1. MCP from Glass Substrates
Jeffrey Elam
Argonne National Laboratory
April 14, 2009

2. MCP Structure resistive coating (ALD) emissive coating (ALD)
pore
resistive coating (ALD)
emissive coating (ALD)
conductive coating (thermal evaporation)

3. What ALD Film for Resistive Coating?
ZnO: conductor
Al2O3: insulator
ZnO/ Al2O3 alloy – tunable resistivity

4. What Composition ALD Film for Resistive Coating?
number of pores in MCP : # pores = Aplate/Apore*(open area ratio) = 4.4x105 pores
Aplate = area of MCP, Apore = area of one pore
resistance of one pore: Rpore = Rtot * # pores = 4.4x1013 Ω
Rtot = resistance of MCP (Target: 100 MΩ)
cross sectional area of film: Afilm =πr2- π(r-t)2 ~ πtd = 0.012t cm
r = pore radius, t = film thickness
resistivity of film: ρ = Rpore Afilm/L = (3.3x1012) t Ω cm
ρ = resistivity of film (Ω cm), L=pore length (0.16 cm)
Convenient thickness: t=100 nm = 10-5 cm, ρ = 3.2x107 Ω cm
~70% Zn

5. Emissive Coating Arradiance identified MgO and Al2O3 (Zeke Isepov)
Al2O3 is easiest for first try
What thickness?

6. Conducting Coating Thermal evaporation (building 200, Schlueter)
Material? Thickness?