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Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI1 Si-FMD status Forward Detector meeting, CERN, 11 March 2003 Børge Svane Nielsen Niels Bohr.

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Presentation on theme: "Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI1 Si-FMD status Forward Detector meeting, CERN, 11 March 2003 Børge Svane Nielsen Niels Bohr."— Presentation transcript:

1 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI1 Si-FMD status Forward Detector meeting, CERN, 11 March 2003 Børge Svane Nielsen Niels Bohr Institute 1.Geometry of Si-FMD 2.Material constants 3.Electronics strategy 4.Cables and DCS 5.Heat dissipation and cooling

2 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI2 FWD detectors layout

3 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI3 Si1, T0_r & V0_r layout

4 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI4 FMD ring layout 512 Inner: Rin=4.2 cm Rout=17.2 cm Outer: Rin=15.4 cm Rout=28.4 cm 20x2x256=10,240 10x2x512=10, Full FMD = 3 inner rings + 3 inner rings + 2 outer rings 2 outer rings

5 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI5 Si1 mechanics model 1:1 Si detectors Support plate Digitizer card Beam pipe support ring Outer ring still missing

6 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI6 Si2 layout

7 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI7 Si3, T0_l & V0_l layout

8 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI8 Si1 assembly VA1’’ preamp+shaper: 128 ch Connector(s) for power, control, read-out Other components Si detector Support plates Si detectors Read-out electronics card on support plate back side Hybrid

9 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI9 Material constants Material type and thickness of one Si detector ring: LayerMaterialThickness Heat conductivity (W/m·K) Density (kg/m 3 ) Specific heat (J/kg  K) Silicon detector Si0.3 mm Hybrid Al 2 O mm FE electronics air + chips 10 mm (mostly air) Support Carbon fibre or aluminium honeycomb 2  0.5 mm C or Al + 10 mm air C: 24 Al: 222 C: 2200 Al: 2700 C: 691 Al: 900

10 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI10 Material constants Material type and thickness of one Si detector ring: LayerMaterialThickness Interaction length Radiation length Silicon detector Si0.3 mm0.6 · · Hybrid Al 2 O mm2.0 · · FE electronics air + chips 10 mm (mostly air) Support Carbon fibre or aluminium honeycomb 2  0.5 mm C or Al + 10 mm air C: 2.6 · Al: 2.5 · C: 0.5 · Al: 1.1 · Total thickness of one Si ring: C: 5.2 · I 1.8 · X 0 Al: 5.1 · I 2.4 · X 0

11 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI11 Read-Out strategy FMD Segment ON DETECTOR Digital serial links (15-20 m) Digital serial links (15-20 m) Trigger & Slow Ctrl IN CAVERN IN COUNTING ROOM Slow control & Trigger Slow control & Trigger Detector Data Link (50-60 m) Detector Data Link (50-60 m) FMD RCU VA 1 ring: 10/20 segments 2 Digitizers 1 RCU per side 1 DDL per side Full FMD: 70 segments 10 Digitizers 2 RCU’s 2 DDL’s FMD Read-Out and Control Electronics Analog serial link (10 MHz)  0.5 m Analog serial link (10 MHz)  0.5 m VA read-out control VA read-out control Local Controller DDL - INT Slow-Control Interface TTC-RX BOARD CTRL Data receiver FMD Digitizer ALTRO CTRL Read-out CTRL CTRL BSN, 21 Nov 2002

12 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI12 FEE test setup (1) BSN, 21 Nov 2002 FMD FEE test CTRL Power Biases Power Biases Clock 10 MHz Clock 10 MHz Trig in ALTRO tester ALTRO CTRL Ext clock Ext trigger Si detector VA

13 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI13 FEE test setup (2) ALTRO tester Si-strip detector + VA’’ preamp VA’’ read-out controller

14 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI14 FMD electronics FMD channel count Note: We have increased the number of strips, use more integrated FE chips with dynamic range 0-20 mips – red values are changed. Segments (wafers) Phi sectors Radial strips FE channels VA chips (128 ch/chip) ALTRO chips FMD Digitizers FMD RCU Si1 inner , Si1 outer , Si2 inner , Si2 outer , Si , Total system ,

15 15 C FMD DCS DCS Detector CAEN ? PVSS II Preamps CAEN ? Ethernet Database(s) OPC client DIM client High VoltagePreamps User interface PVSS II HVLV FMD Control room (ACR) [FSM?] Crate Control PCI-CAN? CAEN OPCserver PVSS II OPS client PCI-CAN? CAEN OPCserver PVSS II OPC client DIMserver Digitizers FMD Digitizers PCI-CAN? ? PVSS II OPC client C 2 28/02/03 EE FMD-RCU (PCI? VME?) 20 LV P 2 DDL PCI-Profibus Ethernet is considered as alternative P? ? 10 LVL0 trig TTC Counting room Cavern Inside magnet

16 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI16 Heat dissipation Heat dissipated by FE electronics of one Si detector ring: VA1’’ preamp chip (128 channels): 235 mW  80 chips = 19 W / ring Read-out electronics and power distribution:  5 W / ring Cooling: air flow between Si detector and support plate radiation from VA chips to support plate active (water) cooling of support plate?

17 Forward Detector Meeting, 11 Mar 2003Børge Svane Nielsen, NBI17 Si-FMD timetable AFRONT END (FE) READ OUT ELECTRONICSCompleted 1Demonstrate functionality of conceptual layout of FEE (Viking PA chip, control system, interface to ALTRO test board) April Final choice of VA pre-ampl. chip. RO testJune 1, Test FEE system coupled to sample Si detector. Source and electron beam tests.June 1, Design, construction and test of prototype FMD digitizer card (FMDD), RO test with ’mini’ FMD-RCU October 1, Full Si detector element + electronics chain RO with realistic RCU and DDL link to DAQ.June 1, 2004 BMECHANICS AND INTEGRATIONCompleted 1Full scale model manufactured (Si1)Feb 1, Cabling and Cooling issues resolvedApril 1, Full integration sequence decidedJune 1, 2003 C.SILICON DETECTORCompleted by 1Complete market surveyFeb 1, Define final specsMar 1, Place order for prototype with industryApril 1, Delivery Si-wafer prototypeJune 1, Start production of Si-hybrid FEE cardJune 1, Delivery prototype hybridAug 1, Si prototype test with FEE and BEE test RO setupDec 1, Place final order for Si with industryApril1, 2004


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