1 Fabrication techniques (only very brief overview) Planar waveguides –Deposited thin films sputtering deposition from solutions polymerization CVD –Diffusion.

Slides:



Advertisements
Similar presentations
MICROELECTROMECHANICAL SYSTEMS ( MEMS )
Advertisements

FABRICATION PROCESSES
Deposition and Etching of Thin Films Nathaniel J. C. Libatique, Ph.D.
Quantum Well Structures and Fabrications A PRESENTATION OF THE DIFFERENT QUANTUM WELL STRUCTURES AND THEIR FABRICATION PROCESS BY TIM KOSANKE AND BLAKE.
Ch.1 Introduction Optoelectronic devices: - devices deal with interaction of electronic and optical processes Solid-state physics: - study of solids, through.
For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN © 2002.
Another “Periodic” Table!. Growth Techniques Ch. 1, Sect. 2, YC Czochralski Method (LEC) (Bulk Crystals) –Dash Technique –Bridgeman Method Chemical Vapor.
EBB 323 Semiconductor Fabrication Technology
Integrated Optic Components  Passive: Requires no input power, like directional couplers, beam splitters, isolators, filters, lenses and prisms  Active:
ECE 491 Meeting PVD Synthesis and electrical characterization of «
Design and Implementation of VLSI Systems (EN1600) lecture04 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Sedra/Prentice.
Device Fabrication Technology
Optical fiber waveguids
MSE-630 Dopant Diffusion Topics: Doping methods Resistivity and Resistivity/square Dopant Diffusion Calculations -Gaussian solutions -Error function solutions.
The Physical Structure (NMOS)
Design and Implementation of VLSI Systems (EN0160) Sherief Reda Division of Engineering, Brown University Spring 2007 [sources: Sedra/Prentice Hall, Saint/McGrawHill,

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #5.
Thin Film Deposition Prof. Dr. Ir. Djoko Hartanto MSc
Fiber Optics FIBER MANUFACTURING.
S. Kugler: Lectures on Amorhous Semiconductors 1 Preparation.
PORE FORMING PROCESS IN ANODICALLY OXIDIZED SILICON WAFERS Basics of electrochemical cell - p + - Si wafer anode in contact with aqueous HF electrolyte.
Lecture 12.0 Deposition. Materials Deposited Dielectrics –SiO2, BSG Metals –W, Cu, Al Semiconductors –Poly silicon (doped) Barrier Layers –Nitrides (TaN,
반도체 제작 공정 재료공정실험실 동아대학교 신소재공학과 손 광 석 隨處作主立處開眞
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #2. Chip Fabrication  Silicon Ingots  Wafers  Chip Fabrication Steps (FEOL, BEOL)  Processing Categories 
MSE 576 Thin Films 1 of xx Molecular Beam Epitaxy 09/26/2008 MSE 576: Thin Films Deepak Rajput Graduate Research Assistant Center for Laser Applications.
M.H.Nemati Sabanci University
LW4 Lecture Week 4-1 Heterojunctions Fabrication and characterization of p-n junctions 1.
AlGaN/InGaN Photocathodes D.J. Leopold and J.H. Buckley Washington University St. Louis, Missouri, U.S.A. Large Area Picosecond Photodetector Development.
English ability would save life English ability gives you opportunities e.g. Job opening in TSMC
Sandia National Laboratories Materials & Processing for Si Compatibility Charles T. Sullivan 505/ Center for Compound Semiconductor.
Er-doped Nanophotonics: A Review on Growth, Characterization & Fabrication for 1.54 μm Emission Antara Hom Chowdhury, Abu Ashik Md. Irfan & Md. Nizam Sayeed.
1 Jiří Petráček Optoelectronics and Integrated Optics.
Reminders Quiz#2 and meet Alissa and Mine on Wednesday –Quiz covers Bonding, 0-D, 1-D, 2-D, Lab #2 –Multiple choice, short answer, long answer (graphical.
High Electron Mobility Transistor (HEMT)
By: Joaquin Gabriels November 24 th,  Overview of CMOS  CMOS Fabrication Process Overview  CMOS Fabrication Process  Problems with Current CMOS.
Introduction EE1411 Manufacturing Process. EE1412 What is a Semiconductor? Low resistivity => “conductor” High resistivity => “insulator” Intermediate.
1 Use of gratings in neutron instrumentation F. Ott, A. Menelle, P. Humbert and C. Fermon Laboratoire Léon Brillouin CEA/CNRS Saclay.
6_thermal.cfm.
From: S.Y. Hu Y.C. Lee, J.W. Lee, J.C. Huang, J.L. Shen, W.
1 Thin Film Optical Filter Fabrication and Characterization Adam Hammouda, Kalamazoo College Dr. David Shelton, UNLV 1.
Thin Film Deposition. Types of Thin Films Used in Semiconductor Processing Thermal Oxides Dielectric Layers Epitaxial Layers Polycrystalline Silicon Metal.
Mar 24 th, 2016 Inorganic Material Chemistry. Gas phase physical deposition 1.Sputtering deposition 2.Evaporation 3.Plasma deposition.
Optical Waveguide Fabrications Jules Billuart & Leo Norilo & Kasperi Kylmänen.
Patterning - Photolithography
Introduction to microfabrication, chapter 1 Figures from: Franssila: Introduction to Microfabrication unless indicated otherwise.
Deposition Techniques
MIT Amorphous Materials 13: Optical Fibers and Waveguides Juejun (JJ) Hu 1.
Lectures07 By Engr. Muhammad Ashraf Bhutta. In Manufacturing fiber there are Two challenges.
Lecture 3: Semiconductor Epitaxy Technologies (II) and
Basic Planar Processes
CMOS Fabrication CMOS transistors are fabricated on silicon wafer
Fabrication Process terms
UNDERGRADUATE COURSES USING THE SMU CLEAN ROOM
OUTLINE 1. Electrical simulation of VCSELs : standard structures
PVD & CVD Process Mr. Sonaji V. Gayakwad Asst. professor
Another “Periodic” Table!
VLSI System Design LEC3.1 CMOS FABRICATION REVIEW
Chapter 5 Plasma and Ion Beam Processing of Thin Films
Silicon Wafer cm (5’’- 8’’) mm
1.6 Magnetron Sputtering Perpendicular Electric Magnetic Fields.
Deposition 27 and 29 March 2017 Evaporation Chemical Vapor Deposition (CVD) Plasma-Enhanced Chemical Vapor Deposition (PECVD) Metal Organometallic CVD.
Molecular Beam Epitaxy (MBE) C Tom Foxon
Device Fabrication And Diffusion Overview
Lecture 3: Semiconductor Epitaxy Technologies (II) and
IC Fabrication Overview Procedure of Silicon Wafer Production
Device Fabrication And Diffusion Overview
Epitaxial Deposition
Deposition Techniques 5 and 8 April 2019
Deposition 30 March And 1 April 2016
Presentation transcript:

1 Fabrication techniques (only very brief overview) Planar waveguides –Deposited thin films sputtering deposition from solutions polymerization CVD –Diffusion –Ion exchange –Ion implantation –Carrier removal –Epitaxial growth 3D Waveguides Optical fibers

2

3 monolitické OIC jen hybridní OIC α < 0.3 dB/cm (vlnovod) α ~ 2 dB/cm (vlnovod) (GaInAsP 1.3/1.55 μm - „telekomunikační“ vlnové délky)

4 Planar waveguides

5 Sputtering e.g. plasma discharge glass, KDP, Si... vacuum (2-20) torr inert gas

6 e.g. ion bean sputtering system Sputtering

7 Deposition from solutions

8 Diffusion Ti film

9

10 Ion exchange

11 Ion exchange ~ 300°

12 Carrier removal free carriers reduce the index of refraction GaAs, GaP the cut-off condition is independent of wavelength

13 annealing

14 Epitaxial growth fabrication of monolitic optical io formed on a semiconductor substrate required bangap:

15

16

17

18 Molecular beam epitaxy (MBE) e.g. GaAlAs or GaInAsP

19 3D waveguides

20

21

22 Waveguide gratings

23 Optical fibers CVD:

24 1st step: preform fabrication using MCVD SiCl 4 + O 2 dopants

25 2nd step: fiber drawing