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ECE 3110: Introduction to Digital Systems Introduction (Contd.)

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Presentation on theme: "ECE 3110: Introduction to Digital Systems Introduction (Contd.)"— Presentation transcript:

1 ECE 3110: Introduction to Digital Systems Introduction (Contd.)

2 2 Previous class Summary Digital devices Digital vs. analog Why digital

3 3 Digital Logic Binary system -- 0 & 1, LOW & HIGH, negated and asserted. Basic building blocks -- AND, OR, NOT

4 4

5 5 Electronic aspect of digital design Digital abstraction Range Noise margin Invalid range Specifications

6 6 Software aspect of digital design Digital design need not involve any software tools. But: modern design, software tools are essential. Examples:  Schematic entry, HDLs (platform compilers, simulators, synthesis tools), simulators, test benches, timing analyzers and verifiers, word processors, high-level languages, CAD

7 7 Integrated Circuits (IC) A collection of one or more gates fabricated on a single silicon chip.  Wafer, die Small-scale integration (SSI): 1-20  DIP: dual in-line-pin package  Pin diagram, pinout MSI: 20-200 gates LSI: 200-200,000  VLSI: >100,000, 50million (1999)

8 8 DIP pinout

9 9 Programmable Logic Device (PLD) ICs which Logic function can be programmed after manufacturing. 2-level AND-OR gates using user-programmable connections  PLAs: programmable Logic Arrarys.  PALs: programmable array logic devices  Programmable logic devices (PLDs) CPLD: complex PLD FPGA: Field-Programmable Gate Array

10 10 CPLD vs FPGA

11 11 Application-Specific ICs (ASIC) Semi-custom IC: chips designed for a particular, limited product/application Reducing chip count, size, power consumption Higher performance. NRE: nonrecurring engineering cost  Standard cells: library  Gate array: an IC with internal structure as an array of gates, unspecified interconnection

12 12 Printed-Circuit Board PCB or PWB (printed-wiring board) Mount ICs so that an IC can connect to other ICs in a system. SMT: Surface-mount technology MCM: multi-chip modules: high speed and density.

13 13 Summary Electronics aspects of digital design Integrated Circuits (wafer, die, SSI, MSI, LSI, VLSI) PLDs: PLAs, PALs, CPLD, FPGA ASIC

14 14 Next… Number systems Reading: Wakerly chapter 2


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