1. AIDA-2020 1st annual meeting DESY, 27/01/2016
Activities in Task Test infrastructure for innovative calorimeters with semiconductor readout
Vincent Boudry
École polytechnique, Palaiseau on behalf of the WP task participants
AIDA st annual meeting
DESY, 27/01/2016
Part I
TNA support + WP14

2. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
Task 14.3 Test infrastructure for innovative calorimeters with semiconductor readout
(CERN, CNRS- LLR, CNRS-LPNHE, CNRS-LAL, DESY, TAU, AGH-UST)
Assembly and QA chain for silicon-based Ecals
Development of an assembly line for highly granular calorimeters with semiconductor readout
Test benches for individual silicon wafers and PCB for quality assurance and to study alternatives
Development of a test station to determine signal characteristics in highly irradiated silicon sensors
Validation of a compact calorimeter prototype including flexible precision mechanics and readout
Calorimeters with pixelated Si wafers allow for an excellent particle separation. After an extensive R&D activity supported by EUDET and AIDA, the next step is the development of tools for construction and quality assurance of large-scale prototypes for an ILC-like detector. This starts with the production of test benches for Si wafers and interface boards. These components are glued together into a detection unit of the order of 20×20 cm² using a robotic system. Up to 10 units will be assembled into detector layers using automated tools.
Such a calorimeter could be also a viable option in a hadron collider environment, such as CMS. A dedicated test set-up is needed to test the signal characteristics of irradiated Si wafers operated at temperature at or below -35 degrees C.
This talk
Marcello
Marek
WP report | 1st Annual meeting | DESY, 15/06/2016

3. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
Document for MS14
Slightly late
Proof reading by WP coordinators
→ SC coordinator
WP report | 1st Annual meeting | DESY, 15/06/2016

4. SLAB Assembly: full chain
Copper (cooling)
Shielding
R&D for “mass production” and QA
Quality tests & preparation of large production
Modularity → ASU & SLABs
Choice of square wafers (≠ from hex: SiD, CMS HGCAL)
Numbers (RECAL = 1,8 m, |ZEndcaps|=2,35m) (likely to be reduced by 30–40%)
Barrel modules: 40 (as of today all identical)
Endcap Modules: 24 (3 types)
Slabs = 6000 (B) (EC) = 9600
many ≠ lengths
ASUs = ~75,000
Wafers ~ 300,000 (2500 m²)
VFE chips ~ 1,200,000
Channels: 77Mch
PCB
(FeV)
ASU
Wafer (4)
Adapter board
(SMB)
Carbon+W
U layout of a short slab
Now we have 10 !
U layout of a long slab
WP report | 1st Annual meeting | DESY, 15/06/2016

5. Full assembly chain resp: R. Cornat + L. Lavergne
⚠ Simplified view ⚠
WP report | 1st Annual meeting | DESY, 15/06/2016

6. PCB Metrology by D. Lacour
Development of an automatic process using a coordinate measuring machine (tri-dim machine)
Before cabling :
Squaring, Parallel edges , Size
Thickness (flatness in depression)
Flatness
After cabling :
flatness and thickness
WP report | 1st Annual meeting | DESY, 15/06/2016

7. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
PCB Metrology results
40 PCB controlled
Criteria (measurements before cabling)
Planarity tol.0.4 mm
Size : to mm
Thickness: 1.55 to 1.70 mm
Squaring: tol mm
Edge parallelism tol.0.05 mm
Rejection yield : ~40% (essentially due to a too large size for alveola)
WP report | 1st Annual meeting | DESY, 15/06/2016

8. ASU Setup“4 wafers without glue”
Mickael Annecy
 The goal:
2.0 – Setup option with support of test electric probes for connecting WAFER to FEV
- Realize an assembly with removable wafer in order to acquire cosmic data. This assembly will test the entire acquisition chain (Wafer-FEV-SMBV4-DIF-GDCC-CCC-PC-Software) before the wafer gluing operation. The first test was realized last week
Hv Kapton
WAFER
FEV
SMBV4
Dif
Mechanical support for 1024 Test Probes
PCB shielding
Thanks to Marc Louzir
WP report | 1st Annual meeting | DESY, 15/06/2016

9. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
WP report | 1st Annual meeting | DESY, 15/06/2016

10. Test plates: noise reconstruction
With single glued ASU:
Noise determination
Prelimary cosmics measurements → Testbeam measurement
WP report | 1st Annual meeting | DESY, 15/06/2016

11. Measurement and Gluing Test Bench
Several test with fake (glass ASU)
10 ASU glued and in test
Quality procedure to be consolidated
WP report | 1st Annual meeting | DESY, 15/06/2016

12. First step : one wafer glued per PCB
The parameters of the gluing robot have been optimized to glue a silicon sensor (18×18 pads) on a PCB
WP report | 1st Annual meeting | DESY, 15/06/2016

13. Second step : 4 wafers per PCB
Deposit of glue on the PCB
256 × 4 = 1024 dots
Move the plate with the 4 wafers on the PCB
The alignment is fundamental :
PCB = mm maximum
Wafer = 90 mm
Possible improvement: optical measurement of planarity
WP report | 1st Annual meeting | DESY, 15/06/2016

14. Electrical tests results
Measurement after gluing onto the PCB
10 ASU tested, all functional (no short cut).
I(V) measurement for each wafer before gluing – leakage current volts
ASU 23 33 34 42
I total
1.9 11 15 5
WP report | 1st Annual meeting | DESY, 15/06/2016

15. Assembly of SiW ECAL layers (LAL)
~ 13 steps for assembly, 8 élements!
Tests done:
Soldering: ✔
Electrical test: ✔
Readout test: ✔
10 Slabs produced and tested
QA procedure to be consolidated
WP report | 1st Annual meeting | DESY, 15/06/2016

16. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
Production of SLAB’s
Prod between LLR + LPNHE + LAL Supervision done by Rémi Cornat → production for next TB ~3 batches of production
All critical material available (ASIC’s, Wafers)
~Now
August
WP report | 1st Annual meeting | DESY, 15/06/2016

17. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
Beam Tests
WP report | 1st Annual meeting | DESY, 15/06/2016

18. Beam test at CERN 2015 2–16th of November
WP report | 1st Annual meeting | DESY, 15/06/2016

19. CERN 2015: Running conditions & program
Masking : 2.2% of all channels in TRIGGER only
Muon beam spots (X-Y distribution of N triggers, requiring ADC-pedestal>10) from typical muon run (361 as example)
DAQ & config: very smooth (1 single crash due to unchecked physicist scripting)
Adjust threshold by progressive noisy cell masking
Many data taken (but “only” ~85 GB)
Beam structure + ACQ for ILC (bursts of 50 ms × 4Hz)
Muons runs
Calibration high threshold
variation of threshold, and angles (49°, 90°)
Electrons of 15, 30, 50, 100, 150 GeV
with 8.5 X0
with mini-cal option this WE
Pions of 50 and 150 GeV with 1.75 λ
Check non unconventional events
WP report | 1st Annual meeting | DESY, 15/06/2016

20. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
CERN 2015: Analyses
1st : verification of behaviour with simple events
SK2 response ⇐ was a priority for SK2A prod
Filtering Noise and establishing clean events
2nd : check of collective response
Correlation between plates
Modelling of shower response
G4 MC being written by A. Psallidas (National Taiwan University, CMS)
Examples given here
analyses from V. Balagura, K. Shpak
First analysis of efficiency
WP report | 1st Annual meeting | DESY, 15/06/2016

21. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
CERN 2015:
Annoyances
Good news !!!
Re-triggering! Masking verification: some issues
Data corruption
in case readout time wasn’t sufficient
corrected by DAQ settings
Negative signal (ADC=4)
located near the DIF connectors
Pedestal stability
Slow drift after power-on on long period
Spilt and delayed triggers
“High intensity” signal delays trigger
Chip full events
Non-operationnal chips if SCA=15 in ACQ-1
Pedestal width:
S(MIP) / RMS(pedestal) =
Good even for short spills with “real” power pulsing and drift effects
For 100M ch ECAL, with a mip/3 = 5–6 σ ⇒ p(noise/cell) = 6×10-7–2×10-9 ⇔ 60–0.2 hits/BX
Most corrected in SK2A
WP report | 1st Annual meeting | DESY, 15/06/2016

22. Efficiency from tracks (prelim.) by V. Balagura
Space
Using tracks extrapolation from 2 planes onto the 3rd one
very clean samples of tracks
1 hit/ layer
adc-ped > 40.
no constrain on studied layer
Time : BX±1
Track maps (layer 3)
WP report | 1st Annual meeting | DESY, 15/06/2016

23. Efficiency map of triggering on mips (prelim.) by V. Balagura
ε vs ch per chip
ε vs Memory (SCA) ~ Time
⟨ε⟩CHIP> 97%; ⟨ε⟩LAYER ≥ 98.3 %
Single inefficient chip (in 48)
Small dependence (also in pedestals) but for faulty chip
– High mip detection efficiency – mandatory for PFA – is reached
– Low fraction of non-triggering zone (~2%) + 2% as faulty chip.
– Re-triggering occurrence in BX±1 ≤0.5%
WP report | 1st Annual meeting | DESY, 15/06/2016

24. OMEGA SKIROC2A by S. Callier, C. de la Taille
400 SK2A chips delivered. Power OK
Production possible through CMS-HGCAL collaboration
WP report | 1st Annual meeting | DESY, 15/06/2016

25. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
BT in 2016 and beyond
WP report | 1st Annual meeting | DESY, 15/06/2016

26. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
Beam test June 2016, 7–22 preparation by R. Cornat, F. Magniette, J. Nanni
Real calorimetric tests with 10 SLAB’s in coordination with SDHCAL
10 slabs (no more test plates)
3 JIT + 1 repaired but 1 lost due to a brutal general power CERN
expected improved S/N ratio, robustness
Flexible structure to accommodate
variable number of SLAB’s
be in “real conditions” for PFA tests:
24 X0 of W + 3 7 cm gap before SDHCAL
Goals: ⇒ Instrumental characterisation of SLABs ⇒ test of PFA tools
R. Cornat
WP report | 1st Annual meeting | DESY, 15/06/2016

27. Commissioning by R. Cornat, F. Magniette, J. Nanni
Beam ≥ 10/06
but Power Cut on 11/06 → damages SDHCAL (5 layers) + ECAL (1 slab)
DAQ
running in common with SDHCAL (SC, spill, Control) Synchronous data storage ✔ Data Exchange unstable ✘ (for online)
Commissioning
Noise scan (High Gain) → threshold high (270 ~ 85% mpv)!
Noise issue tracked to limited PS on Sunday (+effect of power cut ?)
Plans:
Strengthen PS ✔
update DAQ for exchange (today)
Common Runs 16–22...
WP report | 1st Annual meeting | DESY, 15/06/2016

28. WP14.3.1 report | 1st Annual meeting | DESY, 15/06/2016
Conclusions
Production of 2 small batches well on tracks
10 slabs working! (but for CERN PS)
Some procedural defects corrected
Spin-off for ATLAS HGTD 3×3 mm³ pads gluing
Quality procedure to be consolidated (e.g. centralized)
SiW-ECAL detector units:
Fine at low E (mips)
Some issues with ASICs ⇒ to be corrected in next version
High Energy behaviour to be tested.
Activity on time...
MS report almost through (~2M late)
WP report | 1st Annual meeting | DESY, 15/06/2016