1. NanoFab Trainer Update
Nick Reeder, January 31, 2014

2. Updates to User Interface
Revised “Operate” dialog boxes to incorporate rate graphs.
To address concern of Jamshid’s student Rajput, added code to ensure that Tutorials tab displays Introduction page on first visit.

3. Bug Fixes
Found and fixed a problem with code that adds a new layer: previously, the thickness of new layers was truncated if the layer extended beyond the top of the display window.
Found and fixed a problem with Develop code, which previously incorrectly handled unexposed positive photoresist.

4. Lift-Off Code
To let users perform lift-off, added code that removes any isolated regions floating in air after an etch process has removed the underlying material.

5. To-Do List
Implement look-up tables to compute deposition rates for CVD based on user-supplied pressure & temperature.
Populate evaporation look-up tables with values.
Populate sputter look-up tables for Au, Ni, Pt, W, Si3N4, Ta2O5, TiO2, Si.
Fix expose, develop, polish code to compute depth from user-supplied values.
Continue writing bake code; need realistic values for S0 and .
In expose code, implement diffraction of UV in air and absorption within resist, with dependence on solvent content from bake code.
Fix etch code so that (for photoresist) etch rates depend on solvent content from bake code.
Fix spin-coat code so that resist does not adhere to underside of horizontal surfaces.
Write new code for
Clean
Profilometer
Write time-cost-quality code for all operations.
Write online help text.
Produce videos for Videos tab.

6. Activity
Not started
Partial
Complete
Simulation coding
Clean X
Spin coat
Bake
Mask/Expose/Develop
Evaporate
Thermal oxidation
CVD
Sputter
Wet etch
Dry etch
Lift off
Polish
Implant
Track time, cost, quality of each process
User -interface coding
History with option to revert
Save/open history files
Edit colors
User-defined materials
Profilometer
Producing embedded media (videos, photos, etc.)
Testing
Documentation