A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN1 Micro-module assembly -  -module elements - alignment of the silicon sensors to the aluminum tile (principle) - technology of the assembly, with time estimate for each step gluing sensor to ceramic & controls gluing ceramic to Al tile. Thermal aspects alignment controls gluing hybrid to ceramic support and bonding- final tests - final tests - parts and  -module trace-ability - summary of tooling - [production schedule: see talk of P. Bloch]

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN2 Components of a micromodule, together with a photograph of a real micromodule used in beam tests  Module elements

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN3 Alignment of the silicon sensors to the aluminum tile principle: - Si sensors width ,  m; (see Dubna presentation) - ceramic support width ± 100  m; ceramic support always smaller than silicon sensor - the silicon sensor edge is used as reference for the alignment to the aluminum tile - final accuracy of the alignment of the silicon sensor to the aluminum tile is the sum of accuracy of Si - sensor cutting, accuracy of the jig and accuracy of positioning pins of the tile

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN4 Gluing of the Silicon Sensor to the Ceramic Support use two types of glue for fixing of the Si-sensor on the ceramic support and to provide good electrical contact between the Bias- line on ceramic and the backplane: - non conductive rapide Araldite-2012 (polymerization=1h ); - conductive Ag-glue E-solder 3025 (polymerization 24h); mechanical alignment of Si-sensor to the ceramic support done on table #1 with reference bars and two separated vacuum channels for fixing the sensor and the ceramic support; E3025 conductivity tested under radiation up to 500 Mrad

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN5 Positioning and Gluing of the Silicon Sensor to the Ceramic Support Materials and Process Conditions: Cleaning liquid - alcohol Conductive Ag-glue – “E-solder 3025” Nonconductive glue – “Araldite 2012 rapid” Time from glue preparation until the end of dispensing: no more than - 4 min Time of glue polymerization under vacuum clamp - 1 hour Time of complete glue polymerization - 24 hours (“E-solder 3025”) Assembling table Alignment bar Vacuum clamp for ceramic substrate Alignment bar Ceramic substrate Conductive glue Si-Sensor Vacuum clamp for Si-Sensor Nonconductive glue

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN6 HV contact resistance control Resistance of contact should be <10  Si-detector Ceramic support Al-plate Ag-glue HV electrode Vacuum sink Ohmmeter Spring contact Araldite

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN7 JINR Sensor Aligning and Gluing of the Ceramic Support to the Aluminum Tile Vacuum clamp for ceramic substrate Assembling table Alignment bar Tile fixation screw Alignment bar Al tile Glue Micromodule assembly Materials and Process Conditions: Cleaning liquid - alcohol Glue – “Araldite 2012 rapid” Time from glue preparation until the end of dispensing: no more than - 4 min Time of glue polymerization under vacuum clamp - 1 hour

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN8 Thermal aspects Local thermal contractions much smaller than spatial precision and tolerances (very different from the Tracker problem !) Main issue is to avoid stresses due to differential expansion coefficients while keeping good thermal contacts for efficient cooling Silicon sensor -ceramics support gluing : small  tested with several cycles from -30 o C to +92 o C Ceramics support- Al tile gluing Isle allowing small gluing area near the center: mechanical flexibility and controlled glue thickness. FEA shows reduction of stresses by factor >20. Tested again between -32 o C +90 o C Al tile ceramic support cylindrical isle  7 mm glue,.1 mm

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN9 Thermal tests 2000 of gluing Si-sensors on ceramic PCB Si-detector Ceramic support Al-plate Ag-glueEpoxy glue Conclusions: Experimental data after measuring of 5 Si– detectors: no visible effect of degradation of initial parameters of the detectors after change temperature in the range from –32ºC to +100ºC

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN10 A thermal test with strongly irradiated sensors Detector 1 Detector 3 Detector 2 Detector 4 s1s3 s2 s6 s4 s5 Cooling panel Coolant inlet Coolant outlet s9 Read-out chip (0.5W) Side view 2 W heater (is not shown on the right) Aluminium tile s7 s8 Ceramic support Pillar A full-scale ladder prototype was used for the test Good thermal contact and long-term stability of 4 strongly irradiated sensors 400V reverse bias T=-5 o C

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN11  -modules Optical Control of Alignment - Main function of the positioning table is to provide a coordinate system, attached to the invisible positioning pins of  -module - The coordinates system (X,Y) is set by two reference points of the positioning table - Metallization of the detector is a reference for alignment control - Distances X’, Y’ and X” are measured and compared with theoretical values Lens #1 Lens #2  -module Special positioning table Positioning pins Reference point of the table Reference line of the table

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN12 Accuracy of the Prototype  -modules Assembling Optical control Quality control tests on  -module: - cross check by optical method of 1 in 20  -modules in the pre-production; - cross check by optical method of 1 in 100  - modules in the production; - optical control will be done in one center - Alignment Control Center 60  max error in agreement with overall tolerance (see EDR)

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN13 Readout hybrid Readout hybrid production workflow already described by A. Peisert Readout hybrids -fully tested and burnt in- are distributed to regional centers Low alignment precision required ~0.5mm (pitch 1.9mm) Mechanical jig to position using the Al tile pillars as reference Gluing with fast epoxy

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN14 Bonding (1) Vacuum jig supporting the tile under bonding pads. Was used in beam test.

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN15 Bonding (2) Technical Specifications for Bonding (PRR document) define: Bonding specifications (wire, loop height & form, pull strength….) Working environment Bonding Procedure (2 bonds per strip,...) Quality assurance tests visual inspection on bonding machine and under microscope bonding pull tests on test bonds with a dynamometer Bonding exercise using small boards sent back to CERN for control successfully done by all regional centers ( waiting for BEL ) Bonding time not an issue (only 66 bonds), dominated by manipulations (~ minutes) Could be improved by bonding several sensors in a row

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN16 Final tests Make sure Silicon sensor did not suffer Check the connectivity and # of working channels IV test up to 300/500V (total current) “Basic functionality test “ using simplified motherboard connected by RS232: pedestal events (noise) electric test pulse with and without bias (connectivity) infrared Laser tests with moving stage (may be at reception at CERN) DAQ rate ~ 10 Hz, all strips tested in parallel : <15 minutes per micromodule Micromodule ready for shipping to CERN in a special box under design

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN17 Traceability Each part sensor ceramic tile hybrid (and FE electronics) has a barcode number. Keep full record of all part of micro-modules Will be presented in detail by A.Go

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN18  -module Assembling Tools 1. Vacuum jig for alignment and gluing of the silicon sensor to the ceramic support 2. Vacuum jig for alignment and gluing of the ceramic support to the aluminum tile 3. Jig for the  -modules Alignment Optical Control 4. Jig for alignment and gluing of the readout hybrid to the  -module 1 3 2

A.Cheremukhin (JINR, Dubna) CMS Preshower PRR, July 5-6, 2001, CERN19 Conclusions Tooling for the  modules assembling and Quality control  procedure  of  the  module assembling is well defined. Prototypes have been made. Assembling time : 5 per day (per centre) seems feasible