1. EE143 – Ali JaveySlide 0-1 EE143 Microfabrication Technology Professor: Ali Javey ajavey@eecs.berkeley.edu 506 Cory Hall (510) 643-7263 TAs: SangHoon Lee, leesh@me.berkeley.edu Peter Matheu, peter_matheu@berkeley.edu John Wyrwas, jwyrwas@eecs.berkeley.edu Web Page:http://www-inst.eecs.berkeley.edu/~ee143/

2. EE143 – Ali JaveySlide 0-2 Schedule Lectures: Tue/Thu, 3:30pm-5pm Labs (218 Cory) – only 5 of the following 6 sections will be offered: –M 2-5P, 218 CORY –Tu 10-1P, 218 CORY –W 9-12P, 218 CORY –Th 11-2P, 218 CORY –F 9-12P, 218 CORY LAB SECTIONS WILL BEGIN ON January 28th Office Hours: –Ali Javey (Cory Hall, 506) Wednesdays, 10-11 am –TAs (TBD)

3. EE143 – Ali JaveySlide 0-3 Reading Material Primary Text: Introduction To Microelectronic Fabrication R. C. Jaeger Prentice Hall Reference Texts: Semiconductor Device Fundamentals R. F. Pierret Addison Wesley Device Electronics for Integrated Circuits R. S. Muller and T. I. Kamins Wiley

4. EE143 – Ali JaveySlide 0-4 Grading –Laboratory Includes quizzes, lab work, and reports –Homeworks Assigned on Thursdays, due the following week in class You must work on your own –Tests (2-3) ~75 minutes each given periodically per schedule Open book and notes No makeups –Final Examination Friday, Dec. 15 th, 12:30pm- 3:30pm Open book and notes No makeups 30% Letter grades will be assigned based approximately on the following scale: A+: 95-100 A: 88-95 A-: 85-88 B+: 80-85 B: 73-80 B-: 68-73 C+: 65-68 C: 60-65 C-: 55-60 D: 40-55 F: <40 30% 10%

5. EE143 – Ali JaveySlide 0-5 Course Information Prerequisites: –EE40/E100 and Physics 7B or equivalent Course Description –EE143 teaches the fundamentals of integrated-circuit (IC) fabrication and surface-micromachining technology, giving the student a basic understanding of IC and micromachining processes and the effect of processing choices on device performance. Students learn to use process simulation tools and also fabricate and characterize devices in the laboratory. This lecture part will cover the processing techniques and design methodologies of microfabrication. We will discuss the process modules: lithography, thermal oxidation, diffusion, ion implantation, etching, thin-film deposition, epitaxy, metallization. The second part of the course will cover process simulation, layout design rules, MOS, IC, and MEMS process integration. The laboratory part of the course will provide students opportunities to have hands-on experience to fabricate and characterize a NMOS chip with simple MEMS components.

6. Course Schedule EE143 – Ali JaveySlide 0-6 Introduction to Materials and Processing (1-2 weeks) Photolithography (1 week) Etching (1 week) Oxidation (1 week) Deposition (1 week) Diffusion (1 week) Ion Implantation (1 week) Metallization/CMP (1 week) Simulation/Layout (1 week) Process Integration (1 week) Introduction to Devices (2 weeks) Nanolithography and Nanofabrication (1 week)

7. EE143 – Ali JaveySlide 0-7 Laboratory Information We do our best to limit lab size to 12 people; as a result, your telebears enrollment is not a guarantee of being assigned to a lab. You MUST send an email to Professor Javey (ajavey@eecs.berkeley.edu) by Thursday 8pm including the following information: –1) Full Name –2) Major –3) Year (Jr., Sr., Grad student, etc.) 4) Rank list of preferred lab sections in descending order of preference (i.e., 1 st choice, 2 nd choice…) –5) List of any lab sections that you CANNOT attend Failure to send an email may result in you being dropped from the course, even if you are registered on telebears. Final lab assignment will be sent to you via email. PLEASE ENSURE THAT YOUR EMAIL ADDRESS ON TELEBEARS IS CORRECT, SINCE THIS WILL BE USED FOR OFFICIAL CORRESPONDENCE!!!

8. EE143 – Ali JaveySlide 0-8 Lab Safety Week of 1/28 Mandatory Lab attendance required You will have a lab orientation session, and will have to pass a safety quiz before you are officially enrolled in this course. You MUST attend the lab session to which you are assigned.

9. EE143 – Ali JaveySlide 0-9 Course Structure – Lab and Lecture You learn the theories in class; you practice them in lab You are going to make: –resistors, diodes, MOS-cap –bipolar transistor, MOS-transistor, … –some MEMS structures, like bimorphs, … By the end of the semester, you should have learnt –basic lab techniques –how to operate some fabrication equipment –how to characterize the devices you made

10. EE143 – Ali JaveySlide 0-10 The EE143 Chip

11. EE143 – Ali JaveySlide 0-11 Lab Cleanliness only enter the clean room fully gowned –hair net + lab coat + glove + shoe net + safety goggles do NOT touch chemicals / equipment with bare hands always handle wafers with tweezers and trays (unless told otherwise) wash hands before and after entering the lab (why??) –before: so as not to contaminate wafers or equipment –after: avoid chemicals being indigested 3rd week, GSIs will demonstrate how to clean masks 4th week, GSIs will demonstrate how to piranha- clean wafers

12. EE143 – Ali JaveySlide 0-12 Lab Safety do NOT enter the lab when GSI aren’t present know all the emergency exits (ask the GSIs to show you) know where to find the MSDS –under the whiteboard in characterization room know where to find the closet water sources, shower, eye wash ask whenever not clear do NOT try things out without permission NO eating, drinking, playing, etc. inside the lab Things in the lab can be dangerous if not carefully handled. Be sure to respect the chemicals.

13. EE143 – Ali JaveySlide 0-13 Chemical Handling wear protective gear when handling corrosive chemicals –face shield, chemical apron, chemical gloves, respirator if necessary check glove for holes check pH of unknown spillage, label everything corrosive chemicals: H2SO4, HF, aluminum etch, TMAH wash and rinse the exposed body parts with water for > 15mins add acids to water, not the other way around handle wet chemicals only at sinks, acid on right, others on left side

14. EE143 – Ali JaveySlide 0-14 Chemical Handling (cont’d) HF: –be very very careful –HF will penetrate your body and attack your skeletal system; once you feel it, it is already eating your bones!!! –apply calcium gluconate if exposure is suspected –use only plastic beakers for HF (why??) H2SO4: –very painful, severely burns –add H2O2 to H2SO4 to prepare piranha –do not carry the beaker around after mixing (HOT!!) –use only glass beakers for piranha (why??) Chemicals used in the lab are often harmful. Don’t breathe and avoid exposure if possible. Use teflon-ware when handling wafers in acids. Be careful, those teflon tweezers do not hold the wafers very well!!

15. EE143 – Ali JaveySlide 0-15 Chemical Disposal organic chemicals are discarded in designated containers NOTE: in this lab, photoresist (PR) is also dumped down the drain. do NOT mix organic wastes with acids (why??) –can cause fire or even explosion do NOT mix acids and bases

16. EE143 – Ali JaveySlide 0-16 Note: Not drawn to scale Lab Floor Plan

17. EE143 – Ali JaveySlide 0-17 Microfabrication Principles for IC and MEMS Hands-on Fabrication and Testing of IC and MEMS Devices EE143 Overview

18. EE143 – Ali JaveySlide 0-18 Fabricated Structures Using a series of planar processing steps, it is possible to create sophisticated 3D electrical and mechanical structures.

19. EE143 – Ali JaveySlide 0-19 17-stage Ring Oscillator Electrical Functionality / Characterization The resulting structures may be characterization electrically or mechanically

20. EE143 – Ali JaveySlide 0-20 Responsive Drug Delivery Valve Gear Speed Reduction Unit Movable Mirror Turbine engine MEMS Actuators

21. Introduction to Si Processing EE143 in one day

22. Silicon Device Fabrication Technology Over 10 19 transistors (or 1,000,000,000 for every person in the world) are manufactured every year. Variations of this versatile technology are used for flat-panel displays, micro-electro-mechanical systems (MEMS), and even DNA chips for DNA screening...

23. Terminology SSI (Small Scale Integration) – few transistors MSI (Medium Scale Integration) – hundreds LSI (Large Scale Integration) - thousands VLSI (Very Large Scale Integration) - millions ULSI (Ultra Large Scale Integration)

24. Foundry (Fab) Foundry (also called a fab for fabrication plant) is used to refer to a factory where devices like integrated circuits are manufactured. The central part of a fab is a cleanroom. Note the difference between a fab and a lab.

25. Cleanroom Standards Federal Standard Class Limits CLASS MEASURED PARTICLE SIZE (MICROMETERS) 0.10.20.30.55.0 1357.531NA 10350753010NA 100NA750300100NA 1,000NA 1,0007 10,000NA 10,00070 100,000NA 100,000700 Why do we need cleanrooms?

26. Introduction to Device Fabrication Oxidation Lithography & Etching Ion Implantation Annealing & Diffusion Deposition

27. Oxidation of Silicon Si + O 2  SiO 2 Si +2H 2 O  SiO 2 + 2H 2 Dry Oxidation : Wet Oxidation : Thin oxide Thick oxide

28. Oxidation of Silicon

29. Lithography Resist Coating Exposure Development Etching and Resist Strip Photoresist Oxide Si (a) Optical Lens system Deep Ultraviolet Light Photomask with opaque and clear patterns Si Positive resist Negative resist (c) (d) (b)

30. Pattern Transfer–Etching Isotropic etchingAnisotropic etching wet etchdry etch

31. EE143 – Ali JaveySlide 0-31 Ion Energy ~1 keV to 200 keV Module: Ion Implantation

32. EE143 – Ali Javey Processing Steps Si wafer What is process integration? Sequential use of a series of simple process steps or “modules” to create complex structures Slide 0-32

33. EE143 – Ali JaveySlide 0-33 The EE143 Lab Process (part I)

34. EE143 – Ali JaveySlide 0-34 The EE143 Lab Process (Part II)