1. Infrastructure & issues and solutions for ATLAS Upgrade Hybrid/Module strip bonding Fred Doherty, Joe Ashby, Fiona McEwan & Calum Gray ATLAS Upgrade Module Bonding Trials Using Glass Asics

2. 130 nm ATLAS Upgrade Module 2 GU Meeting 19 th January 2016 BJ820 Bonding Setup

3. 130 nm ATLAS Upgrade Module 3 GU Meeting 19 th January 2016 ATLAS Upgrade Module with Glass Readout Asics

4. 130 nm ATLAS Upgrade Module 4 GU Meeting 19 th January 2016 Glass Readout Asics with 4 rows of metal bond pads

5. 1 st 130nm glass asic module bonding 519 th January 2016 GU Meeting The Front End Bonding (FEB) software program was loaded and the XY positional re- referencing, pattern recognition and Z height adjustment for all 10 glass asics on the hybrid and silicon strip sensor were performed. All bond pads checked for correct alignment, metallisation, dirt, debris (bond position moved if possible from problem areas). All 10 asics checked with (64) 256 bond wires requiring (128) 512 bonds per asic (Source - asic & Destination – sensor) and giving a total of (640) 2560 bond wires requiring (128) 5120 bonds in total for LH hybrid. All glass asic bond pad welding parameters had to be modified from the original program settings. The existing parameters would not take to the glass asic pads in trials - deformation error (too small) - so changed (increased weld parameter settings). Prepare wire for immediate bonding using trial bonds if problem stop during 1280 bonds have to understand and fix error, sort and prepare wire to continue bonding. All 10 glass asics bonded well with new parameters and after successful completion of the LH hybrid to sensor bonds the module sensor was rotated to continue RH hybrid to sensor bonds. Checks on all bonding info including BJ820 individual wire bond graphs & detailed visual inspections confirmed successful completion. This procedure is only 1/8 of the FE Bonding for 1 module.

6. 1 st 130nm glass asic module bonding 6 GU Meeting 19 th January 2016 Wire bond positions on ‘destination pads’ of silicon strip sensor

7. 1 st 130nm glass asic module bonding 7 GU Meeting 19 th January 2016 The many parameters for wire bonds (source / destination) at any (Asic / sensor) referenced position

8. 1 st 130nm glass asic module bonding 819 th January 2016 GU Meeting There are 3 options for a bonding program procedure: Load 1 st bond wire layer program then bond both sensor hybrids (markings on sensor when rotating with suction tool 4 times for 4 wire layers). Fully bond the one sensor hybrid loading 4 layer programs and then 1 rotation and load 4 programs to complete other side. Create 4 program for 4 bond layer to complete both sides. Hybrid/Sensor Positional accuracy and repeatability may cause problems and added time setting up. Referencing and Pattern Recognition also for 20 rather than 10 in current smaller logical program. Ideally we do not want to be rotating / moving the sensor at any stage in the bonding process so the 4 programs covering each layer for both sides will I’m sure be implemented.

9. 1 st 130nm glass asic module bonding 9 GU Meeting 19 th January 2016 First LH Hybrid wire layer 1 fully bonded

10. 1 st 130nm glass asic module bonding 10 GU Meeting 19 th January 2016

11. 1 st 130nm glass asic module bonding 11 GU Meeting 19 th January 2016

12. 1 st 130nm glass asic module bonding 12 GU Meeting 19 th January 2016

13. 1 st 130nm glass asic module bonding 13 19 th January 2016 GU Meeting This is a recorded video of the actual wire bonding after preparatory stage.

14. 1 st 130nm glass asic module bonding Preliminary conclusions Good learning curve and experience gained for 130nm Module bond phase. A few issues identified but no show stoppers. CNM glass asics and silicon sensor bond very well at set welding parameters. Timing of all procedures cannot be tied down. Program expansion to 2 hybrids likely. Loop heights for wire layers look ok but electrical module required to confirm. Bond pull test not required till proper asics available for trials. Will look for a camera / microscope lense screw adaptor for videoing setup. Will feedback to UK bonders group on experience so far. 1419 th January 2016 GU Meeting

15. 1 st 130nm glass asic module bonding 15 GU Meeting 19 th January 2016 Time BJ820 automatic wire bonder takes to bond 1 Module 51 seconds for 64 bonds (1 layer - 1 chip) 510 seconds for 640 bonds (1 layer - 10 chips) 2040 seconds for 2560 bonds (4 layers – 10 chips 4080 seconds for 5120 bonds / 4 layers – 20 chips) = 68 minutes to fully bond 1 module - with cover open (70% of top speed) = 48 minutes to fully bond 1 module - with cover shut (100% top speed)

16. 1 st 130nm glass asic module bonding 16 GU Meeting 21 th January 2016 Preparation stages before wire bonding takes pl;ace to bond 1 Module Reference Glass asics and sensor 22 positions (1 layer - 10 chips) * 5m Identify good Pattern Recognition areas 22 positions (1 layer – 10 chips Identify good Pattern Recognition areas 22 positions (1 layer – 10 chips) * 5m wire position and adjust if needed Check 1280 bond pads for problems* / wire position and adjust if needed * 5m Z height adjustment for 10 chips * 1m If bond error during bonding sort problem / sort wire and continue * 5m (1/640) Visual inspection / electrical test to confirm ok * 5m If bond errors sort problem / fix? * 5m 31 minutes all 16 minutes if everything perfect Reference Glass asics and sensor 176 positions (4 layers - 20 chips) * 40m Identify good Pattern Recognition areas 176 positions (4 layers – 20 chips) Identify good Pattern Recognition areas 176 positions (4 layers – 20 chips) * 40m / wire position and adjust if needed Check 10,240 bond pads for problems* / wire position and adjust if needed * 40m Z height adjustment for 10 chips * 8m If bond error during bonding sort problem / sort wire and continue * 40m (8/5120) Visual inspection / electrical test to confirm ok * 40min If bond errors sort problem / fix? * 40m (8/5120) 248 ( 4 hours 8 minutes all ) 128 ( 2 hours 8 minutes if everything perfect)

17. 1 st 130nm glass asic module bonding 17 GU Meeting 19 th January 2016 Other Considerations Bonding for 1 module takes – between 3.5 Hours and 5.5 Hours The figures don’t include loading / unloading / vacuum / problem solutions ? / test bonds / checking graph data / off machine inspections / extra bonding for electrical tests? / (eye) breaks. (Hence 30min addition) First Modules took anything up to 2 days to bond up. (Learning curve, Selective bonding of chips etc ) Last modules took 1.5 modules per day (only 4 corner chips didn’t bother with close inspection of pads and had a uniquely written program to run) If problems with any module bonding on 820 then have to use 710 to keep up production else delays compounded.