1. Meeting CERN 28 Nov. 2002 A.B.Lodge - RAL 1 ECAL CMS ECAL Mechatronics Task Force Meeting.. CMS ECAL Mechatronics Scheme Applicability to EE Meeting held 28 November 2002 at CERN Prepared by A.B.Lodge.

2. Meeting CERN 28 Nov. 2002 A.B.Lodge - RAL 2 ECAL CMS ECAL Mechatronics Task Force Meeting. The Current ECAL Electronics Cooling Design under discussion: At the present time there has been no opportunity to map this proposal on to the ECAL End Caps. It is the understanding of the ECAL (UK) community that this work will be carried out by the ECAL Cooling Team(with some support from UK Team Members) as part of the Design Study in finding a common ECAL solution for the Cooling and Integration of the Front End Electronics Readout. Discussions have started between CERN and the UK on this issue.

3. Meeting CERN 28 Nov. 2002 A.B.Lodge - RAL 3 ECAL CMS ECAL Mechatronics Task Force Meeting. The Current ECAL Electronics Cooling Design under discussion: Tuesday the 26 November 02 being the first time that the UK has had this scheme presented in detail ( not very clear on VRVS). It is therefore too early to objectively asses the acceptability of this scheme in relation to it being a truly common ECAL solution for the Cooling and Integration of the Front End Electronics Readout. There are still clearly a number of unanswered question with this scheme which will need to be addressed before a final decision could be made. Due to the demanding time scales for the ECAL project a decision on this issue can be made, but will result in a certain level of risk.

4. Meeting CERN 28 Nov. 2002 A.B.Lodge - RAL 4 ECAL CMS ECAL Mechatronics Task Force Meeting. The Current ECAL Electronics Cooling Design under discussion: Some Questions: –How will the Cooling Bars be fixed into position? –How will the Mother Cards be fixed to ensure alignment with VFE, LV Regs and FE Cards? –Is there sufficient space between Cooling Bars to accommodate LV Regulator Card components? –How do we ensure no damage to connectors when inserting cards? –Mother Cards will be trapped by Cooling Bars (how would we replace in the event of failure or damage)?

5. Meeting CERN 28 Nov. 2002 A.B.Lodge - RAL 5 ECAL CMS ECAL Mechatronics Task Force Meeting. The Current ECAL Electronics Cooling Design under discussion: Some Questions: –How will the Cooling Bars be stepped to follow EE moderator, if found to be necessary (space required to do this)? –Total number of Cooling Bars is high (EE geometry require a number of different lengths)? –Would this be feasible and what would be an acceptable maximum (without causing pressure drop problems, or temperature rise problems due to additional power dissipation)? –LV Power Distribution? –Fibre Optic Distribution & additional Optical Hybrids(space in Z)?

6. Meeting CERN 28 Nov. 2002 A.B.Lodge - RAL 6 ECAL CMS ECAL Mechatronics Task Force Meeting. The Current ECAL Electronics Cooling Design under discussion: Some Questions: –Where will the Services run on EE and how will they be supported (no intermediate or side plates)? –What about Token Ring Boards? –What about space for Slow Control (DCS)? –Additional height in Z will be require for Signal Umbilical termination / connection? –Space for Gas Purge system will also be required?