1. ITRS Factory Integration (FI) Update
ITRS Factory Integation TWG
2017/3/27
ITRS Factory Integration (FI) Update
Mani Janakiram
July 2007
San Francisco, CA
July 2007 Meeting Attendees: Daniel Babbs, Michio Honma, Melvin Jung, Al Chasey, Mani Janakiram, Tom Jefferson, Shige Kobayashi, Bill Miller, Mikio Otani, Mutaz Haddadin, Gopal Rao, Dave Eggleston, Kandi Collier, Makoto Yamamoto, Adrian Pike, Phil Naughton, Mahmoud Aghel, Takayuki Nishimura, Brad Van Eck, Eric Englhardt, Andreas Neuber, Rex Wright, Terry Francis, James Moyne, Bevan Wu
FI Global Co-Chairs:
Europe: Arieh Greenberg
Japan: Shige Kobayashi, Michio Honma
Korea: C. S. Park, S. H. Park
Taiwan: Thomas Chen
US: Mani Janakiram
FITWG 2000

2. ITRS Factory Integation TWG
2017/3/27
Agenda
Scope and Difficult Challenges
Technology Requirements & Potential Solutions
2007 Updates Summary
Top FI Focus Areas Summary
Factory Integration Cross-Cut Issues
Summary
FITWG 2000

3. ITRS Factory Integation TWG
2017/3/27
Factory Integration Scope and Drivers UI
Factory
Operations
Production
Equipment
Factory Information
& Control Systems
AMHS
Facilities
Si Substrate
Mfg
Wafer
Mfg
Chip
Mfg
Product
Mfg
Distribution
Reticle
Mfg
FEOL
BEOL
Probe/Test
Singulation
Packaging
Test
Increasing cost &
Cycle time implications
Factory is driven by Cost, Quality, Productivity, and Speed
Reduce factory capital and operating costs per function
Faster delivery of new and volume products to the end customer
Efficient/Effective volume/mix production, high reliability, & high equipment reuse
Enable rapid process technology shrinks and wafer size changes
FITWG 2000

4. Key Technologies that will Impact Factory Design
ITRS Factory Integation TWG
2017/3/27
Key Technologies that will Impact Factory Design
2007 and future years were targeted to meet productivity and capture technology requirements
Key process & device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials, wafer size conversion & huge productivity improvements
Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth to attain efficiency and effectiveness
Near Term Years
Year
2007
2008
2009
2010
Technology trend (nm) 65 55 50 45
Wafer Size (mm)
300
Planning for 300’/450mm
Long Term Years
Year
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
Technology trend (nm) 40 35 32 28 25 22 20 18 16 14
Wafer Size (mm)
300
450
EUVL in Production?
New Device Structures?
Next Wafer Size in Production?
FITWG 2000

5. ITRS Factory Integation TWG
FI Sub team –2007 Update
2017/3/27
Subteam
2007 Update & 2008 Plans 1
Factory Operations (FO)
Focus: 1) Reduce Lot Cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix
Updated the tables and included small lot metrics in the technology requirement table to reflect various biz cases. Team will start working on overall visualization and impact of 300’/450mm on Factory Operations. Predictive PM and adv visualization were some of the key potential solutions 2
Production Equipment (PE)
Focus: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement 4) Equipment Intrinsic efficiency
Updated the tables and included equipment induced non value added time metrics in the technology requirement table. Team will work on 300’/450mm equipment needs and equip eng data contents. Mini-batch and SWP vs. Batch processing were some of the key potential solutions 3
Automated Material Handling Systems (AMHS)
Focus: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability
Updated the tables and included survey results on Moves per Hour metrics in the technology requirement table. Team will work on various AMHS design solutions to accommodate high mix and 300’/450mm needs. Flexible lot size transport, capable of handling split and merge were some of the key potential solutions. 4
Factory Information & Control Systems (FICS)
Focus: 1) Increase Reliability, 2) Increase Factory Throughput,
3) Reduce or Maintain Mask Shop Cycle Time,
Updated the tables and included information on time synchronization and emerging challenges. Team will work on data quality issues and data transmission needs. Integrated FICS to facilitate data searches and information correlation on process and operational data was some of the key potential solutions. 5
Factory Facilities (FF)
Focus: 1) Reduce Costs 2) Utility 3) Footprint
Updated the tables and included energy conservation metrics in technology requirement table. Team will work on Green Fab definition and DFF needs in addition to finalizing potential solutions for equipment sleep mode.
FITWG 2000

6. ITRS Factory Integation TWG
2007 FI Focus Area Summary
2017/3/27
Focus Areas
Description
300’/450mm Transition
30% improvement in cost/cm2 and 50% cycle time reduction in days per mask layer is the goal. FI is mapping the ISMI and JEITA guidelines to each FI sub-teams areas of expertise from technology requirements and potential solutions perspective
Energy conservation/ Equipment Sleep Mode
Reduce facility operation cost by enabling facility demand based utilization model – including energy conservation
Airborne Molecular Contamination (AMC) needs
Fab AMC requirements have been defined but AMC at the equipment and FOUP level needs to be understood and defined
“Proactive Visual” manufacturing
Conquer the high mix, small lot, productivity losses and provide metrics for fab operations.
FI Cross-cut issues
Addressed FI key issues with FEP (SWP vs. Batch), Litho (EUVL, APC), ESH (Green fab, Energy), YE (Temp & Humidity) and Metrology (Wafer map standards). Continue to work on 300’/450mm needs.
FITWG 2000

7. Next Generation 300’/450mm Guidelines
ITRS Factory Integation TWG
2017/3/27
Next Generation 300’/450mm Guidelines
300mmプライム推進派
JEITA Guidelines
Equipment maker Inputs
ISMI Guidelines
NG Factory Guidelines combined with ITRS TR & PS
Source
XTime
Dest
Source STK
Wait Time
Dest STK
Inter-Bay
Source Tool
Dest Tool
Seasoning
etc
Wafer by wafer
Process
Speed etc
Start
Tool
STK
Wafer Point
Of View 2 6 4 5 3
2005
2006
2007
2008
2009
2010
2011
2012?
2012
Carrier & lot-size
determination
Direct Transport
Standards
Production Equipment
Factory Control
System Standards
Interoperability Testing
& Reliability Verification
450mm wafer
ITRS FI will work on combined 300’/450mm guidelines to address FI challenges, technology requirements and potential solutions
Courtesy: JEITA/ISMI
FITWG 2000 7

8. ITRS Factory Integation TWG
2017/3/27
Energy conservation/ Equipment Sleep Mode
Reduce facility operation cost by enabling facility demand based utilization model – including energy conservation
Standby
Processing
Electric power (kW)
Time
Standby/processing
=100%
=75% 10 20 30 40 50 60 70 80
Average effective electric power
during standby (kW)
Average effective electric power during processing (kW)
1:1 RATIO
Align on Idle mode definition
Select tools for Sleep mode
Engage others to define solution
Courtesy: Factory Facilities/Toshiba/SEAJ
FITWG 2000

9. AMC Concepts and Requirements from FI perspective
Wafer
Wafer/Tool
environment
Fab
Factory
Integration
Roadmap
Yield Enhancement Roadmap
Technology
Requirements
AMC limits are addressed in the YE TWG, and the WECC sub TWG
Fab environment requirements are being defined in the FI TWG
Equipment, AMHS and FOUP
AMC monitoring & control
Courtesy: YE / WECC

10. Factory Visualization Metrics
ITRS Factory Integation TWG
Factory Visualization Metrics
2017/3/27
Semiconductor Factory
Step 1
Tool 1
Common
Area A
Process
Group A
Product
View
How well is it realized?
Business
Type
Capacity
Quality
Cost
Delivery
Tool
ESH
Logical
World
Physical
Factory Operation
Products/Process
Resources
Competitive
In-Competitive Area
Understanding
Assumptions
Results
Understanding Activity
Key Indicators
GOAL: Provide measurable/actionable metrics for managing factory at various levels easily
Courtesy: STRJ
FITWG 2000

11. Enhance Visibility of Equipment Activity
ITRS Factory Integation TWG
2017/3/27
Enhance Visibility of Equipment Activity
FI is working on putting the equip eng data contents in ITRS tables
Required for data contents meeting the equipment performance needs
Required for enhanced equipment quality management and assurance
Text on equip eng data contents included in 2007 FI text
SECS data port exist – raw data
Equip eng data content requested  model based data + activity/event data (energy, B/A, Setup time, etc.)
<1> Start
ID Read
Docking
Door Opening
Wafer Mapping
<2> Recipe Setting
Recipe Down Load
Variable parameter Setting
<3> Set-ups
Reticle Settting
Ion Source Changing
<4> Eqp Conditioning
Dummy Wafer Setting
Vacuuming
Heating
Seasoning
<5> Quality Conditioning
Send-Ahead
Inspection Results Wait
Monitor Setting
<6> Actual Process
Processing
Wafer Handling
<7> End
Door Close
Undocking
<8> Abnormal
Detection
Wafer Restore
Trouble Restore 5 10 15 20 25
Processing Time
# of Wafers in a Carrier (lot?) b
y = ax + b
setup time contributors
Impact of equip intrinsic cycle time loss defined by a model
Courtesy: STRJ
FITWG 2000

12. FI Cross Cut Issues to be addressed
ITRS Factory Integation TWG
FI Cross Cut Issues to be addressed
2017/3/27
Crosscut Area
Factory integration related key challenges
Front end Process (FEP)
SWP/Batch/Mini-batch for thermal processes (for 300’/450mm) – Continue to work on feasibility and potential solutions. WEE changed from 1.5mm to 2mm and target 1.5mm for later years (solutions unknown)
Litho
EUVL (power, consumables, weight) impact on FI – Work with Litho to understand needs. Also, evaluate process control solutions to support tighter overlay and CD control.
ESH
ESH/FI to identify which tools are ideal candidates for equipment sleep mode (may be phased implementation) and work with ESH on defining green fab.
Metrology
Temperature & Humidity specs for Metrology tools will be included. Off-line/in-line/in-situ Metrology will be included in the 2007 chapter (Wafer metrology versus Sensors data).
Yield Enhancement
YE decided to include temperature and humidity metrics with FI referencing these tables. FI to work with YE on defining AMC needs at the equipment and FOUP level.
FITWG 2000

13. ITRS Litho Challenges/Needs
ITRS Factory Integation TWG
2017/3/27
ITRS Litho Challenges/Needs
LWR = Line Width Roughness; LER = Line Edge Roughness
New mode of operation with design for manufacturing (DFM) practices
Design for Mfg (DFM) needed for:
Immersion litho challenges
Double Patterning needs
EUVL challenges
Controlling LWR and LER increasingly important
Stringent overlay tolerances needed
Wafer fab
Circuit architecture
Masks optimized based on design intent
Layout with critical paths
Packaged IC
Device models
Design rules
Statistical timing optimization
Process variation distributions
Known contours of CD, topography or overlay error with mfg. process
Test data
Role of PCS/APC?
Designers
Present mode of operation for circuit design and fabrication
DFM
Organizational, corporate cultural and geographical barriers
Wafer fab
Circuit architecture
Masks
Layout
Test data
Packaged IC
Device models
Design rules
Designers
Some graphics from eSilicon Corporation website and from Alan Allan, Intel
Remaining graphics form Freescale Semiconductor
Integration of design, modeling, lithographic resolution enhancement techniques and extensive metrology needed to maintain expected circuit performance
Source: Based on ITRS Litho TWG
FITWG 2000

14. Factory Integration Summary
ITRS Factory Integation TWG
Factory Integration Summary
2017/3/27
All FI technology requirements tables and potential solutions tables updated
Operations, Equipment, AMHS, FICS and Facilities
Identified key focus areas for FI
Technology requirement and potential solutions for 300’/450mm
Equipment sleep mode
Intrinsic equipment losses and better visibility of data
AMC solutions for equipment and FOUP
Working with other TWG on cross-cut issues
With FEP, Litho, Metrology, Yield Enhancement and ESH
EUVL, single wafer processing, IM, energy conservation, etc.
Business strategies, market demands, and process technology changes continue to make factories difficult to integrate
Work with other forums/WG to ensure synergy
ISMI 450mm WG, STRJ, IMA, JEITA, SEMI, etc.
Improve sub-team participation to obtain cross-synergy
Thanks!
FITWG 2000

15. ITRS Factory Integation TWG
2017/3/27
Backup
FITWG 2000

16. Factory Operations Technology Requirements
ITRS Factory Integation TWG
2017/3/27
Factory Operations Technology Requirements
Key Objectives: Speed & Flexibility
1) Reduce mfg cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix
Solution exists
Solution being developed
Solution required
FITWG 2000

17. Production Equipment Technology Requirements
ITRS Factory Integation TWG
2017/3/27
Production Equipment Technology Requirements
Key Objectives: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement  Productivity & Cost
Solution exists
Solution being developed
Solution required
FITWG 2000

18. Material Handling Technology Requirements
ITRS Factory Integation TWG
2017/3/27
Material Handling Technology Requirements
Key Objectives: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability
Solution exists
Solution being developed
Solution required
FITWG 2000

19. FICS Technology Requirements
ITRS Factory Integation TWG
2017/3/27
FICS Technology Requirements
Key Objectives: 1) Increase Reliability, 2) Increase Factory Throughput,
3) Reduce or Maintain Mask Shop Cycle Time, 4) Reduce Costs
Solution exists
Solution being developed
Solution required
FITWG 2000

20. Facilities Technology Requirements
ITRS Factory Integation TWG
2017/3/27
Facilities Technology Requirements
Key Objectives: 1) Factory Extendibility, 2) AMC,
3) Rapid Install/Qualification, 4) Reduce Costs
Solution exists
Solution being developed
Solution required
FITWG 2000