1. 1 High Speed Interconnect Solutions Page 1 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 HIROSE ELECTRIC CO., LTD. March, 2010 IT3 series High-speed mezzanine Connector System

2. 2 High Speed Interconnect Solutions Page 2 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 IT3 Series Design Overview Flexibility: Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIE and XAUI as it is in tomorrow’s 20+ Gbps systems. With the ability to transmit differential, single-ended, and power through one package and being stackable from 15 – 40 mm, IT3 can solve your interface needs for both current and future generations. Features: Unique 3-piece structure for excellent reflow solderability Differential, single-ended, and power Low mating/extracting forces Wide misalignment tolerances Stacking heights from 15 to 40mm Both SnPb and Pb-free are available Staggered 1.5mm x 1.75mm BGA A New Standard Mezzanine for Flexibility and Performance Flexible 3-piece design has many advantages Detachable (Mating) Side Mating / Unmating

3. 3 High Speed Interconnect Solutions Page 3 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Hirose IT3 vs. Competition Hirose IT3 Amphenol NexLev FCI GigArray Pin counts :100/200/300 100/200/300200/296 Stack heights : 10mm to 40mm 10mm to 33mm 15mm to 40mm Signal density : 73 diff pairs/inch 73 diff pairs/inch 66 diff pairs/inch Sales channel :Direct / Disty Direct only Direct / Disty 2 nd Source : Tyco None None High ASP = $ 50 + per mated connector

4. 4 High Speed Interconnect Solutions Page 4 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 High Speed “Terms” to Know: Mechanical BGA: Ball grid array interconnect system using reflow solder balls Ground: An electrical connection between a circuit and the earth Power: The rate of generation, transferring or using energy, measured in watts Stack Height: Vertical distance measured in mm between PCB & connector

5. 5 High Speed Interconnect Solutions Page 5 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Application Examples Internet Routers &Switches Servers/ Storage Base Transceiver Station

6. 6 High Speed Interconnect Solutions Page 6 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Currently Available Variations

7. 7 High Speed Interconnect Solutions Page 7 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Available Sales tools 2D Mechanical Drawings 3D STEP Files SI Data -General Presentation -Modeling -Detailed Test Reports (Available by Stack Height) -Test/Demo Board Assembly and Design Notes Product Brochure Qualification Data -L1 Environmental Qualification Test Report -L2 Long-term BGA Reliability Test Report -L3 Manufacturing Yield Test Report Mechanical Show & Tell Samples Sample Display Cases Coming May 2010

8. 8 High Speed Interconnect Solutions Page 8 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Available Sales tools Technical Data NoItemFormatFile name (Ex.) 1Simplified 3D model STEP (SAT &IGES are also available) IT3M-300S-BGA.stp 2Footprint dataAllegroIT3M-300S-BGA.brd 3Spice modelsSpiceIT3-**H.sp 4Touchstone modelTouchstoneIT3-300-**H.s60p Technical Document NoItemFormat File name (Ex.) or Document number 12D drawingPDFIT3M-300S-BGA.pdf 2Spec sheetsPDFIT3M-300S-BGA.pdf 3Contact reliability reportPDFTR0636E-10018 4Eutectic thermal cycling test reportPDFTR0636E-10026 5Lead free thermal cycling test reportPDFTR0636E-20128 6Temperature rise reportPDFTR0636E-20041 7SI reportPDFIT3-**H.pdf 8Assembly notePDFETAD-F0457 9Design notePDFETAD-F0347 10Customer demo board test reportPDFIT3_demo_board_v2.pdf 11Characterization board test reportPDFIT3_Characterization_Board_v09.pdf From Assembly Notes and Design Notes; documents 3 through 6 are based on EIA spec.

9. 9 High Speed Interconnect Solutions Page 9 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 High Speed “Terms” to Know: SI Differential Signaling : Digital signals transmitted as the difference in voltage of a pair of signal lines Gbps: = Gigabits per second; a unit data transfer rate/speed = 1k megabits per second S. Parameter: Plots attenuation vs. frequency used to document connector performance and is also known as insertion loss SI: = Signal Integrity; Process of analyzing and making appropriate system design decisions Signal Ended Signaling: Signals transmitted over one wire using common ground return Spice Model: Simulated program with integrated circuit emphasis Touchstone File: Also known as SnP file; intended for use with documents and specifications for parameter data of active or passive interconnect network

10. 10 High Speed Interconnect Solutions Page 10 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Assembly friendly unique 3-piece X-ray inspection from bottom side X-ray Inspection Friendly Low Thermal Mass for Reflow process For any stacking height combination, receptacle is always same and its height is 6mm only. Small size of receptacle has wide process window for reflow profile. No need to reflow Reflow receptacle only Lead-Free applications benefit from our easy reflow process design. 1.Significantly reduces frequency of false calls 2.Simple receptacle design gives clear vision for X-ray inspection. “Mounting receptacle” Reflow-mounted on PCB “Interposer” Installed onto “Mounting receptacle” after reflow “Mating receptacle” Mated with “Interposer” IT3 3-Piece Design Features & Benefits IT3 series mounting & mating procedure

11. 11 High Speed Interconnect Solutions Page 11 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 HRS IT3 Series : 10˚ acceptable Competitors’: Not acceptable Mating / Un-mating operation Industry standard footprint IT3 3-Piece Design Features & Benefits IT3D/M -***S - BGA 0.75 mm 0.875 mm Signal BGA Ground BGA HRS IT3 Series : 3˚ acceptable Competitors’: Not acceptable High reliable BGA connection *Patent Pending IT3’s unique 3 piece design and construction gives industry leading BGA reliability, while still providing the density of 73 differential pares per linear inch. The IT3’s divided receptacle structure reduces thermal stress and ensures long- term reliability of the BGA ball connection with the PWB Drop-in replacement for NexLev

12. 12 High Speed Interconnect Solutions Page 12 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Lower force Insertion and Extraction Displacement of spring (mm) Contact force (N) 0 Contact normal force Spring workload is decreased. Pre-load structure Housing design prevents pin stubbing Exposed contacts Existing solution IT3 Series IT3 Supplier A Appx. 200 pos. 90 N145N Appx. 300 pos.135 N218N IT3 3-Piece Design Features & Benefits

13. 13 High Speed Interconnect Solutions Page 13 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 IT3 connectors PCB IT3 series for 30mm (or any) stacking height application 3-Piece Connector Assembly Benefit 3-Piece Connector Assembly Benefit Already confirmed that there are no issues to mount Hirose IT3 series connectors on the bottom side of PCB for 2 nd reflow soldering by major CEMs. 2nd Reflow soldering compatible Other supplier for 30mm height application 6mm 19.7mm May not suitable for 2nd Reflow soldering due to the weight.

14. 14 High Speed Interconnect Solutions Page 14 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Robust and Reliable Solder Ball Attachment High Speed Interconnect Solutions Not to scale After reflow soldering Uncontrolled co-planarity brings the migration of solder ball from low to high temperature side during reflow, which causes the soldering failure. The countermeasures are to improve the excess co-planarity or to implement the thicker metal mask to cover such co-planarity. As a contact lead is positioned into a solder ball, it prevents the ball from pealing off during severe shock &vibration test. Hirose IT3 seriesOther connector & silicon device package Since the receptacle’s contact resides in the BGA ball, the IT3 is very strong for shock and vibration. (Patent Pending)

15. 15 High Speed Interconnect Solutions Page 15 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Unique Interposer Design for Signal Integrity Interposer wafer Micro strip line structure Up to 6.25G bps with fully populated pin assignment Over 10G bps with skipped pin assignment for differential pairs Also can be used for power lines Interposer wafer structure Signal / Ground configuration Signal Ground

16. 16 High Speed Interconnect Solutions Page 16 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 IT3 vs. IT2 BGA grid0.7 x 0.875 (mm)1.0 x 1.0 (mm) # of balls Signal: 300 Ground: 270 Signal : 180 Ground : 200 Receptacle size56 x 19.2 x 6 (mm)48.2 x 22.6 x 5.25 (mm) * Because of connector structure, IT2 cannot have pins skipped for faster data transfer requirement.

17. 17 High Speed Interconnect Solutions Page 17 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 Hybrid (Selectively Loaded) Type Available IT3HY (85&100Ω) mating / internal structure IT3HY-100P-38H (schematic only) IT3D-100S-BGA IT3M-100S-BGA 85 Ω QPI wafer (typical for new Server applications) Existing 100 Ωwafer (typical for Telecom applications)

18. 18 High Speed Interconnect Solutions Page 18 High Speed Interconnect Solutions © 2005-2010, HIROSE ELECTRIC CO., LTD. All rights reserved. Rev RSM – April, 2010 IT5 vs. IT3 IT5 has improved ICR (with 8-aggressor FEXT) for 25 Gbps data rate with plenty of margins. IT3IT5 12.5 GHz Via stub