1. EE503 Integrated Circuit Fabrication & Packaging Technology
TOPIC 1
INTRODUCTION TO INTEGRATED CIRCUIT
By:
Noorfozila Binti Bahari
Pensyarah Utama
JKE POLISAS

2. TOPICS in EE503 Introduction To Integrated Circuits (IC)
Silicon And Wafer Preparation
Integrated Circuit Fabrication Process
MOS Transistor Fabrication
Integrated Circuit Packaging Technology
Integrated Circuit Testing, Yield And Reliability
Micro-Electromechanical System (MEMS)

3. TOPICS in EE503 Introduction To Integrated Circuits (IC)
IC technology evolution
Classification of IC

4. TOPICS in EE503
Silicon And Wafer Preparation

5. TOPICS in EE503
Integrated Circuit Fabrication Process

6. TOPICS in EE503 MOS Transistor Fabrication NMOS transistor
PMOS transistor

7. TOPICS in EE503
Integrated Circuit Packaging Technology

8. TOPICS in EE503 Integrated Circuit Testing, Yield And Reliability
IC testing
Defects and Yield Analysis
Reliability and Degradation

9. TOPICS in EE503
Micro-Electromechanical System (MEMS)

10. Learning Outcomes Understand Integrated Circuit (IC) Technology
At the end of this session, students should be able to:
Understand Integrated Circuit (IC) Technology
Know the classification of IC

11. INTRODUCTION TO IC Definition of Integrated circuit
A complex set of tiny components and their interconnections that are imprinted onto a tiny slice of semiconductor material (e.g silicon).
Integrated circuits are usually called ICs or chips.

12. History of Semiconductor Industry

13. History of Semiconductor Industry

14. History of Semiconductor Industry

15. Main Applications of IC
Most electronic equipment today use integrated circuit, for example:
Computer / Server / workstation
TV / Radio / Video
Cell Phones
Digital Clock
Robotic Systems
Telecommunication System
Automotive
Medical Equipment
Aerospace
Children's Toys
Military Field
Missile System
etc.

16. Advantages of IC i. Small ii. Low Cost iii. Light Weight
iv. Low power consumption
v. Easy replacement
vi. High reliability
- the ability of a system or component to perform its required functions under stated conditions for a specified period of time.

17. IC Integration Scales 12
In 1975, he updated his prediction to once every months.

19. Factors that contribute to the accuracy of Moore’s Law
Miniaturization size of transistor from 10µm (micron) to submicron. Nowadays, the smallest transistor is 45nm (0.045µm).
Evolution of transistor design rule
micron submicron deep submicron nano technology
10µm µm µm nm (Pentium Dual Core)
5µm µm µm 20nm (in research)
3µm µm µm

20. Factors that contribute to the accuracy of Moore’s Law
The law is still disputed because the linear growth starts to decline; the number of transistors should increase linearly, but it starts to decrease after 1970.

21. Microelectronics Evolution
Year
Technology
No. of transistors
Example
Transistor 1 -
Discrete Component
FET, Diode
SSI
- Small scale integration 10
Logic Gates, Flip-flop
MSI
- Medium scale integration
100 – 1000
Counter, Multiplexer
LSI
- Large scale integration
1000 – 20,000
RAM, Microprocessor
VLSI
- Very large scale integration
20,000 – 1,000,000
16 bits and 32 bits Microprocessor
ULSI
- Ultra large scale integration
1,000,000 – 10,000,000
Graphic microprocessor
nowadays
GSI
- Giant scale integration
> 10,000,000
Pentium Dual Core Microprocessor

22. Student Centred Activity - Group Discussion 1
Based on the given graphs, relate Moore’s Law to the following evolution of microelectronics memory devices.
Based on the given graphs, relate Moore’s Law to the scaling down of transistor size and the trend in microprocessors.

23. Question # 1.

24. Question # 2

25. Classification of Integrated Circuit
In general, IC can be classified into FOUR (4) categories :
Classification based on circuits function
Classification based on the fabrication method
Classification based on transistor type
Classification based on design methodology

26. Classification Based on Fabrication Method
IC Classification based on fabrication method: a. Monolithic b. Film c. Hybrid

27. Classification Based on Fabrication Method
a. Monolithic
The word ‘monolithic’ is derived from the Greek word monos, meaning ’single’ and lithos, meaning ‘stone’.
A monolithic IC is a miniaturized electronic circuit including both active and passive components and their interconnections are being manufactured in the surface of a thin substrate of semiconductor material.

28. Monolithic IC

29. Monolithic IC Criteria of monolithic IC:
most popular because of low cost
high reliability
isolation weakness
limited range of passive components
circuit design is not flexible.

30. Classification Based on Fabrication Method
b. Film
Film components are made of either conductive or nonconductive material that is deposited in desired patterns on a ceramic or glass substrate.
Film can only be used as passive circuit components, such as resistors and capacitors. Transistors and/or diodes are added to the substrate to complete the circuit.

31. Film IC
Plastic thin film
Image on thin film

32. Classification Based on Fabrication Method
c. Hybrid IC
Hybrid integrated circuit technology is the combination of monolithic circuits and film technology.
The active components are monolithic transistors or diodes.
The passive components may be group of monolithic resistors or capacitors on a single chip, or they may be thin-film components.
Wiring or a metallized pattern provides connections between chips.

33. Hybrid IC
Hybrids ICs are widely used for high power audio amplifier applications from 5 W to more than 50 W.

34. Hybrid IC
Hybrid ICs usually have better performance than monolithic ICs.
However, the process is too expensive for mass production. Thus, multi-chip techniques are quite economical for small quantity production and are more often used as prototypes for monolithic ICs.

35. Fabrication Method Comparison
Characteristics
Monolithic Technology
Film Technology
Hybrid Technology
Type of components
Active and passive
Passive (Resistor & Capacitor)
Substrate material
Silicon (Si)
Germanium(Ge)
Gallium Arsenide (GaAs)
Conduction layer on insulator (glass, ceramic)
Silicon and insulator
Interconnection method
On substrate surface
Metal (Al or gold)
Interconnection of two or more chips
Technology method
BJT, MOS,GaAs
Thin film = 0.5m
Thick film = 25m
Combination of monolithic and film
Size
Medium
Small
Large

36. Student Centred Activity - Group Discussion 2
Identify the advantages and disadvantage of Monolithic, Film and Hybrid fabrication methods.

37. Classification Based on Circuits Function
Integrated Circuits
Linear / Analogue ICs
Integrated circuits that operate with
analogue signals at the input and output.
Digital ICs
Integrated circuits that operate with
digital signals at the input and output.
Examples:
Op-Amp ii. Power Amplifier
iii. Multiplier
iv. Comparator
v. Voltage Regulator
Examples:
i Logic gates
ii. Flip-flop iii. Counter iv. Calculator chips v. Memory vi. Microprocessor

38. Classification Based on Transistor Types

39. Bipolar Junction Transistor (BJT)
NPN
Cross section and Symbol
PNP
Cross section and Symbol

40. Advantage & Disadvantage of BJT ICs
Transistor Type
Advantage
Disadvantage
BJT
i. High switching speed
High durability
High power handling capability
i. High power dissipation
ii. Large chip size
iii. Temperature sensitive

41. MOS IC
MOS transistor is known as MOSFET (Metal Oxide Semiconductor Field-Effect Transistor).
MOSFET is widely used nowadays in electronic equipment, e.g. mobile phone, computer, medical electronic equipment, etc.
Examples of MOS technologies are:
i. PMOS
ii. NMOS
iii. CMOS
iv. VMOS

42. PMOS & NMOS PMOS Cross Section PMOS Symbol NMOS Cross Section
NMOS Symbol

43. Schematic diagram of 2-input NAND gate using CMOS
CMOS Cross Section
Schematic diagram of 2-input NAND gate using CMOS
2-input NAND gate symbol

44. VMOS
One of the disadvantages of CMOS technology is the disability of handling high power.
VMOS is invented to overcome the problem. VMOS has the capability to operate in high current and voltage.

45. VMOS VMOS is the acronym of Vertical Metal Oxide Semiconductor.
VMOS has the V shape gate to conduct more carriers vertically from SOURCE to DRAIN. P + G S D

46. BiCMOS
BiCMOS is the acronym of Bipolar complementary metal oxide semiconductor , the technology that combines BJT and CMOS on the same chip to generate high speed, low power dissipation and high concentration circuit.

47. Advantages & Disadvantages of MOS technology
MOS Transistor Types
Advantage
Disadvantage
PMOS
i. Low fabrication cost.
ii. Simple fabrication method.
Low circuit performance (slow).
This is because the hole current mobility is two times slower than electron.
NMOS
i. Smaller size compared to PMOS.
ii. High circuit performance.
i. Fabrication process is more difficult compare to PMOS.
CMOS
i. Low power dissipation.
Larger size compared to PMOS and NMOS.
BiCMOS
i. High circuit performance (high speed).
ii. Low power dissipation.
i. Larger chip size.
ii. Complex fabrication process.
iii. High fabrication cost.
VMOS
i. Capable of operating in high current and voltage.
ii. High circuit performance (high speed).
i. Complex fabrication process.
ii. High fabrication cost.

48. Student Centred Activity - Group Discussion 3
Distinguish Mixed-signal ICs from Analogue and Digital ICs. What do you think it is? Highlight the advantages and disadvantages of Mixed-Signal ICs.
Reference:

49. Student Centred Learning - Group Discussion
Based on the given graphs, relate Moore’s Law to the following evolution of microelectronics memory devices.
Based on the given graphs, relate Moore’s Law to the scaling down of transistor size and the trend in microprocessors.
Distinguish Mixed-signal ICs from Analogue and Digital ICs. What do you think it is? Highlight the advantages and disadvantages of Mixed-Signal ICs.
Reference:
Advantages and disadvantage of Monolithic, Film and Hybrid fabrication methods.

50. Review of Learning Outcomes
At the end of this session, students should be able to:
Understand Integrated Circuit (IC) Technology
Know the classification of IC
Have You Achieved the Outcomes?

51. Lets see whether you have achieved the learning outcomes
Assessment Task QUIZ 1 (CLO1)