Detector module development for the CBM Silicon Tracking System Anton Lymanets for the CBM collaboration Universität Tübingen, Kiev Institute for Nuclear.

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Presentation transcript:

Detector module development for the CBM Silicon Tracking System Anton Lymanets for the CBM collaboration Universität Tübingen, Kiev Institute for Nuclear Research KINR

STS terminology A. Lymanets - Detector module development for the CBM STS - DPG Dresden station 1 station 2 station 4 station 6

Module concept A. Lymanets - Detector module development for the CBM STS - DPG Dresden sensor 1024 strips 58 μm pitch microcable multilayer Module design is driven by the material budget and noise requirements. front-end board 8 chips with 128 channels each To be mounted support structures carbon fibre

Sensor + cable A. Lymanets - Detector module development for the CBM STS - DPG Dresden strips ± 7.5 stereo angle 58 μm strip pitch (62 62) mm 2 size Multi-layer cable mock-up Cable structure Wide cable is to be connected to a sensor Kapton mesh Kapton Al

Sensor + cable interconnection A. Lymanets - Detector module development for the CBM STS - DPG Dresden Daisy-chained sensors Sensor-to-cable connection Mechanical and handling study Experience: alignment of a cable with 1024 strips is difficult! Connection technology: TAB bonding L-shaped legs for sensor mounting Manufactured in Kharkiv (SE SRTIIE) Talk: M. Singla HK 35.7

Sensor + cable prototypes A. Lymanets - Detector module development for the CBM STS - DPG Dresden See: T. Balog HK 35.8 Performance evaluation of a module prototype Compatible with current n-XYTER front-end boards with ERNI connectors 30 cm Goal: demonstrate the cable concept, TAB bonding, long cables channels (double-sided readout) Different lengths

New module assembly concept Many narrow cables (128 channels each) Same multi-layer structure Mitigate alignment, yield and testability risks A. Lymanets - Detector module development for the CBM STS - DPG Dresden

Sensor quality assurance Visual inspection Electrical characterization Current-voltage Capacitance-voltage behavior Interstrip parameters: resistance and capacitance Channel yield (coupling capacitors, PN-junctions) Double-metallization Shorts and breaks A. Lymanets - Detector module development for the CBM STS - DPG Dresden double-sided sensors have to be tested: probe station, long term stability, etc…

Front-end electronics A. Lymanets - Detector module development for the CBM STS - DPG Dresden FEE prototype base on n-XYTER chip STS front-end board concept STS-XYTER chip 8 chips (128 channels each) Chips are wire-bonded to the PCB Readout chips have to be tested individually before FEB assembly.

Module assembly steps A. Lymanets - Detector module development for the CBM STS - DPG Dresden Tested chip + tested cable Readout test only after full assembly every component has to be tested Need quality assurance, logistics and tooling for module production TAB bond both sensor sides using fixtures (non-reworkable) Nest chips in a FEB, Wire bond to the PCB

Low-mass support structures A. Lymanets - Detector module development for the CBM STS - DPG Dresden Mechanical study: carbon fibre support ultra-light: mass 14 g/m mechanical precision within 100 μm maximal rigidity

Summary Module hierarchy developed Quality assurance tasks Sensors Cables Front-end-electronics Tooling and procedures are under development Fixtures for quality assurance and module assembly Quality assurance for >1000 modules will be required QA sites in Germany (GSI, Tuebingen) and Russia (Dubna) A. Lymanets - Detector module development for the CBM STS - DPG Dresden