1. STMicroelectronics LPS22HB
Nano pressure sensor – Absolute barometer
MEMS report by Sylvain Hallereau
November 2016
21 rue la Noue Bras de Fer
44200 NANTES - FRANCE

2. Table of Contents Overview / Introduction 4
Executive Summary
Reverse Costing Methodology
Company Profile 8
STMicroelectronics
LPS22HB Characteristics
Physical Analysis 14
Synthesis of the Physical Analysis
Physical Analysis Methodology
Package 17
Package Views & Dimensions
Package Pin Out
Package Opening & Wire Bonding Process
Package Cross-Section
ASIC Die 27
View, Dimensions & Marking
Delayering
Main Blocks Identification
Cross-Section
Process Characteristics
MEMS Die 39
Cap Removed & Cap Details
Cap Holes – Cross-Section
Sensing Areas Details
Cross-Section (Sensor, Caps & Sealing)
Bottom Cap Removed & Details
Comparison 67
Manufacturing Process Flow 73
Global Overview
ASIC Front-End Process
ASIC Wafer Fabrication Unit
MEMS Process Flow
MEMS Wafer Fabrication Unit
Packaging Process Flow
Package Assembly Unit
Cost Analysis 96
Synthesis of the cost analysis
Yields Explanation & Hypotheses
ASIC Die 101
ASIC Front-End Cost
ASIC Back-End 0 : Probe Test & Dicing
ASIC Wafer & Die Cost
MEMS Die 104
MEMS Front-End Cost
MEMS Back-End 0 : Probe Test & Dicing
MEMS Front-End Cost per process steps
MEMS Wafer & Die Cost
Component 110
Back-End : Packaging Cost
Back-End : Packaging Cost per Process Steps
Back-End : Final Test Cost
LPS22HB Component Cost
Estimated Price Analysis 117
Company services 121

3. Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the STMicroelectronics LPS22HB pressure sensor. The LPS22HB is an absolute pressure sensor optimized for altimeter and barometer, GPS application and weather station. With dimensions of 2 x 2 x 0.76 mm, it can be integrated in smartphone and wearable electronic. It offers a 60% smaller footprint compared to the previous generation and a 66% smaller volume. Key technical features of the new device include 260 to 1260 hPa absolute pressure range, SPI and I²C digital interface and a low current consumption down to 3µA. The LPS22HB operates with a supply voltage range of 1.7V to 3.6V.

4. Package View & Dimensions
Package: HLGA 10-pin
Dimensions: 2 x 2 x 0.76mm
Pin Pitch: 0.4mm
Marking:
C618
2 mm
2 mm
Package Top View
Package Bottom View
0.76 mm
Package Side View

5. ASIC View & Dimensions
XXmm
XXmm
Die Area: XXmm² (XXXXmm) Nb of PGDW per XX-inch wafer: XXX
Pad number: 20
Connected: 18
ASIC Die Overview

6. MEMS View & Dimensions
XXmm
XXmm
Die Area: XXmm² (XXxXXmm) Nb of PGDW per XX-inch wafer: XXX
Pad number: 9
Connected: 9
MEMS Die Overview

7. MEMS Sensor Dimensions

8. MEMS Front-End Cost

9. MEMS Front-End Cost

10. Component Cost

11. Contact Headquarters Europe Sales Office America Sales Office
FRANKFURT/MAIN
Europa Sales Office
NANTES
Headquarter
LYON
YOLE HQ
TOKYO
YOLE KK
PHOENIX
YOLE Inc.
GREATER CHINA
YOLE
Headquarters
21 rue La Noue Bras de Fer Nantes FRANCE
Europe Sales Office
Lizzie LEVENEZ Frankfurt am Main GERMANY
America Sales Office
Steve LAFERRIERE
Phoenix
USA
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
Mavis WANG
GREATER CHINA