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Koldlok Technical Briefing. Triton Corporate Overview Triton Technology Systems, Inc. Business Purpose Research, Develop, Manufacture and Deliver Products.

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Presentation on theme: "Koldlok Technical Briefing. Triton Corporate Overview Triton Technology Systems, Inc. Business Purpose Research, Develop, Manufacture and Deliver Products."— Presentation transcript:

1 Koldlok Technical Briefing

2 Triton Corporate Overview Triton Technology Systems, Inc. Business Purpose Research, Develop, Manufacture and Deliver Products and Services to: Eliminate Downtime and Improve Operations in Data Centre Facilities

3 Triton Locations Corporate Offices - Santa Fe, NM Regional Offices Tulsa, OK Manufacturing - Plainfield, NJ

4 KOLDLOK Customer List Southwestern Bell HSBC Bank West Group Texas Instruments BAE Systems Sun Microsystems Anheuser Busch Experion Fortis Information Microsoft Valero Energy Vodafone Sprint UPS Dresdner Bank JP Morgan Chase VISA Charles Schwab Cable & Wireless SIAC Bank of America Fujitsu Services BV Phillip Morris Tabacco Standard Chartered Bank

5 Group of Companies Triton Technology Systems The solutions company Computer Site Engineering The consulting engineering company The Uptime Institute Research & education

6 Solution Provider Successfully developed a suite of groundbreaking products and services Designed to increase the reliability and availability of data centres while Significantly reducing energy costs The quick financial payback frees up capital for investment in new IT equipment

7 Challenges - Increasing Heat Densities IT Business Continuity Information outages Business loss Raised-floor yield Costs Inefficient cooling Cancelled agreements Warranty Maintenance Facility Reliability Random outages Ghosts Operations Hot spots Low airflow Low static pressure HVAC incapacity Operations costs

8 Data Centre Equipment Trends Hotter equipment, packed in smaller footprints requiring more cooling capacity Additional cooling capacity typically comes from adding more cooling units Reclaim Lost Capacity before Adding More Seal unmanaged openings wasting cold air Increase airflow, static pressure and capacity Decrease cooling costs

9 Products & Services Briefing Agenda The Problem

10 100% of power is converted to heat Product heat densities are increasing Data centre cooling best practices are often counter intuitive! Mystery Misapplication

11 Product Heat Density Trend Chart Amdahl Cisco Compaq Cray Dell EMC HP IBM Intel Lucent Motorola Nokia Nortel Sun Unisys Thermal Management Consortium members

12 Example of Current High End Heat Loads IBM eServer Blade Centre13.3 kW3,000 W/ft²* Sun Sunfire14.0 kW2,800 W/ft²* RLX ServerBlade 3000i13.3 kW2,660 W/ft²* Dell PowerEdge 1655MC11.9 kW2,360 W/ft²* HP ProLiant Ble 9.0 kW1,800 W/ft²* Home Electric Oven 8.0 kW2,660 W/ft²* * Based on product footprint Trend chart mid-point 2003 projection = 1,200 W/ft²*

13 Cable Cutouts Waste Cooling Capacity Seal cut-outs Each cut-out wastes ~ 2kW cooling Remove perf tiles from hot aisles

14 Cooling Unit Airflow

15 Cooling Unit Airflow Plumes There is little mixing of cold air across the boundary layer of adjacent cooling unit discharge plumes Some mixing of returning hot air occurs

16 Precision Cooling Distribution Select the Right Perforated Tile

17 Bypass Airflow White Paper Extensive field research of data centres The typical, high end data centre had: 2.7 X required cooling capacity installed 10% of cabinets still had hot spot problems Risks the Business Continuity mission –Reduced reliability, ghosts and hardware failure 60% of conditioned airflow bypassed the computer equipment air intakes

18 Bypass Airflow Field Data - 23 Sites - 200,000 Ft²

19 Airflow Bypass Impacts 50% to 80% bypass air observed in many sites has three impacts - all unwanted Hot Spots Cooling unit incapacity Incapacity: Any condition that prevents cooling unit from delivering rated capacity - dirty filters, fouled surfaces, leaks, latent cooling, etc. Latent cooling penalty

20 Latent Cooling Penalty - From Bypass Airflow Reduction in return air temperature results in Latent Cooling which removes moisture from the air Moisture removed must be subsequently replaced to maintain relative humidity above the level required for computer hardware reliability The energy consumed to replace lost moisture (rehumidification) is the latent cooling penalty

21 Related Environmental & Reliability Bypass Airflow Issues Temperature Related Outages Too Cold - condensation shorts & bridges Cooling Unit Set-point Spiral Reducing set-point to force cooling lowers return air temperature which increases both cooling unit incapacity and latent cooling Humidity Related Outages Too High - condensation & latent cooling Too Low - electrostatic discharge 22°C 72°F / 45% RH Re-circulated becomes 29°C 85°F / 29% RH ESD Danger!

22 Products & Services Briefing Agenda The S olution Koldlok

23 Locate Perforated Tiles for Precision Delivery of Cooled Airflow Perforated tiles supply airflow to cabinet air intake

24 Seal Unmanaged Openings to Increase Airflow and Static Pressure Floating Hot Spot Trouble Shooter card indicates sufficient airflow to cool 3,200+ watts

25 Hot Aisle / Cold Aisle Implementation Minimises heated exhaust air from one cabinet flowing into air intake of adjacent cabinet

26 Aisles Parallel to Cooling Unit Airflow Plume Minimises exhaust re- circulation Maximises CFM per perf tile Minimises high velocity discharge

27 Products & Services Briefing Agenda Koldlok Product Overview

28 Koldlok - An Effective Way to Seal Unmanaged Openings Genesis 10 years of research and application identified that many data centres are at risk of heat-related equipment failures Development Koldlok is the result of extensive field investigation that determined how under floor air losses can be permanently minimised

29 Koldlok Product Overview Koldlok Raised-Floor Grommet Family Integral Koldlok (new cut-outs) Surface Koldlok (existing cut-outs) Extended Koldlok (large holes up to ½ tile)

30 Koldlok Product Overview Integral Koldlok (new cut-outs)

31 Integral Koldlok Description Integral & Split Integral Introduced January 2002 Tile cut-out dimensions (Tile Interior Centre) 9 3/16 x 6 3/4 (233 x 172 mm) Overall size ~ 11x 8 ¼ x 1 ¾ (279 x 210 x 44 mm) Usable opening ~ 8x 4 (203 x 102 mm) Multiple layers of different lengths cantilevered, opposing filaments Static dissipative

32 Integral Koldlok Product Features For new cut-outs Seals unmanaged openings Self-seals around cables Increases airflow & static pressure Bleeds of cable static charge Minimises cooling unit incapacity Dresses raw metal tile cuts for NFPA Gas fire suppression system savings

33 Integral Koldlok Application New raised-floor Installation Before equipment is installed Existing raised-floor application During equipment relocation During equipment swaps Includes Fasteners Self-tapping screws Foam stringer seal

34 Koldlok Product Overview Surface Koldlok Family (existing cut-outs)

35 Surface Koldlok Grommet Description Surface Model For existing openings Two part assembly w/joiner connection bars Removable installation Overall size 11x 8 ¼ x 1 ¾ (279 x 210 x 44 mm) Seals openings up to: 10x 7 (254 x 178 mm)

36 Surface Koldlok Features & Applications All Integral features plus: Attaches to surface of raised floor Split opening - surrounds cabling and seals opening Reusable - semi-permanent installation Note: Does not dress raw metal tile cuts (NFPA) Application Installed in data centres while equipment is operating without affecting operations Includes self-adhesive installation kit

37 Skirted Surface Koldlok Description & Application Skirted Surface Models For larger cut-out sizes Powder coated metal skirts Surface Koldlok Family Sizes

38 Koldlok Product Overview Extended Koldlok Family 6 (152 mm) Filaments; 24 (610mm) Long 6 (152 mm) Filaments; 24 (610mm) Long 3 ( 76mm) Filaments; 24 (610mm) Long 3 ( 76mm) Filaments; 24 (610mm) Long

39 Extended Koldlok Description Extended Models For large holes Dual filament rows 3 (76mm) mounting flange 24 (610mm) length Removable end caps Overall size 6 Filament Model: 24x 9x 1 ½ (610 x 229 x 38 mm) 3 Filament Model: 24x 6x 1 ½ (610 x 152 x 38 mm)

40 Extended Koldlok Features & Applications All Integral features plus Attaches to surface of raised floor Can be cut to fit shorter openings Applications Seals openings up to 6x 4 (152 x 102 mm) Dual units placed in opposing position to seal openings up to 12x 24 (305 x 610 mm - ½ Tile) Installed in data centres while equipment is operating without affecting operations Includes adhesive installation kit

41 Internal Test Report Conclusions Koldlok Grommet Report # Published May 1, 2002 Koldlok Sealing Effectiveness - Internal Test 100% Seal with no cable penetrations and static pressures up to 0.10 (3 mm) water column 92% worst case seal with multiple cable penetrations and static pressure up to 0.10 (3 mm) water column Assumes cables are not under tension and pulled against the sides of the Koldlok frame

42 Internal Test Report - Performance Test Data 8x 5 (203 x 127 mm) Cut-out opening wastes 148 CFM ? 703 Watts cooling 0.01 (0.3mm) static pressure) Sealing 8x 5 (203 x 127 mm) cable cut-outs regains capacity 2 cut-outs regain ? 1.4 kW or ~1 typical rack 20 cut-outs regain ? 14 kW or ~1 blade rack Sealing 400 each 8x 5 (203 x 127 mm) cable cut-outs regain Cool kW typical racks or Cool kW Blade Server racks or Eliminate ton / 10,000 CFM CU

43 Integral Koldlok Alternatives Fire Pillows Foam Sheets End User Specials Other Grommets Other?

44 Seal Cable Cutouts This is one way to prevent air loss. Additional refinement is needed.

45 Seal Cable Cutouts Plugging cable openings is good practice; a better choice of materials would be more appropriate

46 Seal Cable Cutouts This home-made solution works only until the first cable needs to be added or removed

47 Seal Cable Cutouts Ensuring that holes stay closed is an ongoing maintenance requirement with this makeshift approach. Typically, no one is responsible for patching holes

48 Seal Cable Cutouts Deformed foam from attempted cut-out seal

49 Seal Cable Cutouts Attempted seal

50 Seal Cable Cutouts

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55 Marketplace Applications Integral & Split Integral Koldlok New Data Centre Construction or Expansion New IT & Telecom Equipment Equipment Rotation / Swaps Surface & Skirted Surface Koldlok Existing Data Centre with Equipment in Place Hot Spots or Airflow Imbalance Maximise Rentable / Usable Space Extended Koldlok (Single or Dual Units) Larger Holes: ¼ to ½ Tile

56 Koldlok System Benefits Quick Financial Return Reduces capital & operations outlays Improves IT Hardware Reliability Stabilises temperature and relative humidity Hardens data centre Increases Raised-Floor Yield Cool more equipment, more effectively Supports business continuity mission

57 Koldlok Financial Payback Business case analysis - new Data Centre 10,000ft² w/400 racks and 400 cable cut-outs Hot / Cold Aisle w/200 perf tiles - 25% open Bypass air - through raised floor Before: 30% After: 10% Electricity cost: £0.06 kWH including demand Financial payback: 5 Months Capacity increase: Cool 8 blade systems


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