1. Production and Testing Status V. Fisch, T. Kiss, T. Tölyhi, V. Veszprémi BPIX Supply Tube Electronic Boards

2.  The followin PCB of Slot 1 are already produced  POH Motherboard (POH-MB)  DOH Motherboard (DOH-MB)  Aadapter Board (AB) L1&L2, AB L3&L4  4 sets (4 pcs /each): Budapest, Aachen, Zürich, CERN.  Connector Boards production stil have an issue  Changed company two times  Only CB L3 and L4 have been submitted now to Exception PCB  Now Eception PCB is looking for a right production plant or partner to be involved  Alternative solution would be a fully polyimid board with exactly the same thickness.  Flex cables are designed will be produced at Würth Elektronik  We waited for the Adapter Boards the precise length verification  have to be ready together with the CBs Status of the Prototypes

3. DOH-MB, DOH-MB, DOH, and POHs mounted together

4. Testing of the Prototypes

5. DOH Motherboard AB L1&L2 - bottom AB L1&L2 - top DOH-MB v1.2

6.  4 DOH-MB have been produced  At the time of testing we had not had the POH-MB poduced yet  The DOH-MB boards were first tested in themselves, powered up w/o the POH-MB  For all 4 DOH-MB (8 fast I 2 C channels) we have the following test results  Bringing up the boards  No shorts, power consumption are the same for all boards  Configuring of the ASICs (throgh the slow I 2 C chain)  We can access the two ASICs (PLL, DELAY25)  both ASICs respond with ACK,  we can enable/disable the DELAY25 outputs  we can set the delay values  Later these tests were repeated with a POH-MB as a carrier: voltage supply and I 2 C configuration are still OK Test Results of DOH-MB

7.  Functional tests  The DOH-MB PLL locks to a 40 MHz input bit stream with embedded trigger bits (TTC) generated by an FPGA board.  we have the decoded clock (CLK) at the DOH-MB output,  we have the decoded trigger (CTR) pulses at the DOH-MB output,  we have the fast I2C data (SDA) at the DOH-MB output, and we also have the regenerated clock for the return data (RCK) at the mDOH input.  Summary  No PCB or assembly issue  We would like to keep 2 pcs for further testing – see next slide  1 board to Zürich, 1 board to Aachen (if needed) Test Results of DOH-MB

8.  The following tests have not been carried out yet  Testing the signal integrity of the fast I2C signals through the entire signal chain (from DOH-MB – flex cable - AB – CB)  For L3&L4: two PCB routing options (selectable by jumper resitors) can be tested  Single long chain for L3 & L4 with one driver (1+1 Gatekeepers in total per DOH-MB)  Two chains for L3 & L4 with two drivers (1+2 Gatekeepers in total per DOH-MB)  Jitter issue  Use of QPLL is investigated (radiation tolerance?)  new components placement and routing of the DOH-MB is needed  DOH-MB v2  The POH-MB was modified in the last minute that it can accomodate a DOH-MB v2 (lock signals to CCU ring)  We can/must start to work on a DOH-MB v2 before having the test results and decision on the use of QPLL DOH-MB - Pending Tests

9. Test Results of POH-MB  4 POH-MB have been produced  Latest modifcations  Screw holes placement and implementation  2 reserved signals (LOCK) between DOH-MB and CCU-ring  For all 4 DOH-MB (8 fast I2C channels) we have the following test results  Connectivity test  This time measured manually line by line  All 4 boards passed the tests  Possible issue: tracks very close to POH screw holes  These boards always have to be handled with extra care (not to be bended)!  Pending tests  fast data signal quality measurements at the end of lines(at POH inputs). We would keep 1 board now.  1 board to Zürich, 2 boards to Aachen (?)

10. Adapter Boards AB L1&L2 - bottom AB L1&L2 - top AB L3&L4 - bottom AB L3&L4 - top AB L1&L2AB L3&L4

11.  4 - 4 AB L1&L2 and AB L3&L4 have been produced  We have the following test results  Connectivity test  This time it was measured manually line by line  All AB L1&l2, and 3 / 4 of the AB L3&L4 passed the tests  On 1 board we have a short circuit, not found yet not even with a microscope  it can be either under one of two connectors or inside the PCB  Low voltage (V d and V a ) voltage drop  Important quantitative parameter of the AB and CB boards (just like of the Extension Boards and modue cables): How we use up the voltage drop budget?  See results in next slides  Pending measurements  No (Maybe more precise measurement of the GND plane resistance)  AB boards have to be used in other pending measurements (fast I2C signal quality and Sector C-D entire voltage drop) -> We keep 1+1 of them.  1+1 boards to Zürich, 2+2 boards to Aachen (?) Test Results of AB L1&L2 and AB L3&L4

12.  AB and CB voltage drop simulations  In the PCB design phase, post-layout simulations were made for the forward V a and V d connections  iterating the „layout and routing” to minimize drop  Common ground plane for the return path: resistance was estimated  Both copper thickness, trace (plane) widthes, no. of layers (GND planes) are all limited  We think that with the design efforts we went just to the wall.  AB and CB voltage drop measurements  Originally we wanted to measure it through the AdpterBoard – ConnectorBoard chain (or even a module cable included), and this is what we have to do (will do) as soon as we have all the boards.  Now we measured the AdapterBoards only with the aim of verifying the simulations  To get the whole voltage drop picture now, we have to rely on a mixture of mesuremenst, simulations, and estimations, however the AdapterBoards measurements can verify/correct the simulation results. Sector C: V a nd V d voltage drop simulations and measurements

13.  AB and CB voltage drop simulations  In the PCB design phase, post-layout simulations were made for the forward V a and V d connections  iterating the „layout and routing” to minimize drop  Common ground plane for the return path: resistance was estimated  Both copper thickness, trace (plane) widthes, no. of layers (GND planes) are all limited  We think that with the design efforts we went just to the wall.  AB and CB voltage drop measurements  Originally we wanted to measure it through the AdpterBoard – ConnectorBoard chain (or even a module cable included), and this is what we have to do (will do) as soon as we have all the boards.  Now we measured the AdapterBoards only with the aim of verifying the simulations  To get the whole voltage drop picture now, we have to rely on a mixture of mesuremenst, simulations, and estimations, however the AdapterBoards measurements can verify/correct the simulation results. Sector C: V a nd V d voltage drop simulations and measurements

14. AB L1&L2 AB L3&L4

15. Sector C: V a nd V d voltage drop

16. Pending Issues  CB boards production to be completed soon  Power cables to be designed and produced  Verfication of the implemented delays vs. the detector needs measure with the actual cable length distrubution  Only minor changes is possible  For the final production we need a scheduling for the deliver of the boards (input from Lea till the beginning of summer)