Presentation on theme: "The Center for Advanced Microelectronics Manufacturing"— Presentation transcript:
1 The Center for Advanced Microelectronics Manufacturing (CAMM)Towards Low-Cost, Mass-Produced Ubiquitous ElectronicsBahgat Sammakia, Mark D. Poliks, Mary Beth CurtinUSDC Flexible Displays and Microelectronics Conference, February, 2007
2 CAMM MissionThe CAMM will demonstrate the feasibility of roll-to-roll electronics manufacturing by acquiring prototype tools and establishing processes capable of producing low volume test bed products.
3 Center for Advanced Microelectronics Manufacturing ApplicationsSensors & ReliabilityMaterial & Process SuppliersArmyFlexible Display CenterProcessEquipmentNovel PackagingFundamentalsDevices
4 CAMM Revenue Sources USDC equipment awards - $ 11.5M New York State -- “High Tech Commercialization” - $21M with over $4M allocated for CAMM-- New York State Office of Science, Technology and Academic Research (NYSTAR) - $1.7MFederal Government-- NASA and DoD: $8M for R2R line infrastructure, prototypes for space and defense applications-- Peer reviewed grantsIndustrial Memberships-- Memberships projected at 8 Full Partners and 12 to 15 Participating MembersCompany specific projects and test-beds
5 CAMM Organizational Structure Deans ofWatson School of EngineeringHarpur CollegeSchool of ManagementCornell UniversityFundamentalsMaterials & ProcessesChristopher OberMichael ThompsonEmmanuel GiannelisGeorge MalliarasGerald SonnenfeldBinghamton University Vice President for ResearchTerrence KaneAssociate DirectorEconomic DevelopmentBahgat Sammakia -- CAMM DirectorMark PoliksCAMM TechnicalDirectorMary Beth CurtinAdmin & DevelopmentDirectorWayne JonesEducation & OutreachDirectorM DeGennaroProjectCoordinatorLaboratoriesL Lehman, Ph.D.S3IP Laboratory ManagerNew Professional Hire (start 4/15)Research ScientistChristopher ChaseSenior TechnicianP Moschak, EIFacility ManagerApplicationsIndustrial Test VehiclesPrototypesCJ ZhongCAMMEconomic DevelopmentTechnology Transfer & LicensingMaterialsCJ ZhongHoward Wang & Timothy SinglerCAMMResearch FundingDevelopmentTheresa PartellDesignElectrical-Mechanical-ThermalHow Lin, EIProcess DevelopmentTool QualificationDaryl SantosECATIEEC InterfaceTool DevelopmentPaul Wickboldt, ConsultantSarah LamMohammed KhasawnehFrank Egitto,EIKim Blackwell, EIMetrologySurface & interface ScienceSB ParkJunghyun ChoCommunications &Marketing
6 New York State Center of Excellence on Small Scale Systems Integration and Packaging Center at Binghamton UniversityExpertise resident at the Small Scale Systems Integration and Packaging Center (S3IP), a NYS Center of Excellence. Includes collaborations with the CAMM, the Integrated Electronics Engineering Center (IEEC), a NYS Center of Advanced Technology, the Institute of Materials Research (IMR), and the Center for Advanced Sensors and Environmental Systems (CASE).Analytical and Diagnostics Laboratory $15M in instrumentation including SEM, TEM, FIB, optical microscopes, metrology tools, mesoscale fabrication, vibrations, and 6” micro fabrication lab.Facilities will be available to CAMM members and partners
7 S3IP Analytical and Diagnostics Laboratory Dr. Lawrence Lehman, Lab ManagerSample Prep, MetallographyFIBMesoscale Machine ShopTEMSEMX Ray ToolsSEM / AFM & sample prepMicroscopy, thermal analysis,laser vibrometry
9 CAMM Facilities at Endicott Interconnect Technologies Peter Moschak, Facility Manager Panel Microfabrication Laboratory- $1M in tooling- Feature sizes greater than 1 m- Suitable for prototyping and early developmentInitial tool set by May 2007Tamarack projection printerKDF sputter-down systemNew CAMM Clean Room- $430K ProjectProject completed December, 2006Ready for Azores tool (first CAMM tool) delivery in Feb 2007and other tools to follow in 2007 and 2008
10 CAMM Facilities at Endicott Interconnect Removed HTCC~ 64,000 square feet per floorLab -- 53,000 sq ft lab & Service Core sq ft
11 Clean Room Expansion Completed Wall opening for vacuum depositionView toward existing clean roomPass through to spray toolsAzores tool location (left)
12 System Supplier *USDC supported Defined Systems Precision Lithography Stepper*AzoresLarge High Vacuum Coater*CHASecond High Vacuum CoaterIn purchaseHigh Vacuum Coating ServicesCPIIn-line Defect Inspection*ECD-IVOLED Evaporation Source*KJLCleaning/Wet ProcessKraemer KoatingWet Stripper/DeveloperHöllmüller SiegmundPrecision Wet Coat & BakeFrontier IndustrialManual Inspection TableTBD*USDC supported
13 Cleaning/Wet Processing Scrub/RinsePoly TankSSTankRewindUnwindAir KnifeKraemer Koating, 20016” to 14” widthDesigned for cleaning and/or wet processingRecirculation w/ cascading possible0.2 to 10 FPM0.5 PLI to 1.6 PLITool ready for installation
14 Wet Stripper/Developer Hollmuller-Siegmund (MacDermid)Up to 15” web widthDesigned for develop & strip processingHeated tanks: three process and two rinseStripper: all stainless steel(formerly DuPont Riston II S-1100X)Developer: all polypropylene(formerly DuPont Riston II D-2000)tool now ready for useTMAH/NaOH(aq)Air KnifeNew Northfield Automation web handling in place
15 Precision Lithography Azores CorporationBased on a proven FPD stepper8” width, can handle up to 24” with new chucksg – line (436 nm); 4 m L/S; mm/min400 ppm distortion compensationRequires hole-punch pattern for pre-alignmentTime lineJuly 06: Customer demonstrationAug 06: Start facilities acceptance testsSept 06: Start CAMM staff training at AzoresOct. 20: FAT startedJan 07: Complete factory acceptance testsMar 07: System arrives at CAMMWeb handlers in test
16 CHA High Vacuum Coater CHA Industries, 2006 8’ to 24”web width, ~1000ft of 7mil5 standard PVD stations or flexible configurations, with open bayInterleaf capability to be includedNo front surface contact~10-7 Torr vacuumTimelineSignificant delaysCHA re-bid remainder of jobWeekly status review by USDCEstimated delivery to CAMM: YE07
17 Second High Vacuum Coater Timeline: Delivery/Installation 9 months after purchase
18 HV Coating at CPIPotential source of coating services at Centre for ProcessInnovation, CPI (Wilton, England).Bobst OptilabWeb widths: 20”12 to 250 mRoll diameter 16”6” coreClass 1000 clean roomUp to four sputter zones:Single and twin cathodesPlanar and rotatableSeparate plasma treatment w/cooled drum
19 ECD-IV Defect Inspection Web scratch identification and defect mappingTwo component systemweb (in-line) inspection “head”web handling systemInspectionWidth of 6” (extendable)Target defect size to detect: (1 to 5) mScratch detection algorithm ( 1 x 10 m)Web location tracking & mapping of defectsPass/fail sensitivity can be setminimum defect size: 3 m or lessWeb handling: widths up to 24”6” core & roller diameter2 to 200 mInterleaf capableTimeline:2Q shipment to CAMM2H ongoing testing program withECD support verify performance
20 Precision Wet Coating & Bake Start: OutsourceLater: In-HouseFrontier Industrial, Towanda, PAHigh precision slot-die coating & bakeFilms down to 0.07 m thicknessClean room capabilityWeb handling: interleafing and windingContract services by purchase orderDynaCoat
21 Scanning Projection Lithography TamarackUV projectionNon-contact projection printerNA from 0.07 to 0.14400 x 500 mm expose area2 kW mercury short arc lamp> 3000 mW/cm2 BB UV ( nm)Filter selectable I, I+H, H+G, G line4 m resolution (NA=0.14)Positive & negative resists, 2 to 100 mTo be delivered May 2007
22 In-Line Sputter Down, Batch Deposition System KDFPallet size 20” x 20” (minimum)Single-ended loadingDual-level vacuum load lockStainless steel (304) chambersShielded sputter targets (4), DC/RFinitially Cu (2), Cr, TiUltimate pressure ≤ 10-7 torrSubstrate pre-heatPlasma etch (Ar or O2) & RIETo be delivered June 2007KDF 900 Series
23 First Year Research Projects Photolithography on Flexible SubstratesRoll-to-Roll (R2R) Fabrication of Flexible Sensor Arrays (FSA) on Polymer SubstratesMaterials and Processing for Inkjet Printing Fabrication of Flexible ElectronicsExploratory Research in Inkjet Printing of Functional Electronics Materials on Surface Energy-Modified Flexible SubstratesAdaptive Human-Centered Automation for Control of Advanced Microelectronics Manufacturing SystemsWrinkling of the Multi Layered Laminate for Flexible Display During Processing and Thermal LoadingOxygen and Moisture Barrier Coatings for Organic ElectronicsNYSTAR / CAMM Supported Research Activities at Cornell University
24 Photolithography on Flexible Substrates Mark Poliks, Bahgat Sammakia, Daryl Santos Three graduate student research assistants: Hao Zhang, Srikanth Poranki and Denisse Yepez.Team is working with Azores Corp on the tool acceptance, qualification and training.Project established to define the web based photo-lithography process for photoresists, web coating and wet processes needed to create 2 – 10 m features on flexible substrates.
25 Photolithography on Flexible Substrates Mark Poliks, Bahgat Sammakia, Daryl Santos Registration and substrate dimensional stability will be characterized for PET (and PEN, PI) in single and multiple photolithography passes; an analytical model will be developed to characterize the materials and process interactions.Team has received additional training at the Web Handling Training course at OSU Web Handling Research Center and at the CNF at Cornell University.In 2007 team will develop a process to create a continuous flexible circuit array on PET with variable size test patterns: 2 – 100 m.
26 C. J. Zhong, Susan Lu and Jin Luo Roll-to-Roll (R2R) Fabrication of Flexible Sensor Arrays (FSA) on Polymer SubstratesC. J. Zhong, Susan Lu and Jin LuoTask Description- Design and R2R fabrication of FSA chips- Optimization of nanostructured thin films on FSA chips,- Feasibility & characterization of R2R fabrication process.Deliverables- a method for assembling nanostructured thin films on FSAs- feasibility for fabricating FSA chips on polymer substrates- feasibility for R2R processingCompleted the initial design of FSA masks, for both R2R processing and standard microfabrication: ongoing. Tested PET polymer substrate in exposures to different solvents: demonstrated the usability of PET.Goal by end of 2007: qualification of Azores & wet processing toolsby creation of 10 ft continuous sensor array with micron sized features
27 PCB on arbitrary substrate Materials and Processing for Inkjet Printing Fabrication of Flexible ElectronicsHoward WangThis project aims at addressing key materials and processing issues in inkjet printing fabrication of polymeric thin film transistors, and developing printing tools with environmental control and in situ sintering and diagnostic capabilities.Silver nanoparticle synthesis and characterizationInk formulation for Dimatix printerSmall angle scattering measurement of regioregular poly(3-alkylthiophene) conformation in solutionsPCB on arbitrary substrate200 nmSEM: Deposited Ag NP
28 Exploratory Research in Inkjet Printing of Functional Electronics Materials on Surface Energy-Modified Flexible Substrates Timothy SinglerProject will improve deposition methods for delivery of small amounts of functional materials to predefined areas on substrates.Goal is to make electronic materials attractive for use with R2R processing. Project will make use of inkjet technology for deposition of these electronic materials.Inkjet equipment identified and ordered.Collaborations established with-- Endicott Interconnect Technologies (substrate energy modification) and-- Levich Institute at CUNY (theoretical modeling of inkjet printing of colloidal suspensions)
29 Adaptive Human-Centered Automation for Control of Advanced Microelectronics Manufacturing Systems Sarah Lam and Mohammed KhasawnehDevelop a conceptual framework for a computer-based training simulator for the photolithography tool.R2R lithography system will be used to test research on intelligent automation. Focus of project is on multiple levels of automation (LOAs) that adapt to the machine operator’s behavioral state.Will create a training simulator prototype and structure.Completed task analysis, error taxonomy, and software/hardware requirements and structure
30 Wrinkling of the Multi Layered Laminate for Flexible Display During Processing and Thermal Loading S.B. Park and Jia GaoTask Description: The deformation of thin film on flexible substrate under thermal loading. Compressively strained elastic film bonded to substrate can form wrinkles. Compliant substrate technology for flexible display applications requires the films to be flat as formation of wrinkles may dramatically change optical pattern.Development of effective finite element model using commercial FEM code for simulating the multi-layered laminate wrinkling as well as the stress analysis (2Q07)Development of instrumentation to validate FEM results and identify failure modes. (4Q07)Anticipated Results: Establish effective finite element modeling guidelines for predicting the wrinkle formation and growth of various geometries of interest and failure metrics for the composite structure under thermal loading.Project awarded in January, 2007.
31 Project awarded in January 2007. Oxygen and Moisture Barrier Coatings for Organic Electronics Junghyun ChoProject will use self assembled monolayers as a template for the deposition of ceramic barrier coatings on polymer substrates, as well as on OLED. Goal is to provide enabling processes and materials for the barrier coatings on R2R organic devices and structures.Project awarded in January 2007.Surface ModificationSAMSurface GroupBonding GroupSubstratebacedPrecursor solution (supersaturated)Bulk precipitateAggregateSchematic of precipitation processes in supersaturated precursor solution: a) nanocrystals (5-10 nm); b) aggregates (up to 1 mm); c) settling of an aggregate; d) uniformly adsorbed nanoparticles at the surface; e) an aggregate formed at the surface.
32 NYSTAR / CAMM Supported Research Activities at Cornell University Christopher Ober (coordinator), Emmanuel Giannelis, George Malliaras, Michael ThompsonFocused on fundamental research aimed at new processes and materials for flexible electronics. This program is highly complementary and interactive with the Binghamton University and CAMM research programs.Electroluminescence and Photovoltaic Response in Ionic Junctions Made with Soft-Contact Lamination (Malliaras)Laser Transient Annealing of Organic Semiconductors for Flexible Plastic Substrates (Thompson and Malliaras)3) BaTiO3 Films on Flexible Plastic Substrates via Pulsed Laser Annealing (Giannelis and Thompson)4) Green Processing for Flexible Electronics using Supercritical CO2 (Ober and Malliaras)
33 Summary Tooling New CAMM clean room completed. Azores tool to be delivered in February 2007 and qualification to begin during 1Q07.Wet spray process tool equipped with Northfield Automation handlers. Tool is ready for use.Tamarack and KDF systems to be delivered by June 2007.ECD-IV inspection tool to arrive 2Q07.FundingOver $ 30 million in NY State and Federal funds raised in support of S3IP and CAMMResearchOver 11 CAMM funded research projects started since 3Q06PersonnelMr. Peter Moschak named CAMM Facility ManagerMr. Christopher Chase hired as Senior TechnicianDr. L. Lehman hired as research scientist in S3IPSecond research scientist hired, to start 2Q07
34 For Further Information Bahgat Sammakia, DirectorCenter for Advanced Microelectronics ManufacturingBinghamton UniversityBinghamton, NY
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