Manufacturing Processes

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Presentation transcript:

Manufacturing Processes Printed Circuit Board Assembly (PCB): Must specify or account for all components mounted into, onto or attached in some way to a printed circuit board as well as test for same Electrical Components: Passives, IC’s, Optical, ElecMech, ElecMag, Connectors, Switches, Sensors, Protection Devices, etc Mechanical Components: Heat Sinks, Thermal Grease, Pullers, Stiffeners, Mounting Hardware, Sensors, Protection Devices, etc High Level Assembly (HLA): Must specify or account for all elements or parts of an assembly level including testing Electrical Elements: PCB’s, Cables, Harnesses, Fans, Power Supplies, Sensors, Protection Devices, User Displays, Switches, etc Mechanical Elements: Enclosures, Feet, Standoffs, Card Guides, Gaskets, Sealants, Fasteners, Hardware, etc

Printed Circuit Board Assemblies Printed Circuit Boards (PCBs): Convenient form of interconnecting electrical components using industry standard attachment processes 3 Basic Types of PCB-Component Assembly Technology Thru Hole (TH) Surface Mount (SMT) Micro-electronic Multi-Chip-Module (MCM) 3 Basic Types of PCB substrate systems (fabs) Rigid epoxy including FR4, BT and others Ceramic, Alumina (Al203), AlNi or other exotics Flexible Substrate (flex circuit) Single, Double and Multi-Layered

Basic Photo-Etch PCB Mfg Process Plated Through Hole PCB Cross Section

Cu PCB Trace Width & Depth IPC Current Capacity Limitations

Cu PCB Trace Conductor IPC* Spacing vs Voltage Summary (*Simplified)