1. Your Technology Experts…2017
Streamline is UL approved for Lead Free Materials
Your Technology Experts…2017

2. Your Full Service, Time Sensitive, Printed Circuit Board Solution
Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications.
TeleCom
Mil / Aerospace
DataCom
Medical
Industrial

3. Streamline Circuit Corp’s Facility
Manufacturing all levels of technology
Time sensitive prototyping through production
The facility was established in 1982
New management team installed September 2003
75,000 sq. ft. PCB manufacturing facility
Complete manufacturing process under one roof
1 mile from the San Jose Airport
Delivery convenience for out of state customers
Located in Silicon Valley
Short car ride away for pick up & deliveries
Financially secure in current market
conditions
Low cost infrastructure
Located in Silicon Valley

4. Management and their Experience
Chuck Dimick –CEO / Founder
Over 35 years of experience in PCB manufacturing.  Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991)
Greg Halvorson – President / Founder
Over 33 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc.
Tom Doslak – Sr. Vice President of Sales & Marketing / Founder
Over 25 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc.
Gary Greenberg – VP of Operations
Over 31 years of industry experience. Previously VP of West Coast Operations for the EMS Division. Has held roles in Operations, Engineering, and Quality at DDI, Teradyne and Raytheon.
Glenn Holland – Director of Quality
Over 31 years of Industry experience. Previously held position of Director of Quality at TTM / Via Systems. Has experience in Operations, Assembly, Engineering and Quality.
Mike Trammel – Director of Engineering
Over 27 years of industry experience. Former Director of Engineering for DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience.

5. Management and their Experience Cont.
JR Ramirez – Production Manager / Founder
Over 35 years of industry experience. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc.
Louis Oliveira – Pre-Production Engineering Manager
Over 28 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. Previously was Pre-Production Engineering at Dynamic Details. Held various key positions at Davila International Circuits.
Phil Ramon – Pre-Production Engineering Supervisor
Over 37 years of experience in the PCB industry. Previously worked for 16 years on the management team for South Bay Circuits, more than 9 years as Pre-Production Engineering Manager and 10 years at CTS Printex. 

6. Customer Service Support
Customer Service (24 hours - 7 days a week)
Sales, Engineering, Manufacturing and Quality
Dedicated customer service readily available-our support group’s located onsite in the facility
Quick response to all requests such as:
Job status
Delivery pull-in
Quantity Increases
Engineering design modification
Inside Sales Customer Support

7. Proactive Engineering Services
Manufacturing Capabilities
Prototype though volume
All time sensitive builds
DFM (Design for Manufacturability)
DFM Software (reviews in 10 minutes)
Net list compare to customer data
Custom Verification programs
Looking for customer design error
In plan Smart data Collection System
Controlled Impedance Verification
Stack up assistance
Copper distribution
Material verification
Cam Valor Stations
4 Laser Direct Imaging units

8. Controlled Impedance Verification
DFM Scan & Report
Stack up assistance
Copper distribution
Material verification
Sub Panel /Array Support
Go to Pre-Production

9. Automated Optical Inspection Fusion 22
Quality Reassurance
Net list compare prior to MFG
Matching Net list to Gerber data
Front End DRC (design rule check)
Searching for customer design mistakes
AOI Automated Optical Inspection
Verifying inner & outer layers, and SUBS
X-Ray Verification
After Lam (Inspecta), After Drilling
Cross Section Verification
Hole Integrity True-Chem Software
Controlled Impedance Testing
TDR test of panel coupons
100% Net List Test On All Product
Eliminator Tester & flying probe
Coordinate Measurement Machine
First articles, 100% measurement verification
Automated Optical Inspection Fusion 22
In house Mil & deliverable Lab

10. On Time Delivery Assurance
100% In-house manufacturing from start to finish
Control delivery & customer flexibility
In-process quality verification system
No out sourcing delivery delays
Employee Training program
Performance evaluation every 6 months
In-house Chemical Laboratory
Cross Sections
Chemical analysis
Mil spec verification
10 flying Probe Testers
Vacuum Lamination press

11. Continuous Improvement Programs
Working daily on:
Research and Development
Pre-Engineering Programs
Improvement Process Program
Department Performance Reviews
Preventative maintenance program
Employee Training Program
Planned Capital expense program
Management meetings
7 Laser drills

12. A Full PCB Solution Multilayer Rigid / Rigid- Flex / Flex
1 to 70 Layers Plus
28:1 High Aspect Ratio
3.23 Mils Hole to Copper
Buried / Blind Vias
9 Sequential Laminations
13+ Stacked Vias
1 Mil Trace & Space
Cavity Constructions
6 oz. + Copper Thickness
Copper Filled Micro Vias
+/- 5% Controlled Impedance Tol.
AS9100 Rev. C / ISO 9001 / ISO 13485
Mil-Spec / ITAR
RoHS & Halogen Free Materials
IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency
3 Mil Mechanical Drills
24” x 30” Oversize Panel
2 Mil Laser Drill Vias
Up to 345 Mils Board Thickness
Via Under Pad (Conductive & Non- Conductive Filled)
75+ Materials (Hybrid Constructions)
Certifications

13. New Equipment 2016 Fusion 22 AOI (2) SC150XXL Vertical Spray Coater
3x the speed of previous models
Resolution down to 25 microns
Multi-Image Technology inspects panel multiple times in different lights angles allows errors to be detected across different colors
Smart Setup provides automatic generation of all parameters
Up to 70% false alarm reduction
SC150XXL Vertical Spray Coater
Even coating spray process enhances consistency and mfg.
Throughput Ink free holes
Siemens PLC S7/1200 with Simatic touch screen control panel
Easy to program and store necessary production parameters
In manual mode each single movement can be performed for maintenance 13

14. Schmid Material Prep Line
Computer driven
1 mil cores
OEM Press (3)
4 Total
Excellon Cobra Combination Laser Drill
7 on site
5 Yag lasers
2 CO2
Nuvogo 800 LDI
Measures down to 18 microns
5 on site

15. In-Plan Pre-Engineering (Fully integrated)
Automated Traveler (Rule based)
Material Prediction Software (Improves registration)
Frontline DFM Tool (Insight, Genesis)
CI Modeling and Verification ±5%
36 Station Automated Cuposit/Electroless
≥29:1 Aspect Ratio
Dynamic Scheduling for Multiple Material Types
Inspecta X-Ray (2 Machines)
Layer to Layer Optimization
3.2 Hole to Copper
Optimize Advanced Registration for Drilling

16. Flying Probe Tester (8 Machines)
16 Head Test Units
Soft Touch Capable
Fine Pitch .19mm Centers to .003 Pitch
ATG’s A7a (2)
8 advanced speed test heads
Self-loading automation
Automatic adjustment of the vacuum matrix
Universal shuttle with tensioning function
4 wire measurement
Micro short detection
Label printer

17. Engineering walk through
PCB TECHNOLOGY ROADMAP
Standard
Manufacturing
Advanced
Manufacturing
Emerging Technology
Engineering walk through
.003”
+/-.001”
.0038”
+/-.001”
.002”
+/ ”
.001”
+/-.0005”
.0005”
+/ ”
Line Width
1. Line and Space
Line Space
Tolerance
Drill Size
.008”
+.010”
28:1
.004”
+.008”
20:1
.003”
+.006”
20:1
.003”
+.002”
28:1
2. Drilled Via Size
Pad Diam
Aspect Ratio
Up to 36
Up to .187”
<16”X22”
36 to 48
Up to .300”
<19”X22”
48 to 60
Up to .350”
<22X28
>.350
Layer Count
3. Misc. Attributes
Thickness
Board Size
FR4
Polyimide
PTFE
HC (Rogers)
Interposer
Substates
UTR’s
Next
Generation
HSD
Advanced
Interposers
Nano Foils
Alternative
Resin Systems
Change drill to current – mat page
4. Laminate Materials
Rigid
Flex
Rigid Flex
FR4
Stiffeners
EMI Shield
Conductive
Bond Ply
Thin Flex
UL Approved
High Speed
Flex High
Reliability
Flex
Data Security UL
Multilayers
Flex
*UTR = Ultra Thin Rigid 17 17

18. TECHNOLOGY ROAD MAP CONTINUED
Emerging Technology
Standard
Manufacturing
Advanced
Manufacturing
Engineering
Walk through
Via Size
.004”
+.005”
.6:1
.003”
+.004”
1:1
.002”
+.004”
2:1
.001”
+.003”
3:1
5. Micro Via Size
Pad Dam
Aspect Ratio
HASL
Entek
Imm Silver
ENIG
ENEPIG
LF HASL
Eless Au
Sel Solder
Imm tin
Solder
Bump
TBD
6. Surface Finishes
+/-.003”
.006”
+/-.002”
.003”
+/-.001”
.002”
Tangency
Registration
7. LDI Soldermask
Min opening
Min hole
.012”
8:1
.010”
12:1
.008”
18:1
<.008
20:1
8. Conductive and
Non-Conductive Via Fill
Aspect Ratio 18 18

19. Nadcap
ISO 9001:2000
IPC 6012,13,15,16,18 Class 3
ITAR
AS9100 Rev C
Mil-Spec in process

20. Total Quality Management
Q-Pulse
Total Quality Management
Quality Assurance Systems
Q-Pulse Quality System
NCMR’s and Corrective Actions
Audits
Training
Equipment Calibrations
BACK

21. Streamline’s Capital Expenditures
Use advanced equipment technologies to manufacture today's printed circuit board requirements
The future in PCB manufacturing is about
technology and automation
Hire and Train equipment operators
High percentage engineering personnel and staff
Laser Direct Imaging Nuvogo 800 LDI
Cuposit & Electroless Line
DES Inner Layer Stripline

22. Resin fill/stacked Vias
Design Strategies
Epoxy fill with copper Vias
Resin Fill off set Vias
Resin fill/stacked Vias
All Copper Fill process

23. V-Stacks: Patented MicroVia technology that will change everything
A combination of Streamline's engineering talent created V-Stack, a new MicroVia manufacturing process that will change everything we know about Via Stacking. This technology allows a manufacturer to create MicroVia structures greater than 4 layers deep with only 1 lamination cycle. V-Stack technology also yields finer features and higher layer to layer reliability. Due to the 30% - 60% reduction in processing, this MicroVia technology is a cost effective route for advanced technology.

24. IPC Manufacturing Class & Industries

25. Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex
8 Layer Rigid Flex Micro via
6 Layer Rigid Flex with Cavity

26. Registration and Micro Via’s
PCB Equipment Needed
for the Future
Pre Production
Engineering
LDI Image
Processing
Develop Etch
Strip
Registration and Micro Via’s
Laser Drilling
Electroless
Technology
Solder Mask
Silkscreen
Test
Product Integrity
Quality
Verification
Streamline is UL approved for Lead Free Materials
Off-Shore Solution
Test Cases
Flex / Rigid-Flex
Back

27. Flex / Rigid-Flex

28. Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex
8 Layer Rigid Flex Micro via
6 Layer Rigid Flex with Cavity

29. Flex Capabilities Standard Advanced Layer Count 1L to 6L 8L to 10L
Maximum Panel Size
10”x16” (250x406mm)
10”x35” (250x889mm)
Min. Line/Space (H & ⅓ oz)
0.004" (0.10mm)
0.003" (0.076mm)
Outline Tolerance
+/-.004” (0.10mm)
+/-.002” (0.05mm) by laser
Stiffener Types
PI, FR4+PSA
PI, FR4, Steel, Alum
Polyimide Thickness
0.5, 1 mil (12.5, 25um)
2, 3, 4 mils (50, 75, 100um)
Base Copper Thickness
0.5, 1 oz (17.5, 35um)
¼ to 2 oz (9 to 70um)
HDI Microvias
Yes
Adhesiveless Materials
Flexible Soldermask
White Coverlay
RA Copper

30. Base Material Flex and Rigid Flex
Other Material Flex and Flex-Rigid
Name Manufacture Material Name
Conductive Silver Ink DuPont CB028
Flex LPI Solder Mask Taiyo PSR-9000FXT, PSR-900
Rogers RFLEX 8080 Liquid Coverlay
Kapton/Polyimide Stiffener DuPont Pyralux, FR, Pyralux
FR4 Stiffener Isola FR406, FR408, 370
Grace GA-170LL
Polyimide Stiffener Arlon N
Aluminum Stiffener
Pressure Sensitive Adhesive 3M MP, F9469PC, F9460PC
Strain Relief (Epoxy) Emerson &Cuming Eccobond 45 Clear, Black
IPC Manufacturer Material Name
4202/1 DuPont Pyralux FR
4203/1 DuPont Pyralux FR
4203/18 DuPont Pyralux FR, Pyralux
4204/1 DuPont Pyralux FR, Pyralux
4204/11 DuPont Pyralux AP
4101/21 Isola FR406, FR408, 370
4101/24 Isola FR406, FR408, 370
Arlon PrePreg 49N
4101B/124 Arlon PrePreg 51N
4101/26 Isola FR406, FR408, 370
Isola Prepreg FR406N
Grace GA-170LL
4101/41 Arlon 35N
Isola Prepreg P26
4101/42 Arlon PrePreg 38N
4101/99 Isola 370HR
Note: Other materials available and have been manufactured, but non standard on per customer request.

31. Technology Process

32. Pre-Production Engineering
Services
“In Plan” planning software
Customer Specific Rules Based Automation
Valor front end CAM (Unlimited Seats)
Industry Standard for front end engineering
Stack up consultations, Service Offered No Charge $
Insight Frontline DFM’s, Service Offered No Charge $
Tech Seminars /Webinars
Material Science, Latest in Laminates and Pre Preg’s
R&D, Building the Toughest to Gain the Knowledge
When you need it, we will be ready!
Go to slide 8

33. Hybrid Construction for low cost
(Meg 6 combined with low cost material for power layer)

34. High Speed Materials Website Page

35. DFM Report

36. Graphical DFM report
BACK
Go to slide 8

37. Imaging System

38. LDI (Laser Direct Imaging) Orbotech Paragon SM20

39. LDI Imaging Systems 100% Laser Direct Imaging (LDI)
Repeatable process, computer controlled
24/7 consistent imaging regardless of shift
No film means lower tooling costs
No repeating defects
Consistent trace width
Tighter impedance control (+/- 5 %)
¼ Mil Accuracy Min Line/.0005 Space
Layer to layer registration within .0004”
No film growth due to heat expansion
BACK

40. SCHMID Precision DES Line (Develop – Etch – Strip)

41. Inner Layer Develop Etch Strip
January 2012 State of the art Schmid DES line Installed
Computer controlled for consistent product
Full automation removes human element
2 Micron variation over panel
1 mil core capability for substrate, HDI, and Rigid flex
4,000 Cores per day capacity based on current copper mix
Tripled capacity upon installation
Positions Streamline for future technologies
BACK

42. Precision Laser Drilling 6 High Speed Laser Drills

43. Laser Drilling 6 Laser drills in house (7th has been purchased)
Daily processing 4-N-4 of means experience
Higher stacks available
.0014” Hole, .004” Pad advances technology window
Aspect Ratio: 3:1
Positional Accuracy for Hole Location +/ ”

44. Via formation, Aspect Ratios and Stacked Vias for Increased Densities
BACK

45. Electroless Processing
Completely Automated Line installed January 2012
Industry leading 28:1 Aspect Ratio: allows for higher density designs
Bar coded processing removes operator errors
Dwell times established in planning for speed & efficiency, translating to consistent product
Ultrasonic, knife edge agitation, vibration & thumper
36 stations, Oversized tanks (24”x 30” Panels)
High volume throughput capability
BACK

46. IPS Automatic Electroless Plating Line

47. Test Capabilities: 100% Flying probe testing (8 Systems)
Flexibility, no fixtures, less cost
Allows for testing sub chapters before final book
Everett Charles Eliminator for faster testing
Every board 100% Net List Tested
BACK

48. ATG Flying Probe Testing (8)
16 Head Test Units
Soft Touch Capable
Fine Pitch .19mm Centers to .003 Pitch
ATG’s A7a (2)
8 advanced speed test heads
Self-loading automation
Automatic adjustment of the vacuum matrix
Universal shuttle with tensioning function
4 wire measurement
Micro short detection
Label printer

49. Pluritec Inspecta X-ray Registration System

50. Internal Registration
In unison with “Xact Software” for scaling
Internal Registration is one of the key attributes in being successful
X-Ray allows verification in real time
X-Sections Verify X-Ray

51. Xact Scaling Report

52. Non Conductive Filled Via Wrap Per IPC 6012 Class III
Electroless
Wrap
Smooth
Copper
Dendrites
(Teeth)

53. Copper Fill Laser Vias & Through Hole Solid Copper Vias
Thermal Via Farms for Thermal Management
BACK

54. Chip Scale Packaging
Chip Scale Packaging Requires Streamlines Equipment Sets for Success-100% LDI

55. LSMDP Laser Solder Mask Defined Pad Using the LDI’s
Precise Imaging to .0005” clearance
Allows reduced solder mask clearance sizes
May reduce layer count
Maximize geometry
Using laser solder mask defined pad (LSMDP)
You can define a “Pad” on top of a pad

56. LSMDP (Laser Solder Mask Defined Pad)

57. Ink Jet Silkscreen Orbotech Sprint-8TM

58. “Now Engineers can actually read to debug!”
Ink Jet Silkscreen
“Now Engineers can actually read to debug!”
Ultra Fine Crisp Lines, Down to 3 mil
Serialization on the fly, BAR Code & QR codes
Applied over partially cured mask providing for the mask and legend to be cure simultaneously to reduce cycle time
Combination inkjet and laser technology
Dry's the ink as it’s applied
BACK

59. Quality Verification Verify Expected Results 2 X-Section labs on site
200 plus sections per day
Wet processing lab onsite
CMM For critical measurement reporting
Two TDR’s for impedance verification
Single ended & diff pairs (Separate testing for accuracy)
Ionic contamination testing
In process lamination X-ray verification
XRF Gold thickness verification X-Ray

60. Total Quality Management
Q-Pulse
Total Quality Management
Quality Assurance Systems
Q-Pulse Quality System
NCMR’s and Corrective Actions
Audits
Training
Equipment Calibrations
Quality Certifications
IPC Certified Trainers 6012, 13,15,18
ISO AS9100C ITAR MIL-P-55110
Mil-P In Process
BACK

61. Future Investments New Schmid outer layer etcher
2 Orbotech AOI systems with .0005” (1/2 mil) capability
New Electroless Gold line (Enepig)
2 Additional LDI systems
New Photo plotter for button and silkscreen film
Additional OEM Press
Facility Growth Expansion
BACK

62. Sample Case #1 Equipment Set: Highlights: LDI, DES 1/1 Trace Space
Laser, Inspecta, LDI
LDI, Inspecta, LDI S/M
LDI, Laser, Electroless
LDI, DES, Inspecta
Flying Probe
Highlights:
1/1 Trace Space
4 N 4 Stacked Micro Vias
.225 mm 1300 Pin BGA
1.6 Mil Via – 4 Mil Pad
.020 Thick
Sub Panel Test

63. Sample Case #2 Speed Test: 800ea 10 layers 2 Lamination cycles
Buried vias, 2-9
Laser Micro Blind 2-3, 8-9
Laser Micro Blind 1-2, with via in pad
3/3 trace and space
6.5 PTH to Copper
Delivered in 4 Days

64. Sample Case #3 Extremely Thin 4 Layer Buried vias 2 -3
2 Lamination cycles
Laser Micro Blind 1-2, 3-4
Finished thickness .0054
Equipment set
BACK