1. The Center for Advanced Microelectronics Manufacturing
(CAMM)
Towards Low-Cost, Mass-Produced Ubiquitous Electronics
Bahgat Sammakia, Mark D. Poliks, Mary Beth Curtin
USDC Flexible Displays and Microelectronics Conference, February, 2007

2. CAMM Mission
The CAMM will demonstrate the feasibility of roll-to-roll electronics manufacturing by acquiring prototype tools and establishing processes capable of producing low volume test bed products.

3. Center for Advanced Microelectronics Manufacturing
Applications
Sensors & Reliability
Material & Process Suppliers
Army
Flexible Display Center
Process
Equipment
Novel Packaging
Fundamentals
Devices

4. CAMM Revenue Sources USDC equipment awards - $ 11.5M New York State
-- “High Tech Commercialization” - $21M with over $4M allocated for CAMM
-- New York State Office of Science, Technology and Academic Research (NYSTAR) - $1.7M
Federal Government
-- NASA and DoD: $8M for R2R line infrastructure, prototypes for space and defense applications
-- Peer reviewed grants
Industrial Memberships
-- Memberships projected at 8 Full Partners and 12 to 15 Participating Members
Company specific projects and test-beds

5. CAMM Organizational Structure
Deans of
Watson School of Engineering
Harpur College
School of Management
Cornell University
Fundamentals
Materials & Processes
Christopher Ober
Michael Thompson
Emmanuel Giannelis
George Malliaras
Gerald Sonnenfeld
Binghamton University Vice President for Research
Terrence Kane
Associate Director
Economic Development
Bahgat Sammakia -- CAMM Director
Mark Poliks
CAMM Technical
Director
Mary Beth Curtin
Admin & Development
Director
Wayne Jones
Education & Outreach
Director
M DeGennaro
Project
Coordinator
Laboratories
L Lehman, Ph.D.
S3IP Laboratory Manager
New Professional Hire (start 4/15)
Research Scientist
Christopher Chase
Senior Technician
P Moschak, EI
Facility Manager
Applications
Industrial Test Vehicles
Prototypes
CJ Zhong
CAMM
Economic Development
Technology Transfer & Licensing
Materials
CJ Zhong
Howard Wang & Timothy Singler
CAMM
Research Funding
Development
Theresa Partell
Design
Electrical-Mechanical-Thermal
How Lin, EI
Process Development
Tool Qualification
Daryl Santos
ECAT
IEEC Interface
Tool Development
Paul Wickboldt, Consultant
Sarah Lam
Mohammed Khasawneh
Frank Egitto,EI
Kim Blackwell, EI
Metrology
Surface & interface Science
SB Park
Junghyun Cho
Communications &
Marketing

6. New York State Center of Excellence on Small Scale Systems Integration and Packaging Center at Binghamton University
Expertise resident at the Small Scale Systems Integration and Packaging Center (S3IP), a NYS Center of Excellence. Includes collaborations with the CAMM, the Integrated Electronics Engineering Center (IEEC), a NYS Center of Advanced Technology, the Institute of Materials Research (IMR), and the Center for Advanced Sensors and Environmental Systems (CASE).
Analytical and Diagnostics Laboratory $15M in instrumentation including SEM, TEM, FIB, optical microscopes, metrology tools, mesoscale fabrication, vibrations, and 6” micro fabrication lab.
Facilities will be available to CAMM members and partners

7. S3IP Analytical and Diagnostics Laboratory
Dr. Lawrence Lehman, Lab Manager
Sample Prep, Metallography
FIB
Mesoscale Machine Shop
TEM
SEM
X Ray Tools
SEM / AFM & sample prep
Microscopy, thermal analysis,
laser vibrometry

8. S3IP Analytical and Diagnostics Laboratory
EM Suite
SEM: Zeiss Supra 55 VP, Analytical Ultra High Resolution FESEM, w/ EDAX Pegasus EDS + EBSD
SEM: Zeiss EVO50XVP SEM
TEM: 200-kV Field Emission Transmission Electron Microscope
FEI FIB: Dual Beam-SEM/FIB
Surface Analysis Lab
Ellipsometer
Profilometer (non contact), Profilometer (Stylus)
AFM
X-ray Tools
X-ray Diffraction, Panalytical X'Pert MRD Pro
X-ray imaging system: Phoenix nanome/x
Real Time X-Ray Analysis System
Small Angle Scattering X-ray tool
Thermal Analysis Suite
Thermal Analysis Instrument suite;
DSC, TGA, DMA, TMA, Rheometer, TG-MS
Flash Thermal Diffuse Tool
Optical / Acoustic Imaging Lab
Upright Metallograph: Axioimager M1m
Inverted Metallograph: Axiovert microscope
Motorized Stereo Microscope w/ 2 cameras: (Stereo Imaging)
15 Stereo inspection microscopes: DV4 Stereo Microscope
Image processing work stations #1 and #2
Heating and Cooling stage
Optical / Acoustic Imaging Lab
Micro Particle Imaging Velocimeter
Ultra-fast Laser Confocal Imaging System
High speed DIC camera
Laser Dopler Vibrobrometer
CSAM Acoustic Microscope
Miscellaneous equipment
Ink Jet Research setup
GC-MS
SEM Prep Lab
Specimen preparation ion beam tool for SEM
Disc Punch, Ultrasonic cutter, Dimple Grinder
Ion Mill, Plasma Cleaner
Carbon Evaporator & Metal Sputter coater
Twin Jet Thinner, Wire Saw
Metallographic Prep Lab
Automatic Polisher
Manual Polisher
Diamond Saw, RPM
Low Speed Diamond Band Saw, RPM
2 Unmounted specimen polishing system
Diamond Band Saw
Meso-Scale Machining Tools
Hardinge HLV Lathe
Levin Instrument Lathe w/Cabinet
Levin Microdrilling Machine w/Cabinet
Levin Micro Drill Press-machine, precision lathe
Hardinge (Bridgeport) CNC/Manual Milling Machine
Production Drill Press 15"
ZCorp Spectrum 510+ Rapid Protyping Tool

9. CAMM Facilities at Endicott Interconnect Technologies Peter Moschak, Facility Manager
Panel Microfabrication Laboratory
- $1M in tooling
- Feature sizes greater than 1 m
- Suitable for prototyping and early development
Initial tool set by May 2007
Tamarack projection printer
KDF sputter-down system
New CAMM Clean Room
- $430K Project
Project completed December, 2006
Ready for Azores tool (first CAMM tool) delivery in Feb 2007
and other tools to follow in 2007 and 2008

10. CAMM Facilities at Endicott Interconnect
Removed HTCC
~ 64,000 square feet per floor
Lab -- 53,000 sq ft lab & Service Core sq ft

11. Clean Room Expansion Completed
Wall opening for vacuum deposition
View toward existing clean room
Pass through to spray tools
Azores tool location (left)

12. System Supplier *USDC supported Defined Systems
Precision Lithography Stepper*
Azores
Large High Vacuum Coater*
CHA
Second High Vacuum Coater
In purchase
High Vacuum Coating Services
CPI
In-line Defect Inspection*
ECD-IV
OLED Evaporation Source*
KJL
Cleaning/Wet Process
Kraemer Koating
Wet Stripper/Developer
Höllmüller Siegmund
Precision Wet Coat & Bake
Frontier Industrial
Manual Inspection Table
TBD
*USDC supported

13. Cleaning/Wet Processing
Scrub/
Rinse
Poly Tank SS
Tank
Rewind
Unwind
Air Knife
Kraemer Koating, 2001
6” to 14” width
Designed for cleaning and/or wet processing
Recirculation w/ cascading possible
0.2 to 10 FPM
0.5 PLI to 1.6 PLI
Tool ready for installation

14. Wet Stripper/Developer
Hollmuller-Siegmund (MacDermid)
Up to 15” web width
Designed for develop & strip processing
Heated tanks: three process and two rinse
Stripper: all stainless steel
(formerly DuPont Riston II S-1100X)
Developer: all polypropylene
(formerly DuPont Riston II D-2000)
tool now ready for use
TMAH/NaOH(aq)
Air Knife
New Northfield Automation web handling in place

15. Precision Lithography
Azores Corporation
Based on a proven FPD stepper
8” width, can handle up to 24” with new chucks
g – line (436 nm); 4 m L/S; mm/min
400 ppm distortion compensation
Requires hole-punch pattern for pre-alignment
Time line
July 06: Customer demonstration
Aug 06: Start facilities acceptance tests
Sept 06: Start CAMM staff training at Azores
Oct. 20: FAT started
Jan 07: Complete factory acceptance tests
Mar 07: System arrives at CAMM
Web handlers in test

16. CHA High Vacuum Coater CHA Industries, 2006
8’ to 24”web width, ~1000ft of 7mil
5 standard PVD stations or flexible configurations, with open bay
Interleaf capability to be included
No front surface contact
~10-7 Torr vacuum
Timeline
Significant delays
CHA re-bid remainder of job
Weekly status review by USDC
Estimated delivery to CAMM: YE07

17. Second High Vacuum Coater
Timeline: Delivery/Installation 9 months after purchase

18. HV Coating at CPI
Potential source of coating services at Centre for Process
Innovation, CPI (Wilton, England).
Bobst Optilab
Web widths: 20”
12 to 250 m
Roll diameter 16”
6” core
Class 1000 clean room
Up to four sputter zones:
Single and twin cathodes
Planar and rotatable
Separate plasma treatment w/cooled drum

19. ECD-IV Defect Inspection
Web scratch identification and defect mapping
Two component system
web (in-line) inspection “head”
web handling system
Inspection
Width of 6” (extendable)
Target defect size to detect:  (1 to 5) m
Scratch detection algorithm ( 1 x 10 m)
Web location tracking & mapping of defects
Pass/fail sensitivity can be set
minimum defect size: 3 m or less
Web handling: widths up to 24”
6” core & roller diameter
2 to 200 m
Interleaf capable
Timeline:
2Q shipment to CAMM
2H ongoing testing program with
ECD support verify performance

20. Precision Wet Coating & Bake
Start: Outsource
Later: In-House
Frontier Industrial, Towanda, PA
High precision slot-die coating & bake
Films down to 0.07 m thickness
Clean room capability
Web handling: interleafing and winding
Contract services by purchase order
DynaCoat

21. Scanning Projection Lithography
Tamarack
UV projection
Non-contact projection printer
NA from 0.07 to 0.14
400 x 500 mm expose area
2 kW mercury short arc lamp
> 3000 mW/cm2 BB UV ( nm)
Filter selectable I, I+H, H+G, G line
4 m resolution (NA=0.14)
Positive & negative resists, 2 to 100 m
To be delivered May 2007

22. In-Line Sputter Down, Batch Deposition System
KDF
Pallet size 20” x 20” (minimum)
Single-ended loading
Dual-level vacuum load lock
Stainless steel (304) chambers
Shielded sputter targets (4), DC/RF
initially Cu (2), Cr, Ti
Ultimate pressure ≤ 10-7 torr
Substrate pre-heat
Plasma etch (Ar or O2) & RIE
To be delivered June 2007
KDF 900 Series

23. First Year Research Projects
Photolithography on Flexible Substrates
Roll-to-Roll (R2R) Fabrication of Flexible Sensor Arrays (FSA) on Polymer Substrates
Materials and Processing for Inkjet Printing Fabrication of Flexible Electronics
Exploratory Research in Inkjet Printing of Functional Electronics Materials on Surface Energy-Modified Flexible Substrates
Adaptive Human-Centered Automation for Control of Advanced Microelectronics Manufacturing Systems
Wrinkling of the Multi Layered Laminate for Flexible Display During Processing and Thermal Loading
Oxygen and Moisture Barrier Coatings for Organic Electronics
NYSTAR / CAMM Supported Research Activities at Cornell University

24. Photolithography on Flexible Substrates Mark Poliks, Bahgat Sammakia, Daryl Santos
Three graduate student research assistants: Hao Zhang, Srikanth Poranki and Denisse Yepez.
Team is working with Azores Corp on the tool acceptance, qualification and training.
Project established to define the web based photo-lithography process for photoresists, web coating and wet processes needed to create 2 – 10 m features on flexible substrates.

25. Photolithography on Flexible Substrates Mark Poliks, Bahgat Sammakia, Daryl Santos
Registration and substrate dimensional stability will be characterized for PET (and PEN, PI) in single and multiple photolithography passes; an analytical model will be developed to characterize the materials and process interactions.
Team has received additional training at the Web Handling Training course at OSU Web Handling Research Center and at the CNF at Cornell University.
In 2007 team will develop a process to create a continuous flexible circuit array on PET with variable size test patterns: 2 – 100 m.

26. C. J. Zhong, Susan Lu and Jin Luo
Roll-to-Roll (R2R) Fabrication of Flexible Sensor Arrays (FSA) on Polymer Substrates
C. J. Zhong, Susan Lu and Jin Luo
Task Description
- Design and R2R fabrication of FSA chips
- Optimization of nanostructured thin films on FSA chips,
- Feasibility & characterization of R2R fabrication process.
Deliverables
- a method for assembling nanostructured thin films on FSAs
- feasibility for fabricating FSA chips on polymer substrates
- feasibility for R2R processing
Completed the initial design of FSA masks, for both R2R processing and standard microfabrication: ongoing. Tested PET polymer substrate in exposures to different solvents: demonstrated the usability of PET.
Goal by end of 2007: qualification of Azores & wet processing tools
by creation of 10 ft continuous sensor array with micron sized features

27. PCB on arbitrary substrate
Materials and Processing for Inkjet Printing Fabrication of Flexible Electronics
Howard Wang
This project aims at addressing key materials and processing issues in inkjet printing fabrication of polymeric thin film transistors, and developing printing tools with environmental control and in situ sintering and diagnostic capabilities.
Silver nanoparticle synthesis and characterization
Ink formulation for Dimatix printer
Small angle scattering measurement of regioregular poly(3-alkylthiophene) conformation in solutions
PCB on arbitrary substrate
200 nm
SEM: Deposited Ag NP

28. Exploratory Research in Inkjet Printing of Functional Electronics Materials on Surface Energy-Modified Flexible Substrates Timothy Singler
Project will improve deposition methods for delivery of small amounts of functional materials to predefined areas on substrates.
Goal is to make electronic materials attractive for use with R2R processing. Project will make use of inkjet technology for deposition of these electronic materials.
Inkjet equipment identified and ordered.
Collaborations established with
-- Endicott Interconnect Technologies (substrate energy modification) and
-- Levich Institute at CUNY (theoretical modeling of inkjet printing of colloidal suspensions)

29. Adaptive Human-Centered Automation for Control of Advanced Microelectronics Manufacturing Systems Sarah Lam and Mohammed Khasawneh
Develop a conceptual framework for a computer-based training simulator for the photolithography tool.
R2R lithography system will be used to test research on intelligent automation. Focus of project is on multiple levels of automation (LOAs) that adapt to the machine operator’s behavioral state.
Will create a training simulator prototype and structure.
Completed task analysis, error taxonomy, and software/hardware requirements and structure

30. Wrinkling of the Multi Layered Laminate for Flexible Display During Processing and Thermal Loading S.B. Park and Jia Gao
Task Description: The deformation of thin film on flexible substrate under thermal loading. Compressively strained elastic film bonded to substrate can form wrinkles. Compliant substrate technology for flexible display applications requires the films to be flat as formation of wrinkles may dramatically change optical pattern.
Development of effective finite element model using commercial FEM code for simulating the multi-layered laminate wrinkling as well as the stress analysis (2Q07)
Development of instrumentation to validate FEM results and identify failure modes. (4Q07)
Anticipated Results: Establish effective finite element modeling guidelines for predicting the wrinkle formation and growth of various geometries of interest and failure metrics for the composite structure under thermal loading.
Project awarded in January, 2007.

31. Project awarded in January 2007.
Oxygen and Moisture Barrier Coatings for Organic Electronics Junghyun Cho
Project will use self assembled monolayers as a template for the deposition of ceramic barrier coatings on polymer substrates, as well as on OLED. Goal is to provide enabling processes and materials for the barrier coatings on R2R organic devices and structures.
Project awarded in January 2007.
Surface Modification
SAM
Surface Group
Bonding Group
Substrate b a c e d
Precursor solution (supersaturated)
Bulk precipitate
Aggregate
Schematic of precipitation processes in supersaturated precursor solution: a) nanocrystals (5-10 nm); b) aggregates (up to 1 mm); c) settling of an aggregate; d) uniformly adsorbed nanoparticles at the surface; e) an aggregate formed at the surface.

32. NYSTAR / CAMM Supported Research Activities at Cornell University Christopher Ober (coordinator), Emmanuel Giannelis, George Malliaras, Michael Thompson
Focused on fundamental research aimed at new processes and materials for flexible electronics. This program is highly complementary and interactive with the Binghamton University and CAMM research programs.
Electroluminescence and Photovoltaic Response in Ionic Junctions Made with Soft-Contact Lamination (Malliaras)
Laser Transient Annealing of Organic Semiconductors for Flexible Plastic Substrates (Thompson and Malliaras)
3) BaTiO3 Films on Flexible Plastic Substrates via Pulsed Laser Annealing (Giannelis and Thompson)
4) Green Processing for Flexible Electronics using Supercritical CO2 (Ober and Malliaras)

33. Summary Tooling New CAMM clean room completed.
Azores tool to be delivered in February 2007 and qualification to begin during 1Q07.
Wet spray process tool equipped with Northfield Automation handlers. Tool is ready for use.
Tamarack and KDF systems to be delivered by June 2007.
ECD-IV inspection tool to arrive 2Q07.
Funding
Over $ 30 million in NY State and Federal funds raised in support of S3IP and CAMM
Research
Over 11 CAMM funded research projects started since 3Q06
Personnel
Mr. Peter Moschak named CAMM Facility Manager
Mr. Christopher Chase hired as Senior Technician
Dr. L. Lehman hired as research scientist in S3IP
Second research scientist hired, to start 2Q07

34. For Further Information
Bahgat Sammakia, Director
Center for Advanced Microelectronics Manufacturing
Binghamton University
Binghamton, NY