1. 2x2 module & stave layouts

2. 2 options “Small chip” “Big chip” Boundary between “small” and “big” is determined by the 6” sensor wafer layout that must be compatible with bump bonding (will become clear later) “Small” chip has also a more natural number of rows & columns, but this is probably a minor issue for chip design.

3. Parameters # cols total # rows total # ganged rows # long cols Long col width Small chip64324000 Small 2x2 tile12865464450um Small active edge 1x1 tile 6432402450um big chip70348000 big 2x2 tile14070264450um big active edge 1x1 tile 7034802450um Normal col. width x row height = 250um x 50um

4. “Small” 4-chip module 34.8 37.5 Active 32.8 x 32.8 10.0 15.0 Flex pigtail (connector plugs into page) Pixel orientation Flex down to chip w-bonds 0.2 (vertical inter-chip gap 0.1mm)

5. “Big” 4-chip module 37.1 37.8 39.9 Active 35.8 x 35.1 10.0 15.0 Flex pigtail (connector plugs into page) Pixel orientation Flex down to chip w-bonds 0.2 (vertical inter-chip gap 0.1mm)

6. Loaded module 20 position connector would be used. Replace 10.22 dimension by 6.52 glue chips sensor flex connector Reduced scale 1.0 mm stiffener

7. “Small” module outer stave … End of stave card serving 8 modules (half a stave) along Z Can serve one face only (top or bottom) => 4 cards per stave Or can be a wrap-around end of stave card and serve both faces => 2 cards per stave. This way identical staves (including bus cable) design can be used over a wide radial range: 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius 34.8 26.8 Module on back 986mm 38.4

8. “Big” module outer stave … End of stave card serving 7 modules (half a stave) along Z (or 8 modules for 1082mm active length) Can serve one face only (top or bottom) => 4 cards per stave Or can be a wrap-around end of stave card and serve both faces => 2 cards per stave. This way identical staves (including bus cable) design can be used over a wide radial range: 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius 37.8 29.8 Module on back 946mm 39.9

9. “Small” sensor 6 inch wafer Active area = 7508 mm^2 Sensor tiles shown with darker line Wafer scale flip chip compatible. Chips shown with lighter line. The name “small” 2x2 tile comes from the wafer layout. –A slightly larger chip and therefore larger 2x2 tile is possible, but only 6 such “large” 2x2 tiles will fit on a 6” wafer.

10. “Big” sensor 6 inch wafer Active area = 7539 mm^2 Sensor tiles shown with darker line Wafer scale flip chip compatible. Chips shown with lighter line. OPTION to make 4 6- chip modules per wafer instead of 6 4-chip modules.

11. “Small” single chip module Using same chip as 4-chip module (hence “small”) Active edge sensor 2-side abuttable format 16.4 16.2 18.7 active

12. “Big” single chip module Using same chip as 4-chip module (hence “small”) Active edge sensor 2-side abuttable format 17.9 17.7 17.4 19.9 active