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Sprinkler Buddy Presentation #8: “Testing/Finalization of all Modules and Global Placement” 3/26/2007 Team M3 Kartik Murthy Panchalam Ramanujan Sasidhar.

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Presentation on theme: "Sprinkler Buddy Presentation #8: “Testing/Finalization of all Modules and Global Placement” 3/26/2007 Team M3 Kartik Murthy Panchalam Ramanujan Sasidhar."— Presentation transcript:

1 Sprinkler Buddy Presentation #8: “Testing/Finalization of all Modules and Global Placement” 3/26/2007 Team M3 Kartik Murthy Panchalam Ramanujan Sasidhar Uppuluri Devesh Nema Kalyan Kommineni Design Manager: Bowei Gai “Low Cost Irrigation Management For Everyone ! ”

2 Current Status Determine Project Develop Project Specifications Plan Architectural Design Determination of all components in design Detailed logical flowchart Design a Floor Plan Create Structural Verilog Make Transistor Level Schematic Layout (~85% done..all modules LVS with only global left) Testing (Extraction, LVS, and Analog Sim.) (main modules verified)

3 Finalized Floor Plan

4 Transistor Count … Block (# used)Old TCNew TC 40:20 Muxes (6)362 60:20 Muxes (2)644 Counter (2)220 KC ROM (1)1256 P ROM (1)122 Metric Storage SRAMS (2) 2430 Constant Storage ROM (1) 428 Floating Point Adder (4) 3210 3501 Floating Point Multiplier (2) 1026 10 Bit Registers (9) 210 Datapath Logic / Misc. 2305 Total: 30,817

5 Updated Design Size Block (# used)Size (um) 40:20 Muxes (4)20 x 80 60:20 Muxes (2)20 x 120 Counter (2)12 x 17 KC ROM (4 parts)181 x 8 P ROM (1)70 x 8 Metric Storage SRAMS (2) 181 x 60 Constant Storage ROM (1) 181 x 8 Floating Point Adder (4) 96x151 Floating Point Multiplier (2) 89 x 40 10 Bit Registers (8)50 x 10 330um x 335 um ~ 1 : 1.01 aspect ratio.11 mm^2 area.28 Density

6 Layout: Progress All Big Modules LVS Global Wiring still has to be finished Control Logic locations estimated and placed Needs wiring Extracted Simulations Run on Major Blocks

7 Layout : 60-20 MUX Density:.35 transistors/um 2

8 Layout : ROMs The decoder and ROM didn’t match at all… Decoder ROM

9 Layout : ROMs Changed Busses from M 1/2 to 3/4 Moved ROM under Bus

10 Layout : Shifter Density:.35 transistors/um 2

11 Layout : FP Add SIG Unit Inputs Density:.36 transistors/um 2 Outputs

12 Layout : FP Add Exponent Unit Density:.34 transistors/um 2 Outputs Inputs

13 Layout : FP Adder FSM Shaped to “Fill Gaps”

14 Layout : FP Adder Density:.28 transistors/um 2 Inputs Outputs

15 Layout : Floating Point Multiply Density:.34 transistors/um 2 InputsOutputs

16 Layout : Entire Chip Density:.28 transistors/um 2

17 Simulations : Extracted RC Mult Clean Input Input Through Min Sized Inv 1.175ns propagation delay Multiplier Output

18 Simulations : Extracted RC Shifter Output from Shifter Clean Shift Signal 340ps propagation delay Input Through Min Size Inv

19 Design Challenges and Implementation Decisions For The Past Week Design Challenge Translation to HW Avoiding “Black Space” in Layout Completed Global Level Layouts then shaped FSMs to fill gaps Placed Entire Blocks under higher metal busses

20 Problems/Questions Metal Directionality is lost when we rotate blocks Possible to ignore this in blocks we don’t route over ? Especially bad in large blocks (FP Adder) Even worse to correct

21 For Next Time More Layout Global Routing Entire Chip Extracted RC Verification


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