1. HV-CMOS Hybridization
G. Darbo – INFN / Genova
Future Pixel Chip Design – Vidyo 18 Mar 2014
On Behalf of Genova ATLAS Pixel
& Genova Low Temperature Detector (LTD) Lab
Indico agenda:

2. How to Glue HV2FEI4 to FE-I4
Requirements:
Thin uniform dielectric layer (5 µm?)
Precise alignment of the two chips (bumps are 18µm diameter and minimum 50µm pitch on FE-I4 side)
Issues on “glue & press”
Difficult to keep parallelism
Difficult to keep calibrated spacing (~impossible once HV-CMOS reaches full size)
How to align chips in XY (if capacitors are not cantered cross-talk)
Deposit Glue
FE-I4 CHIP
Apply pressure
HV2FEI4
FE-I4 CHIP

3. CCPD HV-CMOS - Hybridization
How to improve – process steps:
Use spacers: patterned photoresist pillars on FE-I4
Spin SU-8 photoresist (rad-hard) on FE-I4 to desired thickness
Use mask for making pillars and clean rest of the surface
Apply glue (or SU-8 again) to have a thin layer
Apply pressure until pillars are in contact with HV2FEI4
Test done – see talk at 9th Trento WS by M. Biasotti:
Spin SU-8 photoresist
Pattern pillars by mask
R/O CHIP
Glue deposition
R/O CHIP
Align & pressure
R/O CHIP
DETECTOR CHIP
Ref.: M. Biasotti et al., 9th “Trento” Workshop – Genova 26-28/2/2014
Low Tempreature Detector facility – LTD Genova
2x2 pillar height test:
distance 4 mm
height in µm
The tiny HV2FEI4p1 prototype glued on the large FE-I4
FE-I4
Pillar 1
5.92
Pillar 2
6.07
Pillar 3
Pillar 4
HV2FEI4
2.2 × 4.4 mm2
60 columns × 24rows

4. How Genova May Contribute to CCPD Hybridization
Genova has expertise and instruments
>20 years development of pixel detectors (ATLAS) and low temperature detectors (LTD)
Process on dies (not full wafer)
We may consider to do more than gluing – look at the combined facilities at the same department floor!
Collaboration between
ATLAS Pixel Lab (APL)
Low Temperature Detector (LTD) Genova Lab (see next slides)
ATLAS Pixel Lab (Genova) – APL
KLA-TENCOR P7 stylus profiler
Scan length: 150mm - 6” wafer
Repeatability/reproducibility: 4/15 Å
Vertical resolution: 0.01/0.60 Å
Manual flip-chip machine

5. Micro-fabrication and Thin Film Facility - Genoa LTD Lab
Laser shot for Ir, W, Re deposition
PLD film deposition
Thin Film Growth Systems
2 E-guns 4 material 10-9 mbar
2 AC & 1 DC Magnetron Sputtering Systems
Pulsed Laser Deposition mbar
Micro-fabrication
Reactive Ion Etching, Plasma & Wet etching
2 Mask Aligners, Oxygen Plasma & Ion Beam
Critical Point Dryer
Class1000-CR for lithography
TES on SiN membrane

6. Micro-fabrication and Thin Film Facility - Genoa LTD Lab
Bolometer for 145 GHz-Back etched and spiderweb shaped SiN membrane on Si wfr
250 µm
10 µm
Cryogenic Silicon Ballistic Phonon detector for GeV cosmic protons for L2 orbit payload
5 µm

7. Next Steps Then… Try pillars technique on full size 2x2 cm2
Glue face-to-face FE-I4 to FE-I4
Deposit SU-8 on FE-I4, mask off and leave columns, measure height
Glue and align second FE-I4 using manual flip-chip machine
Make sections and measure thickness
Then…
… proceed with functional components