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TOB Status Joe Incandela University of California, Santa Barbara For the TOB Group Tracker General Meeting Sep. 21, 2001 at CERN Slides courtesy of: A.

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Presentation on theme: "TOB Status Joe Incandela University of California, Santa Barbara For the TOB Group Tracker General Meeting Sep. 21, 2001 at CERN Slides courtesy of: A."— Presentation transcript:

1 TOB Status Joe Incandela University of California, Santa Barbara For the TOB Group Tracker General Meeting Sep. 21, 2001 at CERN Slides courtesy of: A. Affolder, C. Bloch, C. Campagnari, A. Dierlamm, E. Shabalina, A. Onnela, D. White… and others for sure.

2 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 2 Module Assembly Issues TOB module production was slowed due to concerns about HV Bias Long term performance instability of the conductive epoxy led us to backside wirebonding for each sensor on all modules. Treatment of new TEC and TOB modules underway Procedure for previously completed TOB modules understood. Retrofit of all stored modules to start next week complete before rod production starts again in November No impact on TEC schedule is expected. TOB module production now back up to high rates Rod assembly on hold awaiting for replacement Inter-connect Cards. Must now store a much larger than planned number of modules. Preparations for TEC at FNAL UCSB R7 plate designs have been adapted to FNAL gantry Manufacture of parts to start soon

3 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 3 Production so far…

4 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 4 US ARCS Testing Results 2675 Total Tested 2945 Grade A 11 Grade B 26 Grade F This week: 111 of 78592 channels bad (0.14%) WIEN BOX: 3 modules have failed in LT

5 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 5 All Modules Total Production: 1248 of 1922296 channels bad (0.065%)

6 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 6 Completed fractions

7 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 7 Backplane bias issues UCSB study showed evidence for decreasing conductivity with time in sensors with backside scratching and extra Ag epoxy points. FNAL Confirmed with lower stats From previous measurements the problem was understood to be the contact between the Ag epoxy and the aluminized sensor backside (and not the Ag-Au connections).

8 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 8 U.S. Module Production For new modules we solder gold- Kapton tabs to the gold rings on the unused vias and wirebond to sensor backplanes. Still apply Ag epoxy to standard pads. And also use it to adhere extension pads to the backplane. 15 wirebonds per sensor Encapsulate with Sylgard 186 Extension pads don’t affect sensor positioning during module assembly. UCSB has bonded to an existing pad on the frames of over 200 TEC modules and has ARCS tested these. No evidence of any damage.

9 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 9 Backside Bonding – TEC Modules Bonds height average 0.30 mm. 20 modules wirebonded < 1h Bond pull strengths have all been over 7 grams. The encapsulant height can be close to the frame thickness. To make sure we do not go outside this envelope, we will squeegee off any excess to constrain to 0.80 mm height.

10 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 10 UCSB Existing Module Modifications This Week A B F Cumulative A B F A or B L12pu 000000 0.00% L12pd 000000 0.00% L12su 000000 0.00% L12sd 000000 0.00% L34p 000000 0.00% L56p 000200 100.00% R5N 40008000 100.00% R5S 20003800 100.00% R6 1900 00 100.00% R7 2400 00 100.00% Total 1030016300 100.00% No evidence for additional noisy channels or pinholes.

11 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 11 Existing Module Modifications (FNAL) At FNAL we are planning on soldering an insulated wire from the HV point on the top side to a pad bridging the two sensors on the backside. Situation different due to extra silver epoxy point and Gantry assembly plate style. Does avoid the use of silver epoxy in the electrical connection. Needs to be checked that rods built with such modules do not have additional noise. UCSB will use this in cases where silver epoxy has completely covered the via ring.

12 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 12 Module Storage Modules are stored on aluminum plates in commercial cabinets. ESD shelving Dry air circulation 200 modules per cabinet We are currently storing 2400 modules ! We will need to add storage for >600 modules while waiting for rod assembly to restart

13 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 13 Rod Production Mostly on hold awaiting new I2C cards Building DS rods now for CRACK Start sustained production exercise (40 rods per site) very soon Internal workshop in August to converge on remaining loose ends Minutes http://hep.ucsb.edu/cms/rod/workshopAug2005.htmlhttp://hep.ucsb.edu/cms/rod/workshopAug2005.html Some of the issues discussed Agree on default long term standard scenario: 2 day, go cold 4 times "Finalize" cuts to flag bad channels Module grading: Same as ARCS Rod grading - Pass if: Only A or B modules ≥ 1 out of 3 non-DCU thermistors OK I(leak) for all groups < 20  A XML file for DB Went over it line-by-line

14 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 14 I2C Errors All indications are that the problem is completely solved with the new IC cards. However… In US test stands, we still have some occasional ones (64,68,72…) Do not really affect testing Much progress done at CERN – Now believed to be completely understood and will be eliminated. We agreed to stop I 2 C studies in US. Concentrate on production readiness. New ICC Cards About to have enough in hand for 20+ rods to start final rod installation in early November! Focus now on preparation for high rate Rod production in US. Need: Shake out last kinks in production cycle (40 rod exercise). Definition of Digital tests. Some DB details to be sorted out.

15 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 15 Developments at CERN Tests performed on rods at CERN indicate that residual I2C problems are negligible. Another change with the IC card is the potential to change the rod grounding. The new design of the Interconnect-Cards allows an additional ground connection (power return to cooling pipe). Tests performed with Cosmic Rack were performed to understand if the additional ground connection is to be implemented or not.

16 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 16

17 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 17 Rods Acceptance at CERN Number of tested rods: 25 Rod types: SS4_H: 6 x Type 3 SS6_L: 4 x Type 3 SS6_H: 2 x Type 1, 2 x Type 2, 11 x Type 3 NO rod rejected ! Test of 3 rods takes ~ 6h

18 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 18 TST-TOB integration test, July 2005 The TOB fits! … even if clearances reduced from nominal 10 mm to 2-3 mm at thermal screen connections. Further clearance losses must not happen.

19 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 19 TST-TOB integration test, July 2005 A perfect match inside the TST!

20 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 20 TST-TOB integration test, July 2005 Final TIB layer 4 backward + mock-up TID inside the TOB. Inner Rails function as required, clearances ok.

21 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 21 Rod to Wheel insertion Selecting the Rod. Helium leak test of the Rod cooling pipe and Connection of the optical ribbon Optical ribbon attached to installation fork.

22 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 22 Rod to Wheel assembly Rod installation tool aligned with a “Pre-Rod” Rod attached to the installation tool at comfortable height and orientation. Installation tool supported from the Wheel

23 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 23 Alignment tube prototype Alignment tubes supplied by Aachen.

24 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 24 To do Test insertion and pipe soldering of a Double-Sided rod Prepare of lab 186 (upstairs) for present integration work He, dry air, C6F14 lines, He leak detector Assembly of the Cooling segment 2.6.2 with 19 FNAL “Pre-Rods” Pipe soldering, Cabling, Functional tests (power, ctrl, read-out) Development and testing of work platforms, tooling, etc. Get ready (by end of October) to start final Rod assembly Dismount pre-assembled Cooling segment 2.6.2, Production and testing of all cooling manifolds (88-2) Cable supports for the Wheel and for the Thermal Screen Prepare equipment for Wheel transport to downstairs 186 Solve all unforeseen…

25 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 25 Schedule FIRST RODS FOR FINAL INTEGRATION AT CERN: 11+11 rods finished and shipped to CERN by Oct. 14 SS6-H type 1,2,3: 1,1,15+1 US to study ICC swap in-line with production US Rod production ramp and rates Agreed today on ramping up to 4 rods per day at each site starting in November With 20% contingency, the rate is 130 rods per month delivered to CERN. MonthTOB+TOB- Buffer or Deficit at 3/d/site Buffer or Deficit at 4/d/site Oct020 Nov0604070 Dec8002050 Jan7003060 Feb12070-90-60 Mar100120-120-90 Apr0100030 Totals370 -12060

26 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 26 In summary, things are going well

27 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 27 Backup slides

28 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 28 Hybrid Testing (as of Sep. 10) WeeklyCumulative PassFailPassFail% Pass L12su003800.00% L12sd004000.00% L12pd60122610.00% L34p+L12pu38010841598.64% L56p0016352298.67% R2N6099298.02% R2S0078198.73% R5N7295299.33% R5S47-3325299.39% R690334698.24% R70015810.00% Total167-343125298.81%

29 September 21, 2005 - J. Incandela- TOB Status – CERN, CMS Week 29 US Module Assembly (as of 9/16) TOB 45% complete Will be 48% by end of this week ~650 TEC complete TOB 45% complete Will be 48% by end of this week ~650 TEC complete


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