1. 1 DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht ITRS - YE ITWG Meeting in Maastricht April 6-7, 2006 Lothar Pfitzner, ++49 9131 761 110, lothar.pfitzner@iisb.fraunhofer.delothar.pfitzner@iisb.fraunhofer.de Andreas Nutsch, ++49 9131 761 115, andreas.nutsch@iisb.fraunhofer.deandreas.nutsch@iisb.fraunhofer.de

2. 2 DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht Maastricht 2006 YE ITWG Meeting Participants 12 Participants (Europe, Japan, USA) –Lothar Pfitzner (Fraunhofer IISB) –Ines Thurner (Infineon) –Dilip Patel (ISMI) –Sumio Kuwabara (NEC) –Andreas Nutsch (Fraunhofer IISB) –Andreas Neuber (MW Zander) –Dieter Rathei (D R Yield) –Dirk de Vries (Philips) –Chris Muller (Purafil) –Francois Finck (ST) –Allyson Hartzell (Exponent) –Dave Roberts (Air Products)

3. 3 DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht YE Chapter Contributions 2006 Chair: Lothar Pfitzner (IISB) Co-Chair: Dilip Patel (Intel assignee to Sematech) Difficult Challenges Table xxx Technology Requirements and Potential Solutions -Yield Model and Defect Budget (YMDB) Chair: Sumio Kuwabara (NEC) - Japan Table xxx -Defect Detection and Characterization (DDC) Chair: Ines Thurner (Infineon) - Europe Table xxx -Yield Learning (YL) Chair: Tings Wang (Promos Tech) – Taiwan (not present in April) Table xxx -Wafer Environment Contamination Control (WECC) – USA Chair: Andreas Neuber / Kevin Pate (Intel) – Europe/USA Table xxx

4. 4 DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht YE TWG Topics –DDC: update the tables –DDC: remark that metrology tools need to be available for technology development 18 to 24 months before each technology generation ius actually introduced –YMDB: Defect budget survey will be done in Japan, the data will be supplied to ITRS, if other regions participate –YMDB: The defect size distribution will be kept on scaling with 1/x³. Remark: it might be possible for smaller defect size the defect numbers might increase significantly stronger, because effects e.g. nucleation are expected

5. 5 DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht Cross TWG –Lithography –ESH –FEP –Interconnect –Factory Integration –Test Topics –Lithography: For immersion lithography: Is there a need for a new method for defect inspection? Is a specific defect specification required? – Answer: no additional specs. Follow up: exchange on information on sensitivity etc. (requirements on defect detection) –FEP: Yield model in ITRS: requires input from Fabs requires further discussion –FEP: Defect budgets: still no new survey available –TEST: Common coordinate system neccessary

6. 6 DRAFT - NOT FOR PUBLICATION April 5-7, 2006, Maastricht Cross TWG Cross TWGs of WECC –Litho: Further improve definition of interfaces and parameters –Factory integration (FI): Further clarification of interfaces –Front end processing (FEP): Follow-up on AMC and CVD/ALD precursor specifications –Assembly and Packaging: Second contact with regard to new requirements –ESH: Yield modelling for impact analysis will be difficult due to potential reliability issues, further coordination on CVD/ALD precursor material screening and yield impact analysis of recycling