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ITRS Conference July 2007, San Francisco, CA1 2007 ITRS DRAFT DO NOT PUBLISH ITRS Factory Integration (FI) Update Mani Janakiram July 2007 San Francisco,

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Presentation on theme: "ITRS Conference July 2007, San Francisco, CA1 2007 ITRS DRAFT DO NOT PUBLISH ITRS Factory Integration (FI) Update Mani Janakiram July 2007 San Francisco,"— Presentation transcript:

1 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH ITRS Factory Integration (FI) Update Mani Janakiram July 2007 San Francisco, CA FI Global Co-Chairs: Europe: Arieh Greenberg Japan: Shige Kobayashi, Michio Honma Korea: C. S. Park, S. H. Park Taiwan: Thomas Chen US: Mani Janakiram July 2007 Meeting Attendees: Daniel Babbs, Michio Honma, Melvin Jung, Al Chasey, Mani Janakiram, Tom Jefferson, Shige Kobayashi, Bill Miller, Mikio Otani, Mutaz Haddadin, Gopal Rao, Dave Eggleston, Kandi Collier, Makoto Yamamoto, Adrian Pike, Phil Naughton, Mahmoud Aghel, Takayuki Nishimura, Brad Van Eck, Eric Englhardt, Andreas Neuber, Rex Wright, Terry Francis, James Moyne, Bevan Wu

2 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Agenda 1.Scope and Difficult Challenges 2.Technology Requirements & Potential Solutions Updates Summary 4.Top FI Focus Areas Summary 5.Factory Integration Cross-Cut Issues 6.Summary

3 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Factory Integration Scope and Drivers Wafer Mfg Chip Mfg Product Mfg Distribution FEOL BEOL Probe/Test Singulation Packaging Test Si Substrate Mfg Reticle Mfg Increasing cost & Cycle time implications Factory is driven by Cost, Quality, Productivity, and Speed Reduce factory capital and operating costs per function Faster delivery of new and volume products to the end customer Efficient/Effective volume/mix production, high reliability, & high equipment reuse Enable rapid process technology shrinks and wafer size changes Factory Operations Production Equipment AMHS Factory Information & Control Systems Facilities UI

4 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Key Technologies that will Impact Factory Design 2007 and future years were targeted to meet productivity and capture technology requirements Key process & device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials, wafer size conversion & huge productivity improvements Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth to attain efficiency and effectiveness Year Technology trend (nm) Wafer Size (mm)300 Near Term Years Long Term Years Year Technology trend (nm) Wafer Size (mm) Next Wafer Size in Production? Planning for 300/450mm EUVL in Production? New Device Structures?

5 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH FI Sub team –2007 Update Subteam2007 Update & 2008 Plans 1Factory Operations (FO) Focus: 1) Reduce Lot Cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix Updated the tables and included small lot metrics in the technology requirement table to reflect various biz cases. Team will start working on overall visualization and impact of 300/450mm on Factory Operations. Predictive PM and adv visualization were some of the key potential solutions 2Production Equipment (PE) Focus: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement 4) Equipment Intrinsic efficiency Updated the tables and included equipment induced non value added time metrics in the technology requirement table. Team will work on 300/450mm equipment needs and equip eng data contents. Mini-batch and SWP vs. Batch processing were some of the key potential solutions 3Automated Material Handling Systems (AMHS) Focus: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability Updated the tables and included survey results on Moves per Hour metrics in the technology requirement table. Team will work on various AMHS design solutions to accommodate high mix and 300/450mm needs. Flexible lot size transport, capable of handling split and merge were some of the key potential solutions. 4Factory Information & Control Systems (FICS) Focus: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Reduce or Maintain Mask Shop Cycle Time, Updated the tables and included information on time synchronization and emerging challenges. Team will work on data quality issues and data transmission needs. Integrated FICS to facilitate data searches and information correlation on process and operational data was some of the key potential solutions. 5Factory Facilities (FF) Focus: 1) Reduce Costs 2) Utility 3) Footprint Updated the tables and included energy conservation metrics in technology requirement table. Team will work on Green Fab definition and DFF needs in addition to finalizing potential solutions for equipment sleep mode.

6 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH 2007 FI Focus Area Summary Focus AreasDescription 300/450mm Transition30% improvement in cost/cm 2 and 50% cycle time reduction in days per mask layer is the goal. FI is mapping the ISMI and JEITA guidelines to each FI sub-teams areas of expertise from technology requirements and potential solutions perspective Energy conservation/ Equipment Sleep Mode Reduce facility operation cost by enabling facility demand based utilization model – including energy conservation Airborne Molecular Contamination (AMC) needs Fab AMC requirements have been defined but AMC at the equipment and FOUP level needs to be understood and defined Proactive Visual manufacturing Conquer the high mix, small lot, productivity losses and provide metrics for fab operations. FI Cross-cut issuesAddressed FI key issues with FEP (SWP vs. Batch), Litho (EUVL, APC), ESH (Green fab, Energy), YE (Temp & Humidity) and Metrology (Wafer map standards). Continue to work on 300/450mm needs.

7 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Next Generation 300/450mm Guidelines 300mm JEITA Guidelines Equipment maker Inputs ISMI Guidelines NG Factory Guidelines combined with ITRS TR & PS Source XTime Dest XTime Source STK Wait Time Dest STK Wait Time Inter-Bay XTime Source Tool Wait Time Dest Tool Wait Time Seasoning etc Wafer by wafer Process Start Speed etc Tool STK Wafer Point Of View ITRS FI will work on combined 300/450mm guidelines to address FI challenges, technology requirements and potential solutions ? Carrier & lot-size determination Direct Transport Standards Production Equipment Standards Factory Control System Standards Interoperability Testing & Reliability Verification 450mm wafer Standards Courtesy: JEITA/ISMI

8 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Energy conservation/ Equipment Sleep Mode Reduce facility operation cost by enabling facility demand based utilization model – including energy conservation Courtesy: Factory Facilities/Toshiba/SEAJ Standby Processing Electric power (kW) Time Standby/processing =100% Standby/processing =75% Average effective electric power during standby (kW) Average effective electric power during processing (kW) 1:1 RATIO Align on Idle mode definition Select tools for Sleep mode Engage others to define solution

9 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH AMC Concepts and Requirements from FI perspective Wafer Wafer/Tool environment Fab environment Factory Integration Roadmap Yield Enhancement Roadmap Technology Requirements AMC limits are addressed in the YE TWG, and the WECC sub TWG Fab environment requirements are being defined in the FI TWG Equipment, AMHS and FOUP AMC monitoring & control Courtesy: YE / WECC

10 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Factory Visualization Metrics Semiconductor Factory Step 1 Tool 1 Common Area A Process Group A Product View How well is it realized? Business Type Product Process Capacity Quality Cost Delivery Tool View ESH Logical World Physical World Factory OperationProducts/ProcessResources Competitive In-Competitive Area Understanding Assumptions Understanding Results Understanding Activity Process View Key Indicators GOAL : Provide measurable/actionable metrics for managing factory at various levels easily Courtesy: STRJ

11 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Enhance Visibility of Equipment Activity FI is working on putting the equip eng data contents in ITRS tables Required for data contents meeting the equipment performance needs Required for enhanced equipment quality management and assurance Text on equip eng data contents included in 2007 FI text SECS data port exist – raw data Equip eng data content requested model based data + activity/event data (energy, B/A, Setup time, etc.) Processing Time # of Wafers in a Carrier (lot?) b y = ax + b Start Start ID Read Docking Door Opening Wafer Mapping Start Start ID Read Docking Door Opening Wafer Mapping Recipe Setting Recipe Setting Recipe Down Load Variable parameter Setting Recipe Setting Recipe Setting Recipe Down Load Variable parameter Setting Set-ups Set-ups Reticle Settting Ion Source Changing Set-ups Set-ups Reticle Settting Ion Source Changing Eqp Conditioning Eqp Conditioning Dummy Wafer Setting Vacuuming Heating Seasoning Eqp Conditioning Eqp Conditioning Dummy Wafer Setting Vacuuming Heating Seasoning Quality Conditioning Quality Conditioning Send-Ahead Inspection Results Wait Monitor Setting Quality Conditioning Quality Conditioning Send-Ahead Inspection Results Wait Monitor Setting Actual Process Actual Process Processing Wafer Handling Actual Process Actual Process Processing Wafer Handling End End Door Close Undocking End End Door Close Undocking Abnormal Abnormal Detection Wafer Restore Trouble Restore Abnormal Abnormal Detection Wafer Restore Trouble Restore setup time contributors Courtesy: STRJ Impact of equip intrinsic cycle time loss defined by a model

12 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH FI Cross Cut Issues to be addressed Crosscut AreaFactory integration related key challenges Front end Process (FEP) SWP/Batch/Mini-batch for thermal processes (for 300/450mm) – Continue to work on feasibility and potential solutions. WEE changed from 1.5mm to 2mm and target 1.5mm for later years (solutions unknown) LithoEUVL (power, consumables, weight) impact on FI – Work with Litho to understand needs. Also, evaluate process control solutions to support tighter overlay and CD control. ESHESH/FI to identify which tools are ideal candidates for equipment sleep mode (may be phased implementation) and work with ESH on defining green fab. MetrologyTemperature & Humidity specs for Metrology tools will be included. Off- line/in-line/in-situ Metrology will be included in the 2007 chapter (Wafer metrology versus Sensors data). Yield Enhancement YE decided to include temperature and humidity metrics with FI referencing these tables. FI to work with YE on defining AMC needs at the equipment and FOUP level.

13 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Wafer fab Circuit architecture Masks optimized based on design intent Layout with critical paths Packaged IC Device models Design rules Statistical timing optimization Process variation distributions Known contours of CD, topography or overlay error with mfg. process Test data Role of PCS/APC? Designers Organizational, corporate cultural and geographical barriers Wafer fab Circuit architecture Masks Layout Test data Packaged IC Device models Design rules Designers DFM Present mode of operation for circuit design and fabrication New mode of operation with design for manufacturing (DFM) practices ITRS Litho Challenges/Needs Design for Mfg (DFM) needed for: Immersion litho challenges Double Patterning needs EUVL challenges Controlling LWR and LER increasingly important Stringent overlay tolerances needed Integration of design, modeling, lithographic resolution enhancement techniques and extensive metrology needed to maintain expected circuit performance LWR = Line Width Roughness; LER = Line Edge Roughness Source: Based on ITRS Litho TWG

14 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Factory Integration Summary All FI technology requirements tables and potential solutions tables updated Operations, Equipment, AMHS, FICS and Facilities Identified key focus areas for FI Technology requirement and potential solutions for 300/450mm Equipment sleep mode Intrinsic equipment losses and better visibility of data AMC solutions for equipment and FOUP Working with other TWG on cross-cut issues With FEP, Litho, Metrology, Yield Enhancement and ESH EUVL, single wafer processing, IM, energy conservation, etc. Business strategies, market demands, and process technology changes continue to make factories difficult to integrate Work with other forums/WG to ensure synergy ISMI 450mm WG, STRJ, IMA, JEITA, SEMI, etc. Improve sub-team participation to obtain cross-synergy

15 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Backup

16 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Factory Operations Technology Requirements Key Objectives: Speed & Flexibility 1) Reduce mfg cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix Solution existsSolution being developedSolution required

17 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Production Equipment Technology Requirements Key Objectives: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement Productivity & Cost Solution existsSolution being developedSolution required

18 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Key Objectives: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability Material Handling Technology Requirements Solution existsSolution being developedSolution required

19 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH FICS Technology Requirements Key Objectives: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Reduce or Maintain Mask Shop Cycle Time, 4) Reduce Costs Solution existsSolution being developedSolution required

20 ITRS Conference July 2007, San Francisco, CA ITRS DRAFT DO NOT PUBLISH Facilities Technology Requirements Key Objectives: 1) Factory Extendibility, 2) AMC, 3) Rapid Install/Qualification, 4) Reduce Costs Solution existsSolution being developedSolution required


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