Pixel Atsushi Taketani RIKEN RIKEN Brookhaven Research Center 1.Overview of Pixel subsystem 2.Test beam 3.Each Components 4.Schedule 5.Summary

2 Full ladder ~4mm Pixel bus Pixel sensor modules Pixel stave (with cooling) Pixel detector = inner 2 layers of VTX 1 st layer: 10 full pixel ladders = 20 half ladders = 40 sensor modules 2 nd layer: 20 full pixel ladders = 40 half ladders = 80 sensor modules Pixel Detector SPRIO 57mm (32 x 4 pixel) 13mm 256 pixel Sensor module 50  m x 425  m

33 Specification Collision Rate ~ 10MHz -> Timing Resolution < 100nsec Trigger Rate Max 20KHz Occupancy < 1% for pixel detector Pixel size 50 * 425  m 2 Tracking Resolution 50micron for displacement High precision at mechanical construction ~ 25 micron for internal Material Budget ~ 1% of radiation length Technology: Pixel detector developed for ALICE experiment at LHC. Budget: –RIKEN : Ladders and Front End Module –DOE: Mechanical and infrastructure –Ecole Polytechnique :SPIRO board

44 PIXEL (Sensor and Readout) Pixel size(  x z ） 50 µm x 425 µm Sensor Thickness 200  m  r  = 1.28cm,  z = 1.36 cm (Active area) 256 x 32 = 8192 channel / sensor 4 chip / sensor 4 sensor / stave Readout by ALICE_LHCB1 chip Amp + Discriminator / channel Bump bonded to each pixel Running 10MHz clock ( RHIC 106nsec ) Digital buffer for each channel > 4  sec depth Trigger capability > FAST OR logic for each crossing 4 event buffer after L1 trigger

55 PIXEL (Sensor and Readout) Readout by ALICE_LHCB1 chip Amp + Discriminator / channel Bump bonded to each pixel Running 10MHz clock ( RHIC 106nsec ) Digital buffer for each channel > 4  sec depth Trigger capability > FAST OR logic for each crossing 4 event buffer after L1 trigger

66 Pixel detector ladder Sensor module consists of 4 ALICE Pixel readout chips Bump-bonded to silicon sensor Sensor Thermo plate + cooling ALICE LHCB1 chip SensorSensor Module

77 Pixel detector ladder Sensor module consists of 4 ALICE Pixel readout chips Bump-bonded to silicon sensor Sensor Thermo plate + cooling One readout unit, half stave, made from two sensor modules ALICE LHCB1 chip SensorSensor Module

88 Pixel detector ladder Sensor module consists of 4 ALICE Pixel readout chips Bump-bonded to silicon sensor Sensor Half stave is mounted on the support structure Thermo plate + cooling One readout unit, half stave, made from two sensor modules ALICE LHCB1 chip SensorSensor Module

99 Pixel detector ladder Sensor module consists of 4 ALICE Pixel readout chips Bump-bonded to silicon sensor Sensor Half stave is mounted on the support structure Thermo plate + cooling Pixel BUS to bring data out and send control signal in to the readout chip is mounted on the half stave Half stave Pixel BUS Data One readout unit, half stave, made from two sensor modules ALICE LHCB1 chip SensorSensor Module

10 Pixel detector ladder Sensor module consists of 4 ALICE Pixel readout chips Bump-bonded to silicon sensor Sensor Half stave is mounted on the support structure Thermo plate + cooling Pixel BUS to bring data out and send control signal in to the readout chip is mounted on the half stave Each detector module is built of two half staves, read out on the barrel ends Half stave Pixel BUS Data One readout unit, half stave, made from two sensor modules Full stave 22cm 1.4cm ALICE LHCB1 chip SensorSensor Module

11 Bus structure Power 50  m Al GND 50  m Al 6 layers structure GND, Power and 4 signal lines Signal 2; (Vertical line) line connected with pixel chip with wire bonding Signal 4; (for manufacture reason) Signal-4 3  m Cu Signal-3 3  m Cu Signal-2 3  m Cu Signal 1; (for Surface Mount Device) Signal-1 to Signal-4 are connected with through hole Signal lines; 60  m pitch Material Budget; Total ~ 0.26 % Final configuration Signal-1 3  m Cu Signal 3; (Horizontal line) send signal to Pilot Module connected with vertical line with through hole Thermo-plate Sensor module Wire bonding Al Power Al GND Through hole Signal layer Total 188 lines 25cm long 1.4cm wide

12 Pixel Readout Overview Half stave 11cm 60cm Bus (25cm ) + Extender (<35cm)

13 Major components Status ComponentStatus #delivered (needed) Sensor Module Ordering new module and rework 69 good one (128) Bus Under Production5 sets of R/L (64) Extender FPC production done Under SMD parts population 80 (80) SPIRO board Under ProductionSummer 2009(66) FEM Under productionReady by end of Aug.(33) Stave Under production 5 are tested and delivered (32) Ladder Assembly Production started 1 st :manual assemble 2 nd : using assembly fixture (32)

14 Test beam at 120GeV Proton Stripixel Pixel Proton FERMILAB Meson Test area 120 GeV Proton 5-30mm beam spot 4.5 sec spil per 1 min. 2×10 10 proton / spil Independent DAQ for Pixel and Stripixel. Using trigger scintillation counters Stripixel 3 Prototype ROC Trigger: Beam defining Scinti. DAQ : SVX4+ ROC+RCC Pixel 3 Prototype pixel ladder Trigger: Scinti * FAST_OR (3layer) DAQ: Prototype Readout + PHENIX DAQ

15 Pixel performance Residual  res = 6.1  m  res = 57  m Row directionColumn direction Residual [  m] count Intrinsic resolution row : 14  m column : 152  m Un-convolute Fit include all 3 layers hit position Multiple scattering effect

16 Sensor Module Status We need 120 sensor module for 30 ladder plus spares. 69 Useable Class I sensor Modules. 51 Class III sensor module will be reworked until September 2009 and probed for 2 months. 55 brand new sensor module will be purchased under paper work going.

17 Class I702chips Class II175 chips Class III538chips We need 271 chips for reworking and new sensor modules. Readout Chip

18 Readout Bus Sensor 10cm Bus Extender Total < 60cm (70cm) Line/space are 30 /30 micron Bus and extender are connected by the fine pitch connectors. Type Bus: Left and Right Extender: 34cm long 30cm long 29cm long

19 Bus Production Status All process for bus productions has been established. 40 Left and 40 Right plus are needed. 5 set of Bus was fabricated as pre- production. Left version is fine for production, Right version is under confirmation. 1 st Production is starting.

20 Extender 80 extenders are needed in total. 5 extender was produced as pre- production and confirmed with ladder, SPIRO and FEM. Production of total 80 extender was done except trivial surface mount connecters implementation.

21 Stave Finalized the specification on Feb staves plus spares are needed. LBNL delivered to RIKEN 5 staves. 20 staves are waiting for survey. Remainders will be delivered end of June 2009.

22 Spread glue on stave with mask take 0.2 hours will be reduced measuring point Paint glue using mask and manual paddle. Glue thickness are well controlled 80 micron +-10micron Assembly procedure: (1) gluing

23 Assembly procedure : (2) aligned sensors on stave X[mm] Y[mm] +-10 micron

24 Assembly procedure: (3) wire bonding

25 Assembly procedure: (4) Encapsulation of wire Wire vibrates in magnetic field due to the intermittent current associated with level 1 trigger and may break stave sensor Bonding wire barrier Potting glue 1mm No encap ～ 5.9KHz Resonance

26 Ladder assembly Status Prototyping is completed. Production is started –Ladder 1 : Class II sensors and real stave/bus Manual assemble for fall back solution. Finished gluing stave-sensor-bus. Under wire bonding –Ladder 2 : Class II sensors and real stave/bus Sensors are glued on the stave by using assembly fixtures. Bus will be glued by manually.

27 Multiplex data from ladder and control readout chip Reference voltage Serial data transmission to FEM by optical link Radiation hard for all components. Low jitter crystal for high speed link. Voltage regulator for ladder. Production just started and will be finished before 2009/08. SPIRO Board by Ecole Polytechnique Front End Module by Stony Brook University Receiving data from SPIRO and transmit to PHENIX DAQ with specified format VME base board for slow control/diagnostic. Not Radiation hard. 1 st production board is under exhaustive tests. All boards are under assembly and will be ready by end of 2009/08.

28 Schedule Sensor module Ladder Assembly Readout Electronics SPIRO board: Production done before 2009/08 FEM : Under production and tested until 2009/08

29 Issue Sensor module reworking and additional production. –Long lead time. We already discussed with VTT/CERN. –May impact schedule. Ladder assembly had some technical difficulties and has been resolved. –Manual gluing for bus is established.

30 Summary Production of pixel ladder has been started. –Technical issues on the ladder assembly was resolved. –More sensor modules are ordered. Readout electronics will be ready by 2009 Fall.