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2-1 Infineon M167 16-bit Microcontroller One of a family of microcontrollers (M16x) Derived from M166 Same 16-bit CPU core in all family members  Provides.

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Presentation on theme: "2-1 Infineon M167 16-bit Microcontroller One of a family of microcontrollers (M16x) Derived from M166 Same 16-bit CPU core in all family members  Provides."— Presentation transcript:

1 2-1 Infineon M bit Microcontroller One of a family of microcontrollers (M16x) Derived from M166 Same 16-bit CPU core in all family members  Provides software compatability e.g. The Keil C166 C compiler can be used for all devices in the family.  Allows migration of software The 167CS is a quite advanced microcontroller with many peripherals and functions. Most microcontrollers only have some of the features of the 167CS, a few could have more.

2 2-2 M167CS Functional Block Diagram

3 2-3 M167CS CPU Block Diagram

4 2-4 Infineon M167 Basic Features High Performance 16-bit CPU with Four-Stage Pipeline Control Oriented Instruction Set with High Efficiency Integrated On-Chip Memory External Bus Interface 16-Priority-Level Interrupt System 8-Channel Peripheral Event Controller (PEC) Intelligent On-Chip Peripheral Subsystems

5 2-5 Infineon M167 Basic Features contd. 111 I/O lines, bit addressable, organised :-  one 16-bit I/O port (Port 2)  eight 8-bit I/O ports : P0H and P0L making 16-bit Port 0, P1H and P1L making 16-bit Port1, Port 4, Port 6, Port 7and Port 8  one 15-bit I/O port (Port 3)  one 16-bit input only port (Port 5) Most port lines have alternate functions Tri-stated in input mode Selectable input thresholds (not on all pins) Push/pull or open drain output mode

6 2-6 Basic Features contd. High Performance 16-bit CPU with Four-Stage Pipeline  80/60 ns minimum instruction cycle time, with most instructions executed in 1 cycle  400/300 ns multiplication (16-bit * 16-bit), 800/600 ns division (32-bit/16-bit)  Multiple high bandwidth internal data buses  Register based design with multiple variable register banks  Single cycle context switching support  16 MBytes linear address space for code and data (Von Neumann architecture)  System stack cache support with automatic stack overflow/underflow detection [the indicated timings refer to a CPU clock of 25/33 MHz]

7 2-7 Basic Features contd. Control Oriented Instruction Set with High Efficiency  Bit, byte, and word data types  Flexible and efficient addressing modes for high code density  Enhanced boolean bit manipulation with direct addressability of 6 Kbits for peripheral control and user defined flags  Hardware traps to identify exception conditions during runtime  HLL support for semaphore operations and efficient data access

8 2-8 Integrated On-Chip Memory 3 KByte internal RAM for variables, register banks, system stack and code. 8 KByte on-chip high-speed XRAM for variables, user stack and code. 32 KByte on-chip ROM (not for ROMless versions) for code and fixed data.

9 2-9 3 KByte on-chip Internal RAM (IRAM) Has multiple uses :-  user defined variables  the system stack  general purpose register banks A register bank can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0,…, RL7, RH7) so-called General Purpose Registers (GPRs).  and can even be used for program code. Special Function Registers (SFR’s)  1024 bytes (2 * 512 bytes) of the address space are reserved for SFR’s. SFR’s are word-wide registers which are used for controlling and monitoring functions of the different on-chip units.  Unused SFR addresses are reserved for future members of the C166/167 Family.

10 KBytes of on-chip Extension RAM (XRAM) Organized as two blocks of 2 KByte and 6 KByte. XRAM provides storage for user data, user stacks, or code. XRAM is accessed like external memory and therefore cannot be used for the system stack or for register banks and is not bit addressable. The XRAM permits 16-bit accesses with maximum speed. In order to meet the needs of designs where more memory is required than is provided on chip, up to 16 MBytes of external RAM and/or ROM can be connected to the microcontroller.

11 2-11 External Bus Interface Multiplexed or demultiplexed bus configurations Segmentation capability and chip select signal generation 8-bit or 16-bit data bus Bus cycle characteristics selectable for five programmable address areas  Single Chip Mode when no external memory is required,  16-/18-/20-/24-bit Addresses, 16-bit Data, Demultiplexed  16-/18-/20-/24-bit Addresses, 16-bit Data, Multiplexed  16-/18-/20-/24-bit Addresses, 8-bit Data, Multiplexed  16-/18-/20-/24-bit Addresses, 8-bit Data, Demultiplexed

12 Priority-Level Interrupt System 56 interrupt nodes each with separate interrupt vectors 240/180 ns typical interrupt latency (400/300 ns maximum) in case of internal program execution Fast external interrupts

13 Channel Peripheral Event Controller(PEC) The PEC provides a sort of DMA capability Interrupt driven single cycle data transfer Transfer count option (std. CPU interrupt after programmable number of PEC transfers) Eliminates overhead of saving and restoring system state for interrupt requests

14 2-14 Intelligent On-Chip Peripheral Subsystems 24-channel 10-bit A/D Converter with programmable conversion time (7.76 us min.) Two 16-channel Capture/Compare Units with 2 independent time bases. Useful for pulse and waveform generation e.g. Ingition firing sequence for a car engine. 4-channel Pulse width Modulation(PWM) unit Two General Purpose Timer Units  GPT1: Consisting of three 16-bit timers/counters, maximum resolution fCPU/8  GPT2: Consisting of two 16-bit timers/counters, maximum resolution fCPU/4

15 2-15 Intelligent On-Chip Peripheral Subsystems Asynchronous/Synchronous Serial Channels (USART) with baud rate generator, parity, framing, and overrun error detection High Speed Synchronous Serial Channel programmable data length and shift direction Two on-chip CAN Bus Modules(V 2.0B) active Real Time Clock Watchdog Timer with programmable time intervals Bootstrap Loader for flexible system initialization

16 2-16 Other features Different Temperature Range Devices  0 to + 70 °C, – 40 to + 85 °C, – 40 to °C Infineon CMOS Process  Low power CMOS technology including power saving Idle and Power Down modes 144-pin Plastic Metric Quad Flat Pack (MQFP) Package  P-MQFP, 28 ´ 28 mm body, 0.65 mm (25.6 mil) lead spacing,surface mount technology.

17 2-17 Acronyms ADC Analogue to Digital Converter ALE Address Latch Enable ALU Arithmetic and Logic Unit ASC Asynchronous/synchronous Serial Controller CAN Controller Area Network (License Bosch) CAPCOM CAPture and COMpare unit CISC Complex Instruction Set Computing CMOS Complementary Metal Oxide Silicon CPU Central Processing Unit EBC External Bus Controller ESFR Extended Special Function Register Flash Non-volatile memory that may be electrically erased GPR General Purpose Register GPT General Purpose Timer unit HLL High Level Language IO Input/Output OTP One Time Programmable memory PEC Peripheral Event Controller PLA Programmable Logic Array PLL Phase Locked Loop PWM Pulse Width Modulation RAM Random Access Memory RISC Reduced Instruction Set Computing ROM Read Only Memory RTC Real Time Clock SDD Slow Down Divider SFR Special Function Register SSC Synchronous Serial Controller WDT Watch Dog Timer XBUS Internal representation of the External Bus XRAM On-chip extension RAM


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