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Boom Electronics Board (BEB)

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Presentation on theme: "Boom Electronics Board (BEB)"— Presentation transcript:

1 Boom Electronics Board (BEB)
Jane Hoberman University of California - Berkeley

2 BEB Review Outline Overall BEB design goals - Changes since PDR
- Reviews Sub circuit design, performance requirements and verification: - Floater Driver - Bias, Usher and Guard Driver - EFW/ Emfisis Buffer - Ground Diagram How well does the BEB meet it Specification? - Power - Mass - Specification Table - Parts (including Stress Analysis) Status

3 EFW BLOCK DIAGRAM

4 BEB Design Drivers - The Bias Drivers will provide current biasing of sensors. - The Usher and Guard Drivers will provide voltage biasing of photoelectron control surfaces. - The Floating Ground Driver will provide the reference source for each preamp ground, with a range of +/- 215 V with respect to SC ground. - The BEB will provide “Bias”, “Guard”, & “Usher” programmable DC offset potentials with readback. - The BEB will provide an AC test signal source to preamps. - The EMFISIS buffer will deliver buffered, low-noise, analog, difference E-field signals to EMFISIS-WAVES from 10 Hz to 400 kHz.

5 New RBSP BEB Design Elements
BEB is based on CRRES, POLAR, and most recently, THEMIS heritage. Changes from Themis BEB Design (no significant design changes since PDR): +/-225 V output stage increased from +/-100 V, in order to increase Floating Ground and BIAS driver range. - New High Voltage Transistors and Capacitors - Increase in biasing range, thus rail-to-rail op amp required - Layout for 480 V between some parts and traces Floating Voltage increased to +/-15V from +/-10V - change in some bypass capacitors DAC commanding, and AC Test generation in DCB. EMFISIS circuit added - extra power and space requirements - additional noise and frequency response requirement Contingency operation without IDPU interface. Removed from BEB: Actel, braid circuit, RTD

6 All concerns addressed. Peer design review 9/2/09. No issues.
BEB REVIEWS PCB Layout Review 6/30/09 New PCB layout instituted the previously listed changes plus those below. PCB layout and schematic was reviewed . All concerns addressed. Peer design review 9/2/09. No issues. Circuits additions since PDR: Additional filtering for to reduce 200kHz line. Insure no over voltage operation of floaters.

7 BEB BLOCK DIAGRAM

8 BEB Floating Ground Driver
Performance Requirements Frequency Response: LP: 3 dB roll off at 300 Hz. Output Dynamic Range: ± 215 Vdc wrt. SC GND. Output: references Preamp floating power supply (±15Vdc wrt. FGND). Opposing booms matched to 0.1% accuracy, DC to .5Hz. Output level shall track Vsphere to at least .1% , from DC to.5Hz, 0V to 215V

9 BEB BIAS DRIVER Schematic almost identical to Guard, Usher driver
Performance Requirements Frequency Response: LP: 3 dB roll off at 300 Hz. Dynamic Range: ± 175 ± 40 (Vref) Vdc wrt. AGND, where full-scale DAC → Vref = ± 40 Vdc). Opposing booms matched to 0.1% accuracy, DC to .5Hz (BIAS). Gain of 1 with .1% tolerance. (Track Vsphere better than .1% from DC to .5Hz). Noise Level: < 48 uVrms 10 to 10KHz; < 35 uVrms 10K to 400KHz AC distortion < -40dB THD with +/-50VDC +/-100 Vp-p AC DAC Resolution:1 nA DAC Accuracy (BIAS): opposing booms matched to 0.1% DAC step response: <25 ms

10 BEB BIAS AC DISTORTION Vsphere = 26Vpp AC

11 BEB Bias, Usher, Guard Frequency Response

12 EWF to EMFISIS Buffer

13 BEB GROUNDING

14 BEB Power Table Nom Voltage +5V D +10 V A -10 V A +225 V A -225 V A +/-15F1 +/-15F2 +/-15F3 +/-15F4 +/-15F5 +/-15F6 Nominal Current (ma) 3 55* 50* 1.3** .3** 1.8 Nom Power ( W) .015 .55 .50 .2925 .0675 .054 Total nom power (W) 1.749 Peak Voltage +10.5VA -10.5VA +240 V A -240 V A +/-17F1 +/-17F2 +/-17F3 +/-17F4 +/-17F5 +/-17F6 Peak Current (ma) 8 53* 6** 2 Peak Power (W) .04 .5775 .5565 1.44 .072 .068 Total peak power (W) 3.094 * The maximum current of the +10V and -10V supplies are interdependent. The maximum current is dependent on the DAC setting. ** The maximum current of the +225V and -225V supplies are interdependent. The maximum current is dependent on the V sphere input.

15 BEB ETU 1 BEB ETU Mass: 455 grams

16 BEB Performance Compliance
specification Specification Summary Testing Done Status 1 EFW-75: operation temp range Temperature range -25 C to +55C All parts comply compliant 2 EFW-131: initial power On/Reset State DAC comes up at mid range setting Testing complete ETU 1 3 EFW-137 parts compliance See next table 4 EFW- 57 isolated supplies for 4 SPB & 2Axial Preamps By design 5 EFW-101 Contingency operating modes 6 Power 2. Average power:1.75W Peak power: 3.2W 7 Floating voltages 2.2 Floating voltages come up without DCB, DFB 8 Preamp Signal BEB loading BEB input impedance at Vsphere >10G ohms 9 Preamp Signal Distortion distortion to DFB increased < -40dBV Will be done 10 Floating Ground Driver 4.1.2 LP filter: 300 Hz 3db roll off Output level shall track Vsphere to at least.1%, from DC to .5Hz, 0V to 215V Compliant

17 BEB Performance Compliance (con’t)
specification Specification Summary Testing Done Status 13 4.1.3 Bias/ Usher/ Guard Spec HP filter: 300 Hz 3db roll off Complete with ETU 1 compliant 14 DAC resolution better than 1nA (E-field) mode calculated 15 DAC accuracy BIAS: better than .1% matching -40v to +40V on opposing booms 16 DAC accuracy Usher & GUARD: better than .5% matching -40v to +40V 17 Gain Matching (BIAS) better than .1% DC +/- 215 VDC 18 AC distortion <-40 dB THD with +/-50VDC +/- 100V p-p Will be tested 19 Noise Floor: 10 Hz to 10KHz <48uVrms 10KHz to 400KHz <35uVrms Excluding lines at multiples of 50KHz Preliminary Test okay Will tested in IDPU box with LVPS 21 4.1.4 ACTEST Output Spec 22 5 Commanding AC test signal 23 DAc control 24 5 Command, 6 Analog Housekeeping Analog Mux 25 DCB Functional IDPU 8/15/09 26 LVPS 27 DFB

18 BEB EMFISIS Performance Compliance
specification Specification Summary Testing Done Status 1 EFW-59 3 differential buffers By design compliant 2 EFW-102 EMFISIS will be powered without operational DCB, DFB Testing complete ETU 1 3 EMFISIS spin plane sensor signals Frequency response 10Hz to 400KHz UCB & Iowa(8/21/09) 4 Sensitivity: 10Hz -12KHz: 3*10-14(V/m)2/Hz at 1KHz Iowa Preliminary: noise floor -100db* & meets requirement 5 Sensitivity: 10KHz -400KHz 3*10-17(V/m)2/Hz at 100KHz Iowa Preliminary: 5% above requirement* 6 Max signal Amp: 50mV/m at 1KHz 7 Dynamic range:100,000 8 Output Impedance 20 ohms 9 EFW-208 EMFISIS axial plane sensor signals Frequency response 10 to 400KHz Not done To be done** 10 Sensitivity: 10Hz -12KHz 3*10-15(V/m)2/Hz at 100Hz 11 12 30mV/m at 100KHz 13 Dynamic range:10,000 14 15 Mate with EMFISIS Iowa (8/21/09) *Includes room noise and EMFISIS instrument **Not expected to be significantly different from Spin Plane test

19 BEB Parts and Quality assurance Compliance
PART NUMBER PART TYPE DERATING Testing Required STATUS 1 HA5127 OP AMP Total Dose radiation DC Passed 1/7/09 DDD DC passed 10/2/08 2 AD5544 DAC Single Event Upset APL 3/18/09 3 AD648 DC passed 10/24/08 4 2SA1627 -600V PNP transistor Power .6=.6W Current .75=.75A Voltage .75=-450V Screened: EE-INST-002 section S1 table 2&3, derating table 4 Compliant SPT5502TXV 700V NPN transistor Power .6=3.6W Voltage .75 =525V EE-INST-002 section S1 table 4 5 AD822 Screened: EE-INST-002 section M3 table 2&3 In Process 6 M49467P07XXXJ 600V capacitors .6 ceramic derating to 360V EEE-INST-002 section C1 table 4 7 PCB layout IPC-2221 PCB review 6/30/09 8 PCB board FR4 4101/26 used I-6012PC Stress Calculations done on all parts. Spread sheet available.

20 BEB Summary of Documentation Status
Document Name Number Status Date 1 BEB Schematic RBSP_EFW_BEB_002 REV F ETU Release 9/25/09 2 BEB Bill of Material 3 BEB Layout RBSP_EFW_BEB_004 REV C 8/3/09 4 BEB Performance Specification RBSP_EFW_BEB_001 REV G pending 5 EFW to EMFISIS Interface REV B 6 BEB Test Specification RBSP_EFW_BEB_003 REV A

21 BEB: Test and Build Status
Finishing testing of ETU 2 - Complete verification of layout - AC , and AC +DC distortion test - Noise testing 2.Continue Functional Test of BEB with IDPU and Booms - Axial Boom - with 6 preamps - noise characterization 3. EMFISIS Testing - Axial plane test 4. Complete AD822 screening 5. Thermal testing for calibration purposes 6. Update ETU test plan for Flight

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