Power Trench® MOSFETs in Dual CoolTM Package Internal Webcast Tomas Moreno Product Marketing Manager Computing LVCCC tomas.moreno@fairchildsemi.com June 22nd, 2010

Housekeeping Mute your phone please We will begin 5 minutes past the hour Questions: Chat Message through ATT Webcast interface We will answers chat questions at the end of every slide

Agenda Introduction Fairchild's Current Portfolio Market Trends Dual CoolTM Fairchild's Current Portfolio Key Features and Benefits Performance Competitive Landscape Competitive Analysis and Benchmarking Why Dual CoolTM Tools and Resources Available Questions and Answers

Industry Trends Increased Focus on Power Density Customers looking for ways to reduce board space and increase power density through better cooling techniques and technology integration. Customers looking for ways to improve system efficiency at light, medium and heavy loads. Increased Focus on Power Density Blade and Rack Servers and Smaller Desktop PCs Increasing proportion computing systems DC-DC converter applications requiring higher power density [small form factor]. Increased Focus on Efficiency Energy Star Initiative by the Environmental Protection Agency (EPA) Extended battery life requirements Reduction of Electricity Expenses in Servers by IT Departments

Applications with Thermal and Space Constraints Requiring Top Side Cooling Power Supplies VRM Modules Gaming Servers and Computing Class-D Audio

Low Voltage CCI and Computing Package Transitions Dual CoolTM 56 Dual CoolTM 33 5mm x 6mm 3.3mm x 3.3mm Power 33 PowerStage33/34 Thermal Enhancement PowerStage56 Power 56 3mm x 3mm x 0.8mm 3mm x 3mm 3mm x 4.5mm 5mm x 6mm 5mm x 6mm SO-8 5mm x 6mm x 1.75mm SuperSOT™-6 3.0m x 3.0mm ~30mm2 ~9mm2 Smaller Footprint

Power Trench® Dual CoolTM Features Top Side Cooling – Lower thermal resistance from the top of package Same land pattern as 5x6 and 3x3 PQFN – JEDEC standard Allows higher current and power dissipation: Replace 5x6 with 3x3 or replace two 5x6 with one! Benefits Highest power density for DC-DC applications Can be used with or without a heatsink, reducing the number of qualified components in the AVL Multiple suppliers without cross licensing requirements High degree of production commonality with standard PQFN packaging – low risk Applications DC-DC synchronous buck conversion Desktop, Notebook, and Server Telecommunications, routing, and switching

Power Trench® Dual CoolTM Heat sink Copper slug Junction (Die) QJC-S = 3.7ºC/W Clip (source) Leadframe (source) QJC-D= 3.0ºC/W Leadframe (drain) PCB

Power Trench® Dual CoolTM Direction of heat flow indicated by red arrows Heat sink Copper slug Junction (Die) Clip (source) Leadframe (source) Leadframe (drain) PCB

Why Fairchild has the Highest Power Density FCS 6/10 We have the smallest 30V-25V die in the industry! FCS 12/08 Enabling our customers to reduce board space, system cost and overall form factor. FCS charge balance device delivers the same Advantage from 25V to 150V.

“Industry Leading Silicon Now Coupled with Industry Leading Thermal Performance Packaging”

Agenda Introduction Fairchild's Current Portfolio Market Trends Dual CoolTM Fairchild's Current Portfolio Key Features and Benefits Performance Competitive Landscape Competitive Analysis and Benchmarking Why Dual CoolTM Tools and Resources Available Questions and Answers

Power Trench® Dual CoolTM Portfolio Today

Power Trench® Dual CoolTM Mid Voltage Roadmap   Amps RDS-on (m Ohm) nC Part Number Vds Id 10V 6V Qg Qgd FDMS86200DC 150V TBD 16.5 20 33 7.7 FDMS86101DC 100V 7.5 13 39 10.8 FDMS86300DC 80V 24 3 7.2 46 17 FDMS86500DC 60V 32 1.9 67 19 Sampling and Code S dates being worked on

Power Trench® Dual CoolTM * Minimum Copper Pad, Large Heatsink Up to 57% more power dissipation capability

Power Trench® Dual CoolTM Benchmark Boards Dual Cool 33HS Dual Cool 33LS Dual Cool 33HS Dual Cool 56LS Heatsink. Berquist Gap pad 2000, 15 mil Thermocouple via from the bottom

Power Trench® Dual CoolTM

Power Trench® Dual CoolTM Temperature HS 7mΩ 3.3x3.3mm2 Dual CoolTM FDMC3020DC 1.2mΩ LS 2.4mΩ 5x6mm2 Dual CoolTM FDMS2502SDC Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 2Phase CCM Controller: ISL6262A, Ambient Temperature

Power Trench® Dual CoolTM Temperature HS 7mΩ 3.3x3.3mm2 Dual CoolTM FDMC3020DC LS 2.4mΩ 3.3x3.3mm2 Dual CoolTM FDMC2512SDC Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 2Phase CCM Controller: ISL6262A, Ambient Temperature

Agenda Introduction Fairchild's Current Portfolio Market Trends Dual CoolTM Fairchild's Current Portfolio Key Features and Benefits Performance Competitive Landscape Competitive Analysis and Benchmarking Why Dual CoolTM Tools and Resources Available Questions and Answers

Summary of Fairchild vs. Competition Top Side Cooling Family Dual CoolTM Polar Pak DirectFETTM Dualcool CanPAKTM Release to Market Yes Portfolio Size 12 23 48 5 Approximate Form Factors Dual CoolTM33 (3.3x3.3mm2), Dual CoolTM56 (5x6mm2) 5x6mm2 L (7x9mm2), M (5x6mm2), S (3.8x4.8mm2) Product Breakdown 3x3 (5), 5x6 (7) 5x6 (23) L (5), M (28), S (15) 5x6 (5) M (7), S (5) Schottky Body Diode (SyncFETTM) on Synchronous FETs 8 1 6 Common Footprint with PQFN (AKA PowerPak, PowerXX, SuperS08, etc) No Lowest RDSON @10V in 5x6mm2 0.99mΩ 1.2mΩ 1.3mΩ 1.7mΩ

Power Trench® Dual CoolTM Competitor: IR QJA (ºC/W) Max Power in Typical Application (50ºC temp rise) Power Density mW/(mm2) Dual CoolTM 33 (Min Pad no Heat Sink) 80 0.63W 50 DirectFET Small Can 94 0.53W 20 (Min Pad with Heat Sink) 20.7 2.42W 210 18.4 2.72W 140

Why is Dual CoolTM Power Density Leader? Power Trench® Dual CoolTM Competitor: IR Why is Dual CoolTM Power Density Leader? Board Solderable Component Area % Difference Solderable Area Total Component Area (max) Power33 4.54mm2 The new standard 11.56mm2 IRF6710 3.04mm2 >33% Less! 19.16mm2

Power Trench® Dual CoolTM Competitor: IR Key HS loss factors are Qg, Qgd, Ciss and Rdson_4.5V. FSC part better on all key metrics. Key LS loss factors are Rdson_4.5V, Coss, and Qrr. FSC part equivalent or better on all key metrics. FSC total solution component area is smaller.

Power Trench® Dual CoolTM Benchmark Boards Dual Cool 33HS Dual Cool 33LS SQ HS M1LS S1 HS SQ LS S1 HS M1 LS Thermocouple via from the bottom Dual Cool 33HS Dual Cool 56LS 5 internal evaluation boards built and tested Heatsink. Berquist Gap pad 2000, 15 mil

Power Trench® Dual CoolTM Competitor: IR Temperature Dual CoolTM33 HS and LS vs Direct FET Small can HS + Medium Can LS IRF7610S + IRF7695M 75ºC @ 25A FDMC3020DC+ FDMC2512SDC 75ºC @ 25A Fairchild Solution delivers the same temperature but in a much smaller footprint. FDMC3020DC+ FDMC2512SDC 58ºC @ 20A IRF7610S + IRF7695M 58ºC @ 20A Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 1Phase CCM, Controller: ISL6262A.

Power Trench® Dual CoolTM Competitor: IR Efficiency Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 1-Phase CCM Controller: ISL6262A.

Power Trench® Dual CoolTM Competitor: IR 25A Control and Synchronous Solutions 30A Control and Synchronous Solutions S 7.2mΩ M Dual CoolTM 3x3 7.2mΩ Dual CoolTM 3x3 7.2mΩ M 2.4mΩ M Dual CoolTM 5x6 1.2mΩ Dual CoolTM 3x3 2.4mΩ Component Area:49mm2 Component Area:21.5mm2 Component Area:62mm2 Component Area:41mm2

Dual CoolTM Competitive Landscape Suppliers Offering 3.3x3.3mm2 Top-Side Cooling Solutions or Smaller* Key Suppliers Offering Top Side Cooling Solutions Suppliers Offering PQFN - 3x3mm2 and 5x6mm2 * As of June 2010

Dual CoolTM Standard Footprint PolarPak DirectFET Standard Footprint (JEDEC) YES NO Ease of Placement and Routing Common footprint as Standard PQFN and MLP Suppliers Fairchild, TI ST, Vishay IR, Infineon

Power Trench® Dual CoolTM Competitor: Texas Instruments - Ciclon Fairchild’s advantage over TI’s Dual Cool is our Power Trench® Silicon. Advantages and features of our Silicon over TI are: Smallest Silicon (lowest RSP)  Yields lower RDSON and higher power density Lower Output Capacitance  Delivers higher peak and light load efficiency Monolithic Schottky body diode  Lowers reverse recovery losses – higher efficiency Shielded gate technology  attenuates switchnode ringing Lower Qrr  Increases overall efficiency

Power Trench® Dual CoolTM Competitor: Texas Instruments - Ciclon 50% Lower Output Capacitance  Delivers higher peak and light load efficiency Lower Qrr  Increases overall efficiency Qrr Loss:

Power Trench® Dual CoolTM Competitor: Texas Instruments - Ciclon PowerTrench® Shielded gate technology  attenuates switchnode ringing Smallest Silicon (lowest RSP) Lowest RDSON 3x3 PQFN at TI is CSD16323Q3  5.5mΩ Max @ 4.5VGS Fairchild PowerTrench® Shielded-Gate Lowest RDSON 3x3 PQFN at Fairchild is FDMC2512SDC and FDMC7570S  2.9mΩ Max @ 4.5VGS TI – Ciclon Lateral Process

Agenda Introduction Fairchild's Current Portfolio Market Trends Dual CoolTM Fairchild's Current Portfolio Key Features and Benefits Performance Competitive Landscape Competitive Analysis and Benchmarking Why Dual CoolTM Tools and Resources Available Questions and Answers

Tools and Resources Evaluation boards: Available WW29 Website : Going live in WW30: www.fairchildsemi.com/dualcool Application Note White paper Datasheets and availability Press Release and Podcasts Product Line Contacts: Computing Applications: Tomas Moreno Starry Tsai Naveed Ahmad Jerry.C.Chen – Asia Pacific Consumer, Comms, Industrial Applications Mike Speed Internal Computing LV CCC Google Site: https://sites.google.com/a/fairchildsemi.com/computing-lvccc/

Agenda Introduction Fairchild's Current Portfolio Market Trends Dual CoolTM Fairchild's Current Portfolio Key Features and Benefits Performance Competitive Landscape Competitive Analysis and Benchmarking Why Dual CoolTM Tools and Resources Available Questions and Answers