1. M.S. February 25, 2013 1 1 1 Ultimate-2 sensors preliminary summary of LBL probe test results Introduction Wafer maps:  1 STD epi, full thickness  5 high-res  2 DRIE Summary Distribution of Noise/FPN Additional slides

2. M.S. February 25, 2013 2 2 Introduction LBL probe testing procedure is currently used for testing and selecting sensors for ladder construction for the prototype detector The yield that we have observed so far is satisfactory IPHC requested several sensors for additional analysis of sensor performance 8 sensors were available at the time of the request Mathieu discovered several issues with the sensors he tested What is the impact of the identified problems on our testing procedure and sensor selection? ChipProbe testing resultsIssues identified at IPHC E05 w 205high vref2stuck vclp F05 w 205good (3rd category) B02 w 201bad pixels >1% B06 w 203(?) G02 w 204noisy A01 w 303goodhigh power consumption B01 w 303goodcorrupted frame structure C01 w 303hot pixels

3. M.S. February 25, 2013 3 3 Yield and wafer map – U2 thick, std epi A01A02 B01B02B03B04B05B06 C01C02C03C04C05C06C07C08 D01D02D03D04D05D06D07D08 E01E02E03E04E05E06E07E08 F01F02F03F04F05F06F07F08 G01G02G03G04G05G06 H01H02 Wafer 501: Tested:29 good:931% bad:1552% (?):517% Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP NOT TESTED Vref2 high Vref2 low Failed 160 MHz High VCLP High power Wire-bonded (power consumption – NA) A02 – ok at 3.3 V but cross-talk B02 – ok C06 – ok

4. M.S. February 25, 2013 4 4 Yield and wafer maps – wafer 201,202 xx x32223 22232x2x 23x223x3 2112x211 1121211x 121332 32 2x 2x112x 22C03122C071 x1D032221x 2E02211111 12111122 x1122x 21 Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP Vref2 high Vref2 low High VCLP High power Initial classification : colors Ladder selection criteria : numbers (grades) 1-3 Wafer 201: grade 111 grade 219 grade 39 dummies9 Wafer 202: grade 119 grade 218 grade 30 dummies7 other4 grade 2<1% bad pixels

5. M.S. February 25, 2013 5 5 Yield and wafer maps – wafer 203,204 -- -----3 ------12 ------11 -------2 2--2x1x2 ----11 H012 Wafer 203: grade 16 grade 26 grade 31 dummies 2 other1 Wafer 204: grade 118 grade 27 grade 33 dummies14 other1 -- 1xx1x2 1xxC04211x 21211211 11-11x1x 2131-31x x3xxx- x2 Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP Vref2 high Vref2 low High VCLP High power grade 2<1% bad pixels

6. M.S. February 25, 2013 6 6 Yield and wafer maps – wafer 205 xx 11x2x1 xx121C0612 x1211211 x1213121 x1113xF072 211x12 23 Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP Vref2 high Vref2 low High VCLP High power Wafer 205: grade 121 grade 211 grade 33 dummies11 other2 grade 2<1% bad pixels

7. M.S. February 25, 2013 7 7 Yield and wafer maps – 2 DRIE wafers A01x B01B02xB04B05B06 C01xx-C05C06xC08 D01D0231x1x1 1232113x 11x13133 1xG03xx3 23 Wafer 303: grade 111 grade 23 grade 3 8 dummies12 “skipped”12 Wafer 304: grade 119 grade 212 grade 36 dummies11 xx x31221 313112xx 1121212x 11211212 1x21311x x2133x 2x Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP Vref2 high Vref2 low Failed 160 MHz High VCLP High power grade 2<0.1% bad pixels grade 30.1-1.7 % bad pixels

8. M.S. February 25, 2013 8 8 Summary Tests at IPHC indicated holes in the currently used sensor selection procedure All identified issues had been measured in probe tests but were not part of the selection criteria It is necessary (and becoming urgent) to develop more advanced and automated sensor selection procedures – This has been one of the goals for the PXL construction project but has not been implemented yet

9. M.S. February 25, 2013 9 9 Noise and FPN measured in Ultimate 2 sensors 8 wafers

10. M.S. February 25, 2013 10 Noise and FPN measured in Ultimate 2 sensors wafer 501

11. M.S. February 25, 2013 11 Noise and FPN measured in Ultimate 2 sensors wafers 201-205

12. M.S. February 25, 2013 12 Noise and FPN measured in Ultimate 2 sensors wafers 303-304

13. M.S. February 25, 2013 13 Additional slides

14. M.S. February 25, 2013 14 Not classified sensors wafers 201-205

15. M.S. February 25, 2013 15 Yield and wafer maps – wafer 201,202 A01A02 B01B02B03B04B05B06 C01C02C03C04C05C06C07C08 D01D02D03D04D05D06D07D08 E01E02E03E04E05E06E07E08 F01F02F03F04F05F06F07F08 G01G02G03G04G05G06 H01H02 Wafer 201: good:3573% bad:1021% (?):36% Wafer 202: good:3675% bad:817% (?):48% A01A02 B01B02B03B04B05B06 C01C02C03C04C05C06C07C08 D01D02D03D04D05D06D07D08 E01E02E03E04E05E06E07E08 F01F02F03F04F05F06F07F08 G01G02G03G04G05G06 H01H02 Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP Vref2 high Vref2 low High VCLP High power

16. M.S. February 25, 2013 16 Yield and wafer maps – wafer 203,204 A01A02 B01B02B03B04B05B06 C01C02C03C04C05C06C07C08 D01D02D03D04D05D06D07D08 E01E02E03E04E05E06E07E08 F01F02F03F04F05F06F07F08 G01G02G03G04G05G06 H01H02 Wafer 203: good:1225% bad:3573% (?):12% Wafer 204: good:2654% bad:1940% (?):36% A01A02 B01B02B03B04B05B06 C01C02C03C04C05C06C07C08 D01D02D03D04D05D06D07D08 E01E02E03E04E05E06E07E08 F01F02F03F04F05F06F07F08 G01G02G03G04G05G06 H01H02 Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP Vref2 high Vref2 low High VCLP High power

17. M.S. February 25, 2013 17 Yield and wafer maps – wafer 205 A01A02 B01B02B03B04B05B06 C01C02C03C04C05C06C07C08 D01D02D03D04D05D06D07D08 E01E02E03E04E05E06E07E08 F01F02F03F04F05F06F07F08 G01G02G03G04G05G06 H01H02 Wafer 205: good:3573% bad:1225% (?):12% Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP Vref2 high Vref2 low High VCLP High power

18. M.S. February 25, 2013 18 Yield and wafer maps – 2 DRIE wafers A01A02 B01B02B03B04B05B06 C01C02C03C04C05C06C07C08 D01D02D03D04D05D06D07D08 E01E02E03E04E05E06E07E08 F01F02F03F04F05F06F07F08 G01G02G03G04G05G06 H01H02 Wafer 303: good:3369% bad:1327% (?):24% Wafer 304: good:3675% bad:1123% (?):12% A01A02 B01B02B03B04B05B06 C01C02C03C04C05C06C07C08 D01D02D03D04D05D06D07D08 E01E02E03E04E05E06E07E08 F01F02F03F04F05F06F07F08 G01G02G03G04G05G06 H01H02 Physical damage Failed JTAG or power Failed probe tests ? Hot/cold pixel <1% Hot/cold pixel >1% OK noisy Low VCLP Vref2 high Vref2 low Not in DB: A01, A02, B01, C01, C02, C03 Failed 160 MHz High VCLP High power