1. Power Trench® Dual CoolTM

2. Power Trench® Dual CoolTM
Features
Top Side Cooling – Lower thermal resistance from the top of package
Same land pattern as 5x6 and 3x3 PQFN – JEDEC standard
Allows higher current and power dissipation
Benefits
Highest power density for DC-DC applications
Can be used with or without a heatsink, reducing the number of qualified components in the AVL
Multiple suppliers without cross licensing requirements
High degree of production commonality with standard PQFN packaging – low risk
Applications
DC-DC synchronous buck conversion
Desktop, Notebook, and Server
Telecommunications, routing, and switching

3. Where Do We Target Dual CoolTM
Any application that utilizes heatsinks, heatpipes, or any other form of top-side cooling method.
Any application where DirectFET (CanPak) type MOSFET packaging is present
Any other thermally and space constrained application

4. Power Trench® Dual CoolTM
Heat sink
Copper slug
Junction (Die)
QJC-S = 3.7ºC/W
Clip (source)
Leadframe (source)
QJC-D= 3.0ºC/W
Leadframe (drain)
PCB

5. Power Trench® Dual CoolTM
Direction of heat flow indicated by red arrows
Heat sink
Copper slug
Junction (Die)
Clip (source)
Leadframe (source)
Leadframe (drain)
PCB

6. Power Trench® Dual CoolTM
Internal Construction

7. Power Trench® Dual CoolTM
Portfolio as of 10/6/2010

8. Power Trench® Dual CoolTM
Temperature HS
7mΩ
3.3x3.3mm2 Dual CoolTM
1.2mΩ LS
2.4mΩ
5x6mm2
Dual CoolTM
Conditions:
12V IN, 1V OUT,
Fswitch =~280KHz,
Lout = 0.36uH,
Mode = 2Phase CCM
Controller: ISL6262A,
Ambient Temperature

9. Power Trench® Dual CoolTM
Temperature
IRF7610S + IRF7695M 25A
IRF7610S + IRF7695M 20A S
7.2mΩ M
2.4mΩ
Component Area:49mm2
FDMC3020DC+ FDMC2512SDC
20A
FDMC3020DC+ FDMC2512SDC
25A
Dual CoolTM 3x3
7.2mΩ
Dual CoolTM 3x3
2.4mΩ
Component Area:21.5mm2
Conditions: 12V IN, 1V OUT, Fswitch =~280KHz, Lout = 0.36uH, Mode = 1Phase CCM, Controller: ISL6262A.

10. Why is Dual CoolTM Power Density Leader?
Power Trench® Dual CoolTM
Competitor: IR
Why is Dual CoolTM Power Density Leader?
Solderable Area
Bottom Side of Package
Board Solderable Component Area
% Difference
Solderable Area
Total Component Area (max)
Power33
4.54mm2
The new standard
11.56mm2
IRF6710
3.04mm2
>33% Less!
19.16mm2

11. Evaluation Board Support
Three Evaluation Boards on Sales Center:
HS: 5x6 LS: 5x6
HS: 3x3 LS: 5x6
HS: 3x3 LS: 3x3

13. Additional Resources for Dual CoolTM
Sales Center (to become available at time of launch)
Left Navigate to: Market Solutions –> Computing –> Dual Cool
Product overview
Application note
Evaluation Boards
Customer Presentation
Podcast
External web page (to become available at time of launch)
General overview
Complete list of available resources
Application Note (Dennis Lang
Video (Dennis Lang)
White Paper (Art Black)
Other
Press release in WW43
White papers (in Q1’11)
Preliminary Datasheets (Contact Tomas Moreno)

14. Power Trench® Discrete PQFN Portfolio

15. Power Trench® PQFN Discrete Power33 Portfolio as of 10/6/2010
High Efficiency MOSFETs for POL and Multi-phase Applications

16. Power Trench® PQFN Discrete Power56 Portfolio as of 10/6/2010
High Efficiency MOSFETs for POL and Multi-phase Applications

17. Q & A