PXD Summary Tests PXD9 Pilot Production ASICs Components Plans: - beam test - production Contributions from: Bejing, Bonn, Desy, Giessen, Göttingen, Heidelberg, HLL, Karlsruhe, LMU, Mainz, MPP, Prague, Tabuk, TLU, Valencia H-.G. Moser, 18th B2GM, June 2014

Pilot Run Sensor Production 3 hot wafers (W30, W35, W36) ware advanced in a pilot run First tests of phase II (and III) W30 finished (copper, thinning, cut) W35 was held back for wafer level tests: ready for copper W36 had problems with copper: to be repeated Results (shorts) after Al2, before copper: W30: no change after copper 13 of 18 chips usable Can construct 2 inner ladders and 4 outer ladders

Drain current spread Worst case: 24µA

High Speed Links

Noise measurements µfit=0.49ADU W31-3 µfit=0.61ADU

Preliminary Matrix (64x32) results 10.09.2015

ASIC optimization stuck toggling comparator offset

Tests with Hybrid 5 e.g. DCD <-> DHP communication

Boundary Scan Test Tests connectivity of Bump bond pins -Within a chip -From chip to chip Tests possible with needle card (no kapton)

Needle Card Tests First opportunity to tests sensor & ASIC (before Kapton assembly) First results very promising given that good contact can be achieved essentially the full functionality of a module can be tested

ASIC Status and final submission ASIC review in July

Outcome Switcher: faster rise time termination resistors bump pad changes DCD: improve digital data transmission fix JTAG revised gain and pedestal settings understand missing codes

Schedule

SMD assembly Original plan: SMD assembly in Valencia using solder spitting (PACTECH) – failed Backup: use Finetech machine at HLL using a dispenser

Status:

DHE/DHC Trigger card for gated mode tests Controls trigger / veto / laser Optical links Use Glenair transmitters (rad hard) Offer: 52 k€ (30k€ by MPP) Order in ~ 2 weeks

DATCON Concentrator board (15 to be ordered) DHE for tracking and ROI generation (3 to be produced) Custom backplane (ordered) SFP extension card (5 produced)

PS & Services 15 L2bwd produced L1bwd designed Production after test of pilot Power cables: prototypes produced and tested Ready to start procurement

MARCO (Cooling) MARCO presently used at DESY for thermal mock-up Problem: pump wear leads to frequent clogging of filters Will be replaced by a new, more reliable pump (tested!) Pump was bought by Tabuk and will be delivered soon MACRO to be used: Thermal mock-up Ladder assembly at MPP (?) SVD/PXD integration and tests at KEK before installation (pending CERN)

COSMIC Ray Setup Cosmic ray setup for tests of PXD & SVD after integration at KEK B1 Scintillator panels & trigger logic Geometry presently optimized by Tabuk Still in work (remove bias of cosmic MC generator)

Beam Tests PXD only beam test at DESY in November b) Combined PXD/VXD beam test in April 1016 use 2 ladders PXD9 pilot with new ASICs main emphasis on system aspects

Conclusions Sensor: First wafer of the pilot run fully processed, 2 more wafers will follow ASICs: Review before final submission in July after some additional work: DHP and Switcher are submitted DCD will be submitted in September expect chips to be back in January Module Assembly: First PXD9 module assembled (up to Kapton)! Tests: Many tests done with various setups Important results (used for ASIC review & follow up) Still a lot of optimization to be done Important: be ready for PXD9 tests Plans: Test PXD9 pilot modules Series production of sensors to start in December Test final ASICs in January Assembly pilot modules with final electronics in March (combined beam test and BEAST II)