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1 Changes to Litho Tables for 2004 CD control (total CD control includes cross field, wafer and lots) –US and Japan TWG studies concluded that <4nm 3 CD.

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Presentation on theme: "1 Changes to Litho Tables for 2004 CD control (total CD control includes cross field, wafer and lots) –US and Japan TWG studies concluded that <4nm 3 CD."— Presentation transcript:

1 1 Changes to Litho Tables for 2004 CD control (total CD control includes cross field, wafer and lots) –US and Japan TWG studies concluded that <4nm 3 CD control will be red for the foreseeable future Definition of potential solutions –More specific definition defined for technology to be listed as potential solution for N to N+2 nodes using Figure 2 as a guide –N+3 node and beyond potential solutions may be more broad ranging and inclusive Changes to coloring, footnotes, etc. –Definition of overlay in Tables 77a and 77b –Mask table values to be updated –Resist table values to be updated More discussion needed (2005 update probable) –LWR/LER definitions and values with input from PIDS, FEP and Metrology –APC requirements

2 2 ITRS potential solutions and node timeline Unofficial version of 2003 table; Not for publication

3 Original 2001 ITRS (Unchanged in 2002 Update) Production Ramp-up Model and Technology Node Figure 2 Volume (Parts/Month) 1K 10K 100K Months 0 -24 1M 10M 100M Alpha Tool 1224 -12 DevelopmentProduction Beta Tool Production Tool First Conf. Papers Volume (Wafers/Month) 2 20 200 2K 20K 200K Source: 2001 ITRS - Exec. Summary Figure 2 Work in Progress – Do Not Publish 3 First Two Companies Reaching Production


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