Hybrid Issues

Hybrid Panel Bonding Shape/layout Traceablility Metrology No bond off/pull test areas on hybrid Add >2x2 mm2 area in 130 nm hybrids Solder on pads Fixed solder resist, only pick-and-place SMDs, moved SMDs away from bonding areas in 130 nm hybrids Bonding clearances Changed solder resist Top metal contamination Changed etch order so top layer last Traceablility Bad numbering of panels Added numbering to new panels Need id # on hybrid Add scratch area to 130 nm hybrids, big enough for bar code Shape/layout Panel not flat Need to add metal back to FR4, add 2 more side holes in 130 nm hybrids Tabs not flat after reflow, ends don’t vac down Metalized , lengthen, wider tabs needed Mis-drilled alignment holes Added specs/modified panel Can’t glue full panel at once Need to increase hybrid spacing, put locating pin inline for 130 nm hybrids Vacuum leakage from extra mounting holes Need to know what people use Metrology Location for metrology, fiducial markers Need suggestions to add to 130 nm panel, add touchdown points on hybrid

Hybrid toolings Hybrid glue stencil 8 way vacuum jig Remove mounting holes for leak improvement Need more screw down points for panel edge Does it need cooling, like secondary cold plate? Or are fans sufficient? ~50 W per panel, “cold” plate (peltier?) could be used in burn in for accelerated ageing Hybrid pickup tooling Hard to keep edges of ESD plastic clean, hard to get ground flat Need to change plastic faces with grindable metal. Is ESD an issue? Hard to see if pins all the way down Could connect landing pads and add simple continuity test