1. IBL Insertable B-Layer
ATLAS Italia / Referee
Roma, July 14th 2010
G. Darbo – C. Meroni
INFN / GE – MI
On behalf of INFN IBL
Agenda:

2. Outline Status of the IBL project
With focus on INFN related activities
Status of the Technical Design Report (TDR)
Schedule
Consolidation of the Physics & Performance case for IBL
Interim-Memorandum of Understanding
Cost, resources, sharing
Richieste finanziarie e attività 2011

3. IBL Detector Material from Raphael/Neal IBL Specs / Params
The present 7 m long section of the beam-pipe will be cut (flange too big to pass inside the existing pixel) and extracted in situ.
The new beam-pipe with the IBL inserted at its place.
PP1 Collar
Sealing service ring
Alignment wirers
IBL Specs / Params
14 staves, <R> = mm.
CO2 cooling, T < 0.2 W/cm2
X/X0 < 1.5 % (B-layer is 2.7 %)
50 µm x 250 µm pixels
1.8º overlap in ϕ, <2% gaps in Z
32/16 single/double FE-I4 modules per stave
Radiation dose 5x1015 neq/cm2
IST
IBL Support Tube
IBL Staves

4. LHC Plans & IBL Milestones
LHC plans (ATLAS “interpretation”)
Have a phase I and II
Phase I when 30÷50 fb-1
Accumulate 300÷400 fb-1 on phase I
Agreed with CERN management to have phase I shutdown in 2016 (unofficial yet).
IBL design specification (Lint, L)
Life integrated of 500 fb-1
R/O: peak LVL1=100kHZ
IBL Milestones
FEI4 submission : 6/2010.
sensor choice 6/2011.
FEI4 Version 2 eng. Run 9/2011.
first prod module 11/2012
last prod module 9/2013.
Stave loading completed (incl. 3 months cont) 6/2014
End of integration (incl. 3 months cont) 5/2015
IBL installation 5/2015 – early 2015 Installation possible, but no contingency.
LHC
Ref. M. Nessi

5. FE-I4 (GE) FE-I4 FINAL LAYOUT 87M TRANSISTORS!
FE-I4 submitted on July 1st at 14:00 (GMT)
More than 2 years of engineering work for a team of >15 Engineers/physicist
Largest HEP chip ever! 20.2x19.0 mm2, 87 million transistors!
IBM accepted all the waivers, tomorrow the WRB at IBM will discuss the waivers and tell us the risk.
Fabrication time is weeks. An expected delivery date will be provided 1-2 weeks after submission. 60 Known Good Dies / wafer.
Money contributions collected following interim-MoU share.
Engineering run cost > 500kCH
16 8-inch wafer expected
60 KGD / Wafer
16 Wafers
20.2 mm
FE-I4 FINAL LAYOUT
87M TRANSISTORS!
Engineering Team:
At Bonn Tomasz Hemperek, Michael Karagounis, and Andre Kruth;  at CPPM Denis Fougeron, Fabrice Gensolen, and Mohsine Menouni;  at Genova Roberto Beccherle;  at LBNL Julien Fleury (visiting from LAL), Dario Gnani, and Abderrezak Mekkaoui; and at NIKHEF Vladimir Gromov, Ruud Kluit, Jan David Schipper, and Vladimir Zivkovic.
Students:
David Arutinov (Bonn), Bob Zheng and Frank Jensen (LBNL)
Physicists:
Marlon Barbero, Maurice Garcia-Sciveres
19.0 mm

6. Module Prototype Program & Test Beam (GE, PI, TN, UD)
Sensors and IBL activities merging
Test beam coordination & analysis between IBL and Sensor R&D
EUDET telescope used by Planar, 3D and Diamond sensors: 3 µm resolution!
Common order and plans for FE-I4 prototype modules, bump-bonding at IZM.
INFN contribution to the cost: 9k€
GE, TN and UD focusing on 3D, PI part of the planar prototyping
Once sensor technology will be decided, INFN will contribute to production ∞
Test beam Coordination within IBL WG1
Residual from EUDET extrapolation to 50µm pitch pixels (single hit clusters).
FBK-Irradiated 3E sensors (*)
Planar Sensors PI
Flat top:
High telescope resolution
ATLAS Collaborations for sLHC R&D
IBL
3D Sensors
GE, TN, UD
50µm
Diamond Sensors
Preliminary

7. 3D Sensor – Recent results(*)
Lorentz B = 1.6 T)
3D sensors from FBK irradiated to 1015 – 5 x 1015 neq/cm2
Karlsruhe: 26 MeV protons
Ljubljana: reactor neutrons
Lab & Test Beam measurements (*)
Very good efficiency at neq/cm2 (preliminary)
Not full 3D devices…
Full 3D in development at FBK
Planar: ΘL = -7.4º ± 0.4
3D: ΘL = 0º
Angle = 0º Eff. = 99.0%
p-irradiated devices (dose = 1015 neq/cm2)
Angle = 15º Eff. = 99.9%
(*) Credits: June 2010 beam and lab tests name list
M. Borri, M. Boscardin, L. Bosisio, V. Cindro, G.F. Dalla Betta, G. Darbo, C. Da Via, B. DeWilde, Su Dong, C. Gallrapp, C. Gemme, H. Gjersdal, P. Grenier, S. Grinstein, P. Hansson F. Hugging, A. La Rosa, A. Micelli, C. Nellist, S. Parker, H. Pernegger, O. Rohne, A. Rovani, K. Sjobaek, K. Tsiskaidze, J. Janssen, J.W. Tsung, N. Wermes.

8. FBK – 3D Sensors for IBL IBL Design (slim and active edge):
3D sensor with slim edge (200µm) and full through columns. DRIE (Deep Reaction Ionizing Etching) is stopped by a 0.7µm membrane. In process 200 and 230 µm thick wafer batches. Expected wafers Oct.2010
Active edge, with support wafer. Wafer end of the year.
Wafer floorplan has 8xFE-I4, 9xFE-I3, CMS, ...
Planar Sensor
3D Sensor
FBK 3D wafer for IBL
700nm DRIE stopping membrane
FBK DRIE:
200÷230 µm x 12µm

9. Indium Bump Bonding (MI, GE)
Indium BB at Selex (technology option, SiAg at IZM baseline)
Selex qualified for small FE-I3 need to change the process to FE-I4
First attempt with dummy was partially succesfuls
Need to upgrade the flip-chip head and change pressure/temperature of the process
Test with scan chains -> with FE-I4 if successful.
X-ray of FE-I4 size dummy bumped to dummy sensor
4 Pixels shorted
6 Pixels shorted
8 Pixels shorted
164 Pixels shorted
Dummy sensor
Dummy FE

10. ROD (BO + GE)
Redesign the ROD (Read-out Driver) architecture starting from the Pixel design:
Reason: components obsolescence, bottle neck of the Architecture, complexity in debugging due to mixed DSP / FPGA environment.
Smart Idea:
Move the embedded processing used for calibration (4 DSP/Board) to standard PC: use GB-ethernet
Responsibilities:
BO the ROD board, FPGA, PowerPC Programming
GE electrical-BOC to connect to FE-I4 modules without opto-link (debug the initial system)
INFN responsibility

11. Flex Hybrid Design (GE)
Stave flex (technology / test demonstrator)
Final layout made at GE submitted to CERN PCB workshop: in production
5 Cu layers and 1 Al layer (for LV)
Total thickness = 0.45mm
(Designed) Impedance = 80Ohm
Several additional designs
Single layer module flex, test boards,
Simulation of the full chain undergoing at GE
Simulation of transmission: CLK/DT-IN (40 MHz, multipoint)
Simulation of transmission: DT-OUT (160 Mbps, multipoint)
EOS
Wing
Bus (10mm wide)

12. PP2 Redesign (MI) IBL needs new Power Distribution System:
Increase of current per channel worst case (up to ~ 4A)
Solution: use two LDO (low drop outputs) / channel with current limit
Controller board
to improve the existing design (new FPGA)
Collaboration between Milano and Barcellona
FPGA: same ACTEL family but need to qualify for radiation tolerance
PP2 Crate
Regulator Board
Controller Board

13. Stave Design (MI) STAVE CARACTERISTICS SIMULATION RESULTS 2.4 / 3.0
Pipe ID/OD
[mm]
Omega Thickness
[µm]
Foam Density
[g/cm3]
Coolant
X/X0 [%]
Thermal Figure of Merit (Γ)
[ºC•cm2/W]
Bare Stave with Coolant
Full layer (+ Module + Flex)
CF pipe, heavy foam
2.4 / 3.0
150
0.55
C3F8
0.48
1.056
17.25
CF pipe, light foam
0.25
CO2
0.36
0.956
18.56
Ti 3mm pipe, light foam
2.8 / 3.0
300
0.66
1.276
2.79
Ti 2mm pipe, light foam
2.0 / 2.2
0.57
1.166
3.22
Baseline
Design baseline defined:
Ti cooling pipe with CO2 cooling.
Prototyping and test
Many prototypes made
Status: finalizing base line design
Major technical contributions from MI and ~1/3 of the project under financial responsibility of INFN

14. IBL Technical Design Report Status
TDR

15. TDR: Status & Schedule Motivation for delay in TDR printout:
LHC machine plans after Chamonix, luminosity profile, machine shut-downs impacted on IBL TDR.
Need of better documentation of Physics performance for the TDR  ATLAS EB  "IBL physics and performance taskforce” (M. Elsing, A. Andreazza)
The TF will reinforce the efforts to ensure the completion of the IBL performance studies for the IBL TDR by end of August.
TDR draft (Schedule)
First draft circulated to selected readers, comments received, being implemented.
Second review by experts: mid July.
TDR draft ready for distribution to IBL Collaboration: 2nd week of August
Final TDR ready: 4th week of August
Submission to LHCC: 1st week of September
IBL (Staves)
Ed Moise
IBL in the Physics Simulation & in the Engineering CAD Rendering
Existing B-layer
Iourii Gusakov
IBL (Staves)

16. Physics & Performance TF
consolidate and extend present studies
single particle performance (pions and muons)
tracks in jets (100 and 500 GeV di-jets, top, WH)
primary vertexing with high lumi. Pileup
b-tagging, especially redo high-pt jets studies
study different pileup scenarios
zero, 1034, 2*1034 and 3*1034 luminosity
estimate efficiency and fake rate vs lumi
demonstrate how IBL helps for robust tracking in jets, with fakes, …
add emulation of Pixel/SCT readout problems
study robustness of tracking and how IBL recovers performance
Status
IBL geometry existing, motecarlo production ongoing
Checking results on single tracks, tuning jets and vertexing
TDR editing… keep deadline!!!

17. IBL Performance (TF Results)
Simulation shows:
Clear improvement in impact parameter resolution (plot 1)
Specially in the region pT<10 GeV, that in ATLAS is dominated by multiple scattering
50% improvement of rejection power in b-tagging (plot 2)
Performance are stable even if existing b-layer is off (plot 3).
Plot 1
(top events)
Plot 1
Light jets rej.
Plot 3
IP resol.

18. Interim-Memorandum of Understanding
MoU

19. Memorandum of Understanding
IBL Memorandum of Understanding (MoU)
Between The ATLAS COLLABORATION, and Funding Agencies/Institutions of the ATLAS Collaboration constructing the IBL (for the ATLAS construction was between Institutes and CERN).
The MoU comprises all of the actions needed to construct and commission the IBL. The operation and maintenance of IBL is not a part of the present MoU and will be included, following its completion, within the M&O MoU framework. (IBL once delivered will be part of the Pixel Detector)
Annexes define: work sharing and responsibility, cost contribution, project organization and management structure.
IBL interim MoU – Why an interim MoU?
Ad Interim MoU until sensor technology is chosen (Planar Silicon / 3D Silicon / Diamond) - Decision on sensor technology (Spring 2011) – Sensor R&D and IBL communities work in tight collaboration to finalise a design matching IBL specification.
Consolidate interest of Institutes and availability of funds

20. Development of Interim-MoU
IBL (interim)-MoU Status:
“IBL Kick-off” meeting (8/7/2009)
Institutes express their interest in the IBL based on project WBS (Workpackage Breakdown Structure).
Institute Board created with the Institutes interested in the project
Extended Pixel IB (Meetings: 1/03/2010 and 18/06/2010)
Defined sharing of work, cost amongst Institutes/Funding Agencies (i-MoU annexes)
All project is covered by resources – need x-check with Funding Agencies (FA)
Status
Collecting feedback from FA on funding and general project support
Going to sign the interim-MoU?
INFN (BO, GE, MI, UD)
Quite active in the project, very good synergy and collaboration keeps up INFN visibility.

21. Institutes and Contributions to IBL
Technology options refer to supplementary costs that are sensor technology specific and will be known before the definite MoU takes effect.
42 Institutes in the interim-MoU (few others are “observers” ).
14 Countries + CERN
9.7 MCH total project cost
Note: the numbers in the table "are not final, nor are the suggested financial contributions yet firm, but are meant for a common overall discussion.”

22. INFN Contribution to IBL
Total IBL cost:
9741 kCH
Total INFN contribution:
1400 kCH (14.4 %)
1047 kCH CORE
354 kCH M&O-A in-kind
~100 kCH presently on M&O-A could be deducted from INFN if cables (assigned as work responsibility) becomes in-kind contribution.

23. INFN Contribution to MoU Items
Resources and deliverables are summarized in the two tables

24. RICHIESTE FINANZIARIe
2011 – Programma attività INFN, richieste finanziarie, responsabilità, milestones
RICHIESTE FINANZIARIe

25. BOLOGNA Attività 2011: Sviluppo PCB prototipo ROD.
Sviluppo firmware FPGA e software PowerPC del ROD
porting software da DSP (old Pixel ROD) a PowerPC
Test bench per sviluppo software TDAQ del ROD (Crate e Single Board Computer – SBC)

26. GENOVA
Attività 2011
Sviluppo prototipo funzionale Flex Hybrid per lo stave e per il modulo
Disegno versione 2 del FE-I4 (sottomissione Autunno 2011)
Catena alta tensione: Test della catena completa di alta tensione con PS, cavi a PP1, Flex hybrid, sensore
Si sta discutendo di installare I cavi nell Shut Down 2012/13 – sono su M&O-A, potrebbero essere presi in-kind (stima ~40÷50 kCH).
Sviluppo prototipo & test dei moduli: in vista della produzione (2012) del 50% del totale
Sviluppo scheda BOC (back of crate card) elettrico per leggere moduli con ROD senza opto-link (per QC RoD, test-beam, system test, produzione moduli…). In collaborazione con BO e gruppi tedeschi (BOC)

27. MILANO Attività Milano 2011: Prototipaggio e preproduzione stave
Modifiche schede regolatori PP2 (differenti specifiche FE-I4: VDD , IDD ), scheda controller PP2 (nuova FPGA da qualificare con irraggiamento), backplane
Sviluppo bump-bonding con Selex (alternativa technologica alla IZM)

28. TRENTO (Dot.1 PD) Attività 2011: Simulazione sensori in 2 D e 3D
layout sensori 3D (slim e active edge), layout maschere bump-bonding
Test strutture su wafer sensori 3D: prima e dopo irraggiamenti

29. UDINE
Attività 2011:
Sviluppo sensori 3D insieme a UD e TN (fase di prototipaggio),
Bump-bonding di FE-I4 con sensori 3D
Test-beam, irraggiamenti sensori 3D
Pre-produzione sensori (tecnologia da decidere a metà 2011)

30. Sommario Richieste e Responsabilità IBL
Responsabilità nel progetto IBL:
Giovanni Darbo: IBL Project Leader L1
Danilo Giugni Stave WG Coordinator L2

31. Milestones INFN Milestones – ATLAS IBL:
IBL -Test beam di rivelatori con chip FE-I4     30/4
IBL - Scelta baseline per i sensori              31/7
BL - produzione e test prototipo ROD/BOC        31/10

32. Conclusions IBL planned to be completed by 2015
CERN/Experiments agree on a shutdown in 2016
TDR is progressing and documenting the technical design of the IBL
Deadline for submission to LHCC early September
iMoU ready to sign
Some Countries/Institutes already did.
INFN balanced between money contribution and visibility of activities, but
Competition is high … and many want a seat on boat!

33. Backup slides

34. IBL Project Status in Pills
All the aspect of the IBL project are pretty well covered:
Some in advanced design or prototype phase, as mentioned sensor and FE-I4
Just to mention a few
Stave: baseline CO2 cooling & Ti-pipe, TM measurements & FEA simulation well on its way.
Stave/module flex-hybrid: multi-layer and stacked single layer prototyping.
Internal services: design, simulation, prototyping
Off-detector R/O: architecture defined, detailing board design and firmware
Power chain: upgrade study of the PP2 regulator. Simulation & design, waiting FE-I4 for selecting power scheme. Sensor decision impacts HV selection.
Integration in SR1, installation mockup in bld. 180: designs, prototypes, getting parts
Stave loading: ideas, testing, looking at jigs
Layout: global supports, beam-pipe flanges, IST
2012 shutdown: preparatory activities in the pit for IBL
Installation: guiding pipe, insertion/extraction table, ALARA
Cooling: cooling plant parameters, TM studies and prototypes for beam-pipe bakeout
For most updated overview checkout June IBL Workshop at hold Geneva Univ.:

35. IBL Layout Layout parameters: Baseline layout decided
14 Staves, “reverse turbine” (there were two main options in Barcelona)
Beam-pipe reduction:
Inner R: 29  25 mm
Very tight clearance:
“Hermetic” to straight tracks in Φ (1.8º overlap)
No overlap in Z: minimize gap between sensor active area.
Layout parameters:
IBL envelope: 9 mm in R
14 staves.
<R> = 33 mm.
Z = 60 cm (active length).
η = 2.5 coverage.

36. Extraction/Insertion
Progresses on many areas:
Installation mock-up (Geneva & CERN ) in bld 180
Extraction/Insertion “table” (LPSC Grenoble)
Long Guiding Tube (Brandeis)
Integration and Envelopes definition (CERN Atlas TC)
Beam-pipe split flanges (CERN Vacuum group)
ALARA (CERN Atlas TC)
Installation
Mock-up in bld.180

37. IBL TDR Editors: M.Capeans (CERN), K. Einsweiler (LBNL)
Chapter Editors: G.Darbo, T.Flick, M.Garcia-Sciveres, C.Gemme, H.Pernegger, O.Rohne, R.Vuillermet
and quite many Contributors to different chapters: A.Andreazza, O.Beltramello, A.Catinaccio, I.Dawson, D.Ferrere, KK.Gan, D.Giugni, Y.Gousakov, N.Hartman, I.Hinchliffe, F. Huegging, S.Kersten, N.Massol, P.Morettini, D.Muenstermann, L.Nicolas, M.Raymond, S.Rozanov, D.Su, W.Trischuk, C.da Via, E.Vigeolas and S.Wenig
Chapters’ Structure:
Overview – IBL history, lifetime and failure issues, requirements, physics
Modules – sensors (3 technologies), FE electronics, integration (bump-bonding, “mini- Flex”)
Staves - mechanical concept for the stave, module loading, cooling and thermal issues, electrical integration, internal services
Integration - mounting staves with beampipe, services integration, final surface testing
Control, Readout, and Integration - power supplies, opto-links, off-detector readout electronics, external services, cooling plant, DCS, integration with the present detector DAQ/DCS
Installation – beampipe extraction, mock-up, IBL transport and installation, connection and testing
Commissioning – calibration, early data-taking plan with random triggers, charge injection, cosmic ray data-taking
Prototyping, Production Testing, System Testing
Critical Integration Issues – cooling, bakeout, powering, detector weight, material budget
Project Management and Organization
Draft has 200 pages (too long?).
Circulated to selected readers (many comments received):
Attilio Andreazza, Andrea Catinaccio, Allan, Nigel Hessey, Tim Jones , Leonardo Rossi, Steinar Stapnes, Georg Viehhauser, Norbert Wermes