HPS Motherboard Electronic Design

Slides:

Advertisements

Similar presentations

1 Copyright Pericom Semiconductor 2007 Last Slide PERICOM CONFIDENTIAL INFORMATION SATA&SAS ReDriver Application Guide FAE Training Lingsan Quan Application.

Advertisements

SQUARE PAD PCB DESIGN Elizabeth Starling, Jerry Collins Florida Institute of Technology High Energy Physics Lab A January 26 th, 2015.

Layer 0 Grounding Requirement in terms of noise performance Grounding/Shielding studies with L0 prototype Summary Kazu Hanagaki / Fermilab.

Ecal Connection board and Motherboard design. Connection Board Motherboard.

1 Module and stave interconnect Rev. sept. 29/08.

Printed Circuit Board Design

Daniel Miller Joe Quesada Justine Lazo

Production and Testing Status V. Fisch, T. Kiss, T. Tölyhi, V. Veszprémi BPIX Supply Tube Electronic Boards.

LSU 06/04/2007Electronics 81 CAD Tools for Circuit Design Electronics Unit – Lecture 8 Schematic Diagram Drawing Etched Circuit Board Layout Circuit Simulation.

STATUS OF THE CRESCENT FLEX- TAPES FOR THE ATLAS PIXEL DISKS G. Sidiropoulos 1.

Differential Signals EECS 713 Project by Jay Fuller :) What are they? When to use them Traces, connectors, terminations, etc.

VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.

Subject: Mixed Connectors !!! ? What is it ? Why ? Provider? Samples….

The printed circuit board (PCB) design

WP7&8 Progress Report ITS Plenary meeting, 23 April 2014 LG, PK, VM, JR Objectives 2014 and current status.

Simple Layout Class 2 zzz 2011/12/16

Choosing the right preamplifier/discriminator comparing advantages and drawbacks : NL-277-L (Nanometrics), ASD-8 (Cern) and MAD4 (INFN Italy) Our favorite:

1 HV Bias Power Patch Panel for Scintillator KLM Gerard Visser Xiaowen Shi overview Schematics layout Parts.

“CAE-CAD-CAM” TECHNIQUES FOR DEVELOPMENT OF ELECTRONIC MODULES Faculty of Electronics and Information Technology University “Politehnica” of Bucharest.

Current ILC work at Fermilab Electrical Engineering Dept.

CALICE meeting Prague 2007, Hervé MATHEZ 1 DHCAL PCB STUDY for RPC and MicroMegas (Electronics recent developments for the European DHCAL) William TROMEUR,

Belle-II iTOP readout: production HV board and front board iTOP Electro-opto-mechanical working group Virginia Tech, 7/3/2013 Gerard Visser Indiana.

Dimensions of the PDM frame: 167mm x 167mm x 28.7mm.

CVD PCB, first steps. 15 mm 25 mm Chip area. No ground plane underneath the chip. Bulk isolated => only one ground line Power lines Connector: 11,1mm*2,1mm:

1 Module and stave interconnect Rev. sept. 29/08.

Part II: Using PCB Layout Software – Custom Component Libraries

1 E906 Pre-Amplifier Card 2009/10/07. 2 E906 Wire Chambers Station1 MWPC: –build a new E906 MWPC. –4500 channels in total. Station2 DC: –recycle old E866.

General Purposes Input/ Output Daughter board for Univ Eval Rev B Julien Cercillieux University of Hawaii

Figure 1: ICD Single Channel Block Diagram Schematic PMT High Voltage Supply (see Figure 4 & 4a) LED Pulser PMT Calibration (see Figure 6) ICD Scintillator.

HV connection for a Common GEM foil design Aiwu Zhang

27 th September 2007AIDA design meeting. 27 th September 2007AIDA design meeting.

Some questions:  In which order cables will be put ?  Who, where will put PS signal cables in bundles ?  Which kind of cable binders: velcro or panduit.

1 PreFPIX2 Inner board and test beam triggering Gabriele Chiodini Fermilab - Jan 07, 02.

EC_ASIC drawing (1) ASIC BASIC FASIC D 68 pi ns ASIC A 68 pi ns ASIC C ASIC E 120 pins ABCDEF 68 pi ns 68 pi ns 68 pi ns 68 pi ns.

Trace connecting two pads! More than 45 degree bends Traces too close together Rule of thumb: traces at least 40 mil apart.

HCAL – Integration Plans Mathias ReineckeHCAL – Main meeting Introduction 2.HCAL Base Unit (HBU) - Update 3.Testboards 4.Light Calibration System.

TCSP Presentation #3 Team 14 SPOT DASH. Schematics 3 Pages 3 Pages Page 1: Buttons, LEDs, sensors related circuits Page 1: Buttons, LEDs, sensors related.

1 4 PCB: LEFT TOP 115 channels, LEFT BOTTOM (115), RIGHT TOP (106), RIGHT BOTTOM (106). For LEFT TOP board 115 channels we have: 115 smd connectors (AMP.

Technology Road Map Imaging And Etching Trace / Space Outers * Current

E-Cal Readout Boards - 8 Boards total -Design & Fabrication at Jlab - Assembly at Orsay Nick Nganga HPS Collaboration Oct Jlab.

The HULK Luke Johnston Ethan Byler Dhruv Lamba Andy Robison.

Front End Board (16 channels) Superlayer Cross Section Frontend Enclosure HV cap board HV cap Board Signals from chamber wires go to HV cap board to be.

Pads Assembly- Zamiatin Si Detector – ELMA/Dubna/MSU Interface Board – dubna/baskagiv Carrier Board -dubna/baskagiv Pre-Amp –sleniov(analog) Basilev-dubna.

1 VELO integration INTEGRATION, december 05 OUTLOOK : - PARTS - 3D MODEL - LV & HV CABINETS INTEGRATION - LV CABLING - RPT CABLING.

End-of-stave region. 2 Space Z-dimension is critical –Keep gap small (might help getting rid of stubs) Edge of last barrel silicon (at corner) is 1277.

Proposal for LST-based IFR barrel upgrade Roberto Calabrese Ferrara University Workshop on IFR replacement, SLAC, 11/14/2002.

9/18/2003Safety Review Electronics Electronics design LV, HV power supply Fusing Heat.

TRIO-CINEMA 1 UCB, 2/08/2010 CINEMA Solar Array Design Review Yashraj Khaitan David Glaser Kevin Jenkins Chris Pasma Space Sciences Laboratory University.

1 LAPPD Team meeting 6/10/2010 Ossy Siegmund, Experimental Astrophysics Group, Space Sciences Laboratory, U. California at Berkeley Integration of Front-End.

Belle-II iTOP HVB Status SLIDE FOR INCLUSION IN GARY’S PRESENTATION Belle II General Meeting Gerard Visser Indiana University CEEM 11/13/2012.

The printed circuit board (PCB) design §PCB design is part of the design process of a product in electronics industry. §PCB is a piece of insulating plastic.

Drift Chamber Review Jefferson Lab 6-8 March 2007 CLAS12 Drift Chamber Electronics R. Chris Cuevas Group Leader -- Fast Electronics Jefferson Lab Physics.

2 March 2012Mauro Citterio - SVT Phone meeting1 Peripheral Electronics Some updates Mauro Citterio INFN Milano.

Development of T3Maps adapter boards

Calorimeter Mu2e Development electronics Front-end Review

High-Speed Serial Link Layout Recommendations –

Update of MVD services and requests

Daniel Miller Joe Quesada Justine Lazo

ECE 3301 General Electrical Engineering

ob-fpc: Flexible printed circuits for the alice tracker

EC board for JEM-EUSO Design investigations

Electronics for the E-CAL physics prototype

University of Wisconsin-Madison / SSEC

Automotive Hotrod and Wettable Flanks Packaging Advancements

Assembly order PCB design

High-Speed Serial Link Layout Recommendations –

Outer Endcap External Bus tape

RPC FEE The discriminator boards TDC boards Cost schedule.

From Prototype to Production with Eagle PCB Design

The NEW Anatomy of NIMROD Originally from S. Wuenchel, Z, Kohley and L

Presentation transcript:

HPS Motherboard Electronic Design 4 PCB (115, 115, 106, 106 channels each). For TOP LEFT board 115 channels we have: 115 smd connectors (AMP 10 pin) for preamp very similar to previous version (pin slightly smaller). It is the same of FT-Cal motherboard.(next slide) 15 TE signal connectors from 16 pin each, equal to previous version. (see page 3) 2 HV connectors (15 pin) DSUB 750V, 5A, trough hole different to previous for a easier routing. 1 LV connectors (6 pin). We can use the same HV grouping. We can use the same cable as discussed with Stepan Stepanyan.

AMP 10pin smd connector

TE 16pin connector

HPS Motherboard Design Block of 10

HPS Motherboard Design 115 top left

HPS Motherboard Layout Design For Layout design we have, probably, 10 layers. (3 signals + 1 for High Voltage + 1 fan-out + 5 GND). Layout specifications: 115 signal traces with 50 Ohms impedance. Signal: 0.2 mm line width and 0.2 mm min. spacing. HV: 0.6 mm line width and 0.9 mm min. spacing. Ground ring between two signals as FT-Cal project.

Some Questions 1)We assume preamp connection is the same of FT-Cal. Is it true? 2)Preamp positioning. Where is located the HV pin respects yours picture? Last pin of right? Is the same for top and bottom part? 3)Thickness between 3 or 4 mm for you. I think a 2.5 mm. Any problems? 4)Link the tin ground around the preamps holes to an internal ground layer with a via. Is it necessary? 5)You want put a tin ground without solder (circular area diameter 10mm) around each fixing hole. Why?