company Participate in Bluetooth Business

Source : Cahners In-Stat Group, July 2000 FAX Notebooks, HHPCs Desktop PCs Palm Computers Video Projectors Home Networking Automotive Cellular Photo Printers Set Top Boxes Cellular/PCS Headsets Cordless Phones PBX Printers Office Networks Digital Cameras Potential Bluetooth Markets

PhonePhone Dongle Type BT Module Baseband Host Chip RF Module 3 in 1 Phone 3 in 1 Phone Notebook PDA USB Dongle PCMCIA Card Module WLAN WLAN (Printer, ) (Printer, ) Desktop- PC PC Card USB Adapter Module WLAN WLAN (Printer, ) (Printer, ) (, ) (, ) Accessary&Etc.Accessary&Etc. H/F /PC H/F H/F PSTN Gateway LAN Access Point CNS,A/V REKES, BT RF Bluetooth Product Trend

Source : Cahners In-Stat Group, July 2000 Bluetooth Worldwide Market Growth Europe and Japanese Markets take off faster than in North America. Europe and Japanese Markets take off faster than in North America. Total 1,375Million Unit in 2005 Total 1,375Million Unit in ,375 Million Unit

Mobile Phones 45.6% PC Cards & Adapters 32.9% Printer & Fax 7.0% Desktop PCs 6.4% Notebook PCs 3.4% Cordless Phones 2.6% Other 2.1% 2001 = 31M Units Mobile Phones 73.2% Desktop PCs 5.9% Headsets 4.6% Printer & Fax 4.1% Notebook PCs 3.8% PC Cards & Adapters 3.6% Other 4.9% 2005 = 1,375M Units Top 6 Bluetooth Application Digital Mobile Phone's Bluetooth Market grows from 45.6% to 73.2% Digital Mobile Phone's Bluetooth Market grows from 45.6% to 73.2% As more products integrate Bluetooth, the percentage of PC Cards/Adapters will shrink. As more products integrate Bluetooth, the percentage of PC Cards/Adapters will shrink. Source : Cahners In-Stat Group, July 2000

Semiconductor Revenue vs. ASP Total 6 year CAGR of 256% in revenue Total 6 year CAGR of 256% in revenue 29% decline in average sales price, from 1999 to % decline in average sales price, from 1999 to 2005 Source : Cahners In-Stat Group, July 2000 Million US$ US$

Bluetooth Equipment Maker 3Com - Bluetooth Modem Card for Notebook PCs 3Com - Bluetooth Modem Card for Notebook PCs Acer NeWeb - licensed WIDCOMM's dongle, PCMCIA, CF Acer NeWeb - licensed WIDCOMM's dongle, PCMCIA, CF Alcatel - OneTouch 500, 700 GSM Phone Alcatel - OneTouch 500, 700 GSM Phone Axis Communications - Access Point Axis Communications - Access Point Compaq - Psion's PC Cards, USB Dongle Compaq - Psion's PC Cards, USB Dongle Dell - Psion's PC Cards, USB Dongle Dell - Psion's PC Cards, USB Dongle Motorola/Digianswer A/S - PCMCIA, USB Adapter, Car-Kit Motorola/Digianswer A/S - PCMCIA, USB Adapter, Car-Kit Ericsson - T36 GSM Phone, Headset Ericsson - T36 GSM Phone, Headset Handspring - Acer Nweb's Product Handspring - Acer Nweb's Product IBM - Motorola and TDK's PC Card IBM - Motorola and TDK's PC Card Socket Communication - CompactFlash Card Socket Communication - CompactFlash Card TDK - PC Cards, USB Adapter, CF, LAN Access Point TDK - PC Cards, USB Adapter, CF, LAN Access Point Toshiba - Note Book PCs Toshiba - Note Book PCs Xircom - PC Cards, USB Dongle, CF Xircom - PC Cards, USB Dongle, CF MotorolaAxisIBMWidcomm TDK

Bluetooth Chipset & Module Trend

Voice in/out Power Mgmt PLL Clocks RF Interface Transmit Buffer 1/3, 2/3 FEC Data Whitening CVSD/ PCM Clock Recovery 1/3, 2/3 FEC Offset Canceller Receive Buffer Sliding Correlator Link Controller UART PCMROM A/D (RSSI) VCO PDN/A Pre- scaler PLL and control logic Demod S & H Power Management Low IF Receiver LNA Data in/out BB Chip RF Chip RF Module Bluetooth Module & ComponentsAntenna Band Pass Filter RF Switch Crystal Substrate (FR-4) Balun RF Shield Regulator RF Chip BB Chip Flash Memory Substrate (LTCC) Radio Module Bluetooth Module

Radio IC BiCMOS Technology - Low Power Consumption BiCMOS Technology - Low Power Consumption Low IF or Direct Conversion Low IF or Direct Conversion Qualcomm MSM Interface Qualcomm MSM Interface BlueRF Interface BlueRF Interface Vendor Philips (UAA3558, BiCMOS) Conexant/Philsar (PH2401, SiGe-BiCMOS) Siliconwave (SiW015, SOI BiCMOS) Broadcomm/Innovent (NVT1003, CMOS) Infineon (PMB6615, BiCMOS) Lucent (W7020, BiCMOS) National Semiconductor (LMX3162, BiCMOS) OKI (ML7050LA, CMOS) Atmel/TEMIC (T2901, SiGe-BiCMOS) Vendor Philips (UAA3558, BiCMOS) Conexant/Philsar (PH2401, SiGe-BiCMOS) Siliconwave (SiW015, SOI BiCMOS) Broadcomm/Innovent (NVT1003, CMOS) Infineon (PMB6615, BiCMOS) Lucent (W7020, BiCMOS) National Semiconductor (LMX3162, BiCMOS) OKI (ML7050LA, CMOS) Atmel/TEMIC (T2901, SiGe-BiCMOS) Package TSSOP-38, BGA-48, TQFP-48 Package TSSOP-38, BGA-48, TQFP-48

CPU Core 16~32bit RISC INTERRUPT CONTROLLER DEBUG I/F PORT ROM RAM SYSTEM CONTROLLER UART I/F USB I/F PCM I/F TIMER WATCHDOG LINK CONTROLLER CVSD ADC & DAC RF I/F XTAL Amp & SPK -Phone POWER MANAGEMENT VOLTAGE REGULATOR EEPROM or FLASH RF MODULE HOST I/F Baseband Structure

Baseband IC Processing Power - 3 to 4 MIPS Processing Power - 3 to 4 MIPS ARM7 Core - Ericsson & Philips, Nokia, Xircom, 3Com, Lucent, Atmel Mitel Semiconductor, Conexant/Philsar, Alcatel Microelectronics ARM7 Core - Ericsson & Philips, Nokia, Xircom, 3Com, Lucent, Atmel Mitel Semiconductor, Conexant/Philsar, Alcatel Microelectronics Other Baseband Core CSR : 16bit RISC Broadcom(Innovent) : 8051 Hitachi : H8 National : CR16 Digianswer : DSP Other Baseband Core CSR : 16bit RISC Broadcom(Innovent) : 8051 Hitachi : H8 National : CR16 Digianswer : DSP External Flash Memory for Firmware (2Mbits to 4Mbits)- To reduce risk Specification is not fixed! External Flash Memory for Firmware (2Mbits to 4Mbits)- To reduce risk Specification is not fixed! CMOS Technology - One Chip CMOS Technology - One Chip Package - BGA-96, TQFP-100/144, FPBGA-96 Package - BGA-96, TQFP-100/144, FPBGA-96 Include Voice Codec Include Voice Codec Full 3 SCO Support Full 3 SCO Support

RADIO ONLY RADIO ONLY Portable phones! Phones contain powerful processors and memory capable of providing baseband and control functions A cost-effective solution is often to provide a module containing only the radio function RADIO + BASEBAND RADIO + BASEBAND ….if phone processor does not have excess capacity to support Bluetooth TX data formatting and RX synchronization. RADIO + BASEBAND + MICROCONTROLLER + MEMORY RADIO + BASEBAND + MICROCONTROLLER + MEMORY For retrofit upgrade and unhosted applications - headsets, PC cards Appropriate to include crystal and voltage regulation also Types of Bluetooth Module

Baseband Flash Memory RF Rx Tx Ballun SWBPF VCO X-tal Regulator PA Low IF, Direct Conversion SiGe-BiCMOS - Low IF, Direct Conversion SiGe-BiCMOS - Firmware Baseband Firmware Baseband CODEC, MP3 Embedded Solution Host Host PCB Pattern PCB Pattern BPF 2 SW BPF 2 SW Antenna Solution Antenna Solution Interface (BlueRF) Bluetooth Module Trend

Ericsson Components Full Module/RF Module (PCB Substrate & LTCC) LucentPhilips '00/10 ~ 100 / '00/10 ~ 100 / Lucent RF Module (LTCC) Lucent- Ericsson Ericsson MACO ( ) Full Module/RF Module (ALIVH Substrate) PhilsarMitel '00/6 Sample '01/Q1 '00/6 Sample '01/Q1 ALPS ALPS Full Module (PCB) CSRCSR '00/5 Sample '00/12 '00/5 Sample '00/12 Taiyo Yuden Full Module (?) Silicon Wave Hitachi '00/Q3 Sample Murata Murata RF Module (LTCC) Lucent Lucent - Atmel Full Module (PCB) TemicAtmel Alcatel Full Module (LTCC) (One Chip) (One Chip) '01/Q1 '01/Q1 JTDC Full Module (PCB) PhilsarMitel? Full Module/RF Module CSR '01/Q1 '01/Q1 CSR MakerModule& PCB TypeRF ChipBB ChipStatus Bluetooth Module Maker

mm 12 mm PhilipsEricssonMurata Radio Module 14mm 10.2 mm Substrate : LTCC (Low Temperature Co- Fired Ceramic) Substrate : LTCC (Low Temperature Co- Fired Ceramic) Flip-Chip, Wire Bonded Flip-Chip, Wire Bonded BGA Packaging BGA Packaging Target Application : Mobile Phone, Full Module Target Application : Mobile Phone, Full Module (6mm x 8mm)

BlueRF TM Standard Interface for RF and Baseband Standard Interface for RF and Baseband Benefits Benefits - SoC designers need not to have expertise in RF design - SoC vendors will have confidence there will be multiple RF parts - RF designers will have one design for multiple SoC applications Receive Path - RxMode1,2,3 Receive Path - RxMode1,2,3 Transmit Path - One Configuration Transmit Path - One Configuration Control Register Interface - JTAG, DBus Control Register Interface - JTAG, DBus Contact to to get the specification Contact to to get the specification

Useful Web-Site for Bluetooth

Conclusion / Q&A Who will be win in Bluetooth Business? Who will be win in Bluetooth Business? Mobile Phone Air Time Loss - 3-in-1 Phone, WAP Kiosk etc. Mobile Phone Air Time Loss - 3-in-1 Phone, WAP Kiosk etc. Real Royalty Free Technology? Real Royalty Free Technology? Thanks for Listening! All presentation material will be hosted in my personal Homepage