1. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder1 US CMS Silicon Electronics Testing US CMS Lehman Review BNL 5/21/03 A. Affolder University of California Santa Barbara (on behalf of the US TOB testing group)

2. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder2 Electronics Testing Group –Fermilab (FNAL) S. Tkaczyk +2 technicians –University of California, Riverside (UCR) Gail Hanson, Patrick Gartung –University of California, Santa Barbara (UCSB) A. Affolder, S. Burke, C. Campagnari, D. Hale, J.Incandela, S. Levy, S. Stromberg +2 Undergraduate Students –University of Illinois, Chicago (UIC) E. Chabalina, C. Gerber + 1 Graduate Student –University of Kansas (KU) A. Bean, L. Christofek, D. Coppage –University of Rochester (UR) R. Eusebi, A. Hocker, P. Tipton + 1 Graduate Student

3. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder3 Outline Introduction  Clean rooms and infrastructure  Test stands Testing model  Plans for production  First “300 modules” Status of each testing stage  Hybrid testing  Module testing  Module burnin  Rod assembly  Rod burn-in with interlocks Summary

4. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder4 Overview FNAL and UCSB will have equal production capabilities and capacities UCSB will wire bond APV-pitch adaptors and thermal cycle hybrids for US sites  FNAL test stands –2 of 4 DAQ and 2 of 4 ARCS  UCSB test stands –1 of 3 DAQ and 3 of 5 ARCS  UCR module diagnostics and repair –0 of 1 DAQ and 0 of 1 ARC TOB Module Summary Table

5. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder5 FNAL Testing Clean Room ARCS in place near gantry for quick testing Space allocated for rods burn-in area, additional ARCS and DAQ (burn-in/repair) stands

6. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder6 UCSB Testing Clean Rooms Clean room adjacent to production area 29 m 2  Room layout finished  Currently in high bay with intentionally same layout –Missing only hybrid thermal cycling test  Beginning to move into completed area as we speak >100 m 2 clean room dedicated solely to TOB rod assembly/testing  Currently removing gantry, wirebonder, OGP from space and into new clean room –Simplifies transportation/storage of rods

7. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder7 Other Recent Infrastructure Projects Hybrid holding plates  Matches hybrid thermal cycling test stand  Can bond and test with low noise in same holder Hybrid thermal cycler  Just beginning design Burn-in low voltage distribution crate  LED indicators and fuse protection Crowbar  HV protection circuit Hybrid clamshell Module clamshell

8. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder8 ARCS Based Test Stands Hybrid testing  Hybrid clamshells Hybrid thermal-cycler  Under construction Module testing  Module clamshell  LED systems  DEPP HV supply Hybrid Clamshell Module Clamshell DEPP LED Controller ARC Controller ARC crate ARCS - APV Readout Controller Software Purpose - Fast testing of hybrids and modules Missing hybrid-to-utri adapters to fully use capacity

9. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder9 DAQ Based Test Stands DAQ system – a prototype of the real CMS tracker readout chain Purpose – fast and burn-in testing of modules and rods (detail)(detail) Single Module Test Stand Module Burn-in Rod Assembly And Burn-in Missing necessary testing components for module burn-in and any rod testing

10. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder10 The TOB Testing Cycle Quick test hybrids on ARCGantry constructs modules. Modules test on ARC Assemble rods from modules Rod burn-in Rods shipped to CERN Thermal cycled module Wire bond Final pinhole test on ARC Wire bond Thermal cycle hybrids

11. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder11 Production Ramp Hybrids  Initially hybrids will have pitch adaptors bonded and will be thermally cycled and tested at CERN  Acceptance testing will occur at FNAL and later at UCSB Modules production will follow the flow presented earlier  All will be thermally cycled and run overnight with Vienna boxes to look for infant mortality and measure time constant for pinhole creation if applicable.  Separately some will be run longer to try to determine if any failures have longer time constants Rod Production  Initially we will use whatever single-rod test software is available  We will likely build single rods and run long-term tests on single rods until adequate multi-rod test software is available –Interlocking for safety can be done in parallel with a separate pc

12. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder12 ARC Hybrid Test Results 4 (11) hybrids have had APV bonded to pitch adapters at UCSB (FNAL)  2 opens developed in 7680 channels –Final pitch adaptors will be more uniform  even better bonding performance Hybrid clamshells enable testing without large pickup effects at chip edges  Same requirements can be made for hybrids with or w/o PA bonded

13. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder13 Hybrid Thermal Cycler Hybrid pitch adaptor pulsing/thermal cycling test  Acts as short-term burn-in (20 minutes) –Hybrids (and components) tested for several minutes prior to arrival Very custom set-up  Sam Burke (UCSB) has begun design work for electrical system –Baseline provided by CERN  Dave Hale (UCSB) has begun mechanical design  Software for data acquisition and interlocks provided by CERN System should be operational in time for need (late summer)  Test/bonding performed by CERN for M800 hybrids CERN Thermal Cycler If failure rate determined to be low after first 200-300 hybrids, will only sample test hybrids

14. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder14 ARCS Module Testing Group’s experience in previous silicon experiments have been used extensively to modify testing procedure  More stable  More descriptive Suggestions have been adopted by CMS silicon testing groups

15. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder15 ARC Module Testing (2) Chip “feature” makes low common mode noise extremely important  UCSB clamshell decreases common-mode noise to the point where location of opens become detectable by their noise levels –PA-sensor –Sensor-sensor  Pinholes act as if saturated  High current channels can have higher noise (Bad IStrip  Slight noise increase on chip edges Pinholes PA-sensor opens Sensor-sensor opens Bad CAC Bad Istrip Sensor flaw PEAK ON Noisy Strips

16. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder16 ARC Module Testing (3) Gain test (UCSB)  Test added to determine location of opens without optical inspection/LED test –Necessary for finding opens created during rod assembly/burn-in  Opens clear by higher gain  Pinhole clear by lack of gain Pinholes Sensor-sensor open PA-sensor open Short

17. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder17 ARC Module Testing (4) Analysis macro under development which correlates testing results to determine type of channel defects  Ultimately will output list of bad channels with suggested repairs/rework necessary for module  Additional generates all plots necessary for module QA Work will be used to define testing criteria for cross calibration of all CMS strip silicon detectors

18. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder18 Module Testing Results 18 prototype modules constructed at FNAL  Used in rod prototypes and beam tests  All of extremely good quality 8 production modules have been constructed and tested at FNAL  All of extremely good quality –0.4% bad channel creation during early production 8 production module have been constructed and tested at UCSB  All of extremely good quality –0.5% bad channel creation during early production Last 4 modules had no bad channels introduced –3 damaged due to wire bonding mistake in the HV bias return line which will not be repeated Leads to high bias current (50-800  A) Will be used in cross calibration of all test stands

19. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder19 Module Burn-in Status Both Vienna boxes used for module burn-in arrived at UCSB  LV distribution + HV controllers ready  Demonstrated basic functionality  Software currently does not have capability for multi-module tests –Patrick Gartung (UCR) and UIC grad student (as of June) are actively working to improve software Once failure rates (if any) established, may be able to sample test

20. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder20 Rod Assembly Testing Actively working to finalize rod assembly hardware  Versions of rod assembly rotation table, rod handling tool and all other tools should be shipped to UCSB soon Assembling single rod testing hardware  Commitment from CERN delivery of LV PS and DAQ componentsDAQ components  CAEN HV PC controllers ordered Arrival times of assembly hardware and single rod testing hardware (2-3 months) match production schedule

21. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder21 Rod Burn-in Test Facility (UR Group) Peak production at FNAL/UCSB will be at most 10 rods per week per site.  Each site will have capacity to burn-in 8 rods at one time. –50% contigency  Currently plan 72 hour burn-in cycle –Should be able to reduce to 48 hours, if necessary  Each system to include… –Cold box –Chiller –PC/DAQ system for chiller and flow control –2nd PC for CMS DAQ system –LV Power supplies provided by CERN –HV Power supplies loaned from ‘CERN Prep’

22. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder22 Rod Burn-in Stand Status Purchased a chest freezer and low temp chiller  Time from 20C to –25C is ~1.5 hours. Chiller DAQ system  Flow, temperature control and dew point interlocks have been specified and quoted. –Low noise equipment similar to CDF Rod DAQ system  Commitments for DAQ components made –Scheduled to be delivered in time for use  Multi-rod software under-development –Group’s involvement in multi-module software should speed finalization of software

23. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder23 Current Estimated Testing Through-put Hybrid Arrival Testing  24 hybrids per day at UCSB  Matches peak production (+ contingency)  Requires dedicated tech Hybrid Thermal Cycling  Most components missing  Construction should finish in-time for need (late summer)  Test stand will be able to match production rate Module Basic Test  2 ARC LED stands at both sites  12 modules per day  Matches peak production (+ contingency)  Requires dedicated tech Module Burn-in (Vienna Box)  Lack of hybrid-to-utri adapters limits testing through-put to 1 –Should receive more in next few weeks  Current software can only test 1 module at a time Rod Assembly Testing  Most hardware not delivered yet –Currently cannot test any rods –Will be able to match production rate with full compliment of equipment Rod Burn-in will start in fall

24. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder24 Summary Production ramp up at FNAL/UCSB has begun  Current hardware/software meet hybrid/module testing needs –Multi-module burn-in software needed in near future Group actively working on software  We have developed testing protocols to decisively find/diagnose all problem channels  Extremely high quality modules have been made so far –<0.5% bad channels introduced per module We will need more test equipment to achieve peak rate  Commitments made to deliver equipment in time Rod assembly and test stands under development  Equipment specified and ordered Rod burn-in infrastructure to be ready in early summer  Rod DAQ electronics and software will be ready Group’s work on multi-module burn-in software will speed up software development

25. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder25 Back-up Slides

26. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder26 Tracker/DAQ Readout System Front End Drivers (FED) digitize the data Front End Controller (FEC) distributes clock and trigger signals to the front end and sets and monitors all APV parameters TSC Trigger Sequencer Controller (TSC) generates trigger signals corresponding to a L1 Trigger Communications and Control Unit (CCU) provides slow control Return

27. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder27 Testing Model (1) (03/01/29) Hybrids  Shipped to UCSB –Visual Inspection –Simple functionality test –Wire bond pitch adaptors –Thermal cycle with continuous ARC test and pitch adaptor pulsing  Distributed among FNAL and UCSB for production –FNAL to repeat simple functionality test for finding transport damage Modules  Fast test with ARC/LED –Simple repairs (e.g. pull wirebonds on any newly developed pinholes)  Overnight “burn-in” of modules with Vienna box (sample unless necessary to do all)  Final pinhole check with ARC/LED  Modules stored for later rod installation

28. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder28 Testing Model (2) (03/01/29) Rods at US Sites  Received and visually inspected  Modules mounted on rod –According to flavor (1 of 24) –All modules mounted (e.g. 6 at a time for SS rod) and tested  Capacity: 2 SS rods/day per site  LT Test –Up to 8 rods per site for up to 72 hours with 3 thermal cycles per day sampled data taking –Recalibrate optohybrid vs temp  Final test at US site

29. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder29 ARC Module Testing (3) Chip “feature” results in loss of entire chip due to saturation effects if few pinholes bonded LED pinhole test  Bonded multiple inherent pinholes on purpose  LED test always detects pinholes seen in sensor probing Pinhole Sensor flaws Pinholes are clearly identified 

30. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder30 Rod Assembly Testing (2) PC boards  Now need 5 PCI slot + 1 ISA slot +ethernet + COM port + LV DI/O card (if necessary) –Neither site has such a computer  1 TSC  2 FED  2 OEC –Allows for SS4 rods only  2 DI/O cards

31. US CMS Silicon Electronics Testing – CMS Lehman Review - May 21, 2003 - Affolder31 Rod Assembly Testing (3) To get first site read-out rods need the following hardwareTo get first site read-out rods need the following hardware  1 LV PS  1 A1303 CAEN controller  1 PC (5 PCI + 1 ISA + ethernet + 1 com + LV DI/O (maybe))  2 Electrometers  1 DI/O card  1 OEC LV PS, A1303, and electrometers all may be long lead time items (2-3 months)