1. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 o IBL Stato e Richieste 2013 Riunione ATLAS / INFN Referee, 5 September 2012 G. Darbo – INFN / Genova Indico agenda: https://indico.cern.ch/conferenceDisplay.py?confId=205414

2. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 2 Production Status: Modules, Staves,… Bare Module: FE-I4B: 43 wafers delivered (31 from pre-production and 12 from production), 8 still to be tested – yield > 50% - enough wafer for IBL Sensor production: production completed from CiS (yield 90% on 150 wafers), CNM and FBK (60 wafers in spec with 3 good tiles), Bump-bonding at IZM: UBM completed on 119 planar and 53 3D wafers - 23 FE-I4B wafers – flip-chip of 81 DC and 55 SC modules - ~2 months delay. Dressed modules Module Flex (GE, vers.3): 1 st batch (150 DC + 125 SC) received from Phoenix and under component loading a Mipot. Dressed modules (Flex v.3 + FE-I4B): started production in Bonn and Genova Stave Stave Flex (GE, prod. at CERN): 1 st batch lost (over etching), ~2 months delay. Loaded Stave: Loaded and under system test Stave-0A (use FE-I4A modules) – Stave-0B will be loaded in September – Production stave will start loading in November (delay due to bare modules and stave flex). IBL Numbers: 14 Staves, 168 double-chip (DC) planar modules, 112 single-chip 3D modules IBL Numbers: 14 Staves, 168 double-chip (DC) planar modules, 112 single-chip 3D modules

3. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 3 Stave 0 : IBL Milestone! Fig.1 (Bonn): Photo Galleries: http://dpnc.unige.ch/atlas/upgrade/IBL/StaveLoading/Stave0/index.htmhttp://dpnc.unige.ch/atlas/upgrade/IBL/StaveLoading/Stave0/index.htm http://www.photoshop.com/users/nannino/albums/e8fb281d2b2b43b988d2a68854fbcab8#page=1 Module Assembly (Genova) Stave-0A (Loaded in Geneva) FBK: 3D sensors – V BD for IBL quality modules FBK: 3D sensors – I leak @ 20V for IBL quality modules (tested by provisional metal) 30 V 1 µA

4. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 4 Power (PP2) & R/O (ROD) Chain PP2 Electrical and mechanical specifications of boards (3 types) and crate completed – qualification done with patched Pixel old cards and FE-I4. Launched production of crates (10 units: 4 IBL + 2 nSQP + IBL tests on surface) – Board prototypes in production. ROD Version B: 5 boards produced – Presently there are complete setups (BOC + ROD) at Bologna and Wuppertal for firmware developers and at CERN for DAQ and system test development. Status: minor hardware fixes individuated for production version (C) – Initial firmware exist and successfully communicates from FE-I4B BOC ROD (only electrically at moment). Version C: plan to launch pre-production in a few weeks (~1 months for fully assembled/tested cards after PO is raised) – Complete production spring next year. ROD Ver.B IBL PP2 regulator I/O + controller 8 regul. = 8 ½ staves

5. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 5 IBL & Pixel in SR1 (2013) 5 STEP#3: stave integration with beam-pipe and services STEP#2: cooling pipe brazing to stave STEP#1: Stave testing before brazing cooling pipe Foreseen for PIXEL rework (nSQP) – limited access for radiation control 1 2 3 Cooling plant + e - racks for full IBL test with final R/O and PS IBL (2 staves) + Pixel System test

6. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 6 Integration & Installation Activities System Test When: now to >12/2013 INFN involved in: ROD + DAQ (R/O chain) and PP2 (power chain) IBL Integration in SR1 at CERN When: all 2013 INFN involved in: electrical services (stave flex, cables), full test of IBL (ROD/DAQ/PP2) Installation in the PIT When: starting late spring 2013 (services) to 2014 (IBL) INFN involved in: Off-detector commissioning with DAQ and DCS (2013/14), IBL connectivity test (2014). Note: installation scenario depends of extraction of the Pixels. IST (IBL Support Tube) installed in surface if Pixel are extracted, IBL in the pit.

7. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 7 Milestones 2012 e 2013 Stato of 2012 milestones (Aug.2012) Giugno 2012 - produzione ROD (versione finale) Stato: 70%. – ROD Vers.B in test (5 schede, 3 setup completi con BOC), Firmware parla con il FE-I4 – Vers.C (produzione, bug-fixes della Vers.B) in poche settimane. Luglio 2012 - Primo stave equipaggiato con moduli e servizi Stato: 90 % - (stave 0 versione FE-I4A). Dicembre 2012 – Completamento produzione di (bare moduli) Stato: bump-bondati 81 double-chip e 55 single-chip moduli – ritardo ~2mesi Milestones 2013 Giugno 2013 - Completamento della produzione di Moduli IBL con flex Settembre 2013 - Qualifica della catena completa di R/O (dal FE al ROD) Giugno 2013 - Commissioning del sistema completo di alimentazione LV in SR1

8. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 8 BACKUP SLIDES IBL

9. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 9 Richieste Finanziarie IBL e Resp. Richieste finanziarie 2013 (escluso MI/ME) Responsabilità IBL

10. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 10 BACKUP SLIDES AFP

11. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 11 FE-I4A Dicing off top pads test Test done with FE-I4A. Diced off top pad test (80 µm instead of 220µm). Tested chip shows no damage FE-I4B need to be tested, but <100 µm should be feasible Ref.: M. Garcia-Sciveres, P. Murray, G. Shaw LBNL Sept. 15, 2011

12. IBL - 2013 G. Darbo – INFN / Genova Roma, 5 September 2012 12 40 m 6 th cut 5 th cut 3 th cut 1 st cut p+ (ohmic) columns n+ (junction) columns IBL FBK 3D are very suitable for thin(ner) edge. One row of ohmic holes is sufficient to stop the depletion region: ~100µm edge. 3D FBK Thin Edge Ref.: G.-Giacomini et al., 6th Trento Workshop, 2-4 March 2011 (http://tredi.fbk.eu)